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    • 6. 发明公开
    • Thin film memory, array, and operation method and manufacture method therefor
    • Dünnschichtspeicher,Array,und Betriebs- und Herstellungsmethodedafür
    • EP2113943A2
    • 2009-11-04
    • EP09166746.9
    • 2003-04-09
    • Seiko Instruments Inc.Hayashi, Yutaka
    • Hayashi, YutakaHasegawa, HisashiYoshida, YoshifumiOsanai, Jun
    • H01L27/108
    • H01L27/1203H01L21/84H01L27/10802H01L27/10844Y10S257/908
    • A memory cell which is formed on a fully depleted SOI or other semiconductor thin film and which operates at low voltage without needing a conventional large capacitor is provided as well as a memory cell array. The semiconductor thin film (100) is sandwiched between first (110) and second (120) semiconductor regions which face each other across the semiconductor thin film and which have a first conductivity type. A third semiconductor region (130) having the opposite conductivity type is provided in an extended portion of the semiconductor thin film. From the third semiconductor region, carriers of the opposite conductivity type are supplied to and accumulated in the semiconductor thin film portion to change the gate threshold voltage of a first conductivity type channel that is induced by a first conductive gate (310) in the semiconductor thin film between the first and second semiconductor regions through an insulating film (210).
    • 提供了形成在完全耗尽的SOI或其他半导体薄膜上并且在低电压下工作而不需要常规的大电容器的存储单元,以及存储单元阵列。 半导体薄膜(100)夹在半导体薄膜之间彼此相对并且具有第一导电类型的第一(110)和第二(120)半导体区域之间。 具有相反导电类型的第三半导体区域(130)设置在半导体薄膜的延伸部分中。 从第三半导体区域,将相反导电型的载流子提供给并累积在半导体薄膜部分中,以改变由半导体薄层中的第一导电栅极(310)感应的第一导电类型沟道的栅极阈值电压 通过绝缘膜(210)在第一和第二半导体区域之间形成膜。