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1. 发明申请

US20100216044A1 Air-Cooled Thermal Management for a Fuel Cell Stack 有权
标题翻译：燃料电池堆的空气冷却管理
公开(公告)号：US20100216044A1
公开(公告)日：2010-08-26
申请号：US12389966
申请日：2009-02-20
申请人： George W. Hawkins , Zakiul Kabir , Qimin Ming , Yang Song
发明人： George W. Hawkins , Zakiul Kabir , Qimin Ming , Yang Song
IPC分类号： H01M8/04 , B32B38/08
CPC分类号： B32B37/12 , B32B2315/08 , B32B2457/18 , H01M8/0267 , H01M8/04029 , H01M8/04074 , H01M8/241 , H01M8/2465 , H01M2008/1095
摘要： The air-cooled thermal management of a fuel cell stack is disclosed. One disclosed embodiment comprises a cooling plate apparatus for an air-cooled fuel cell stack, where the cooling plate comprises a body configured to receive heat from one or more fuel cells in thermal communication with the body, and airflow channels formed in the body and configured to allow a flow of a cooling air to pass across the body. An insulating structure is disposed in the airflow channels, wherein the insulating structure has decreasing thickness from a cooling air inlet toward a cooling air outlet.
摘要翻译：公开了一种燃料电池堆的风冷热管理。一个公开的实施例包括用于空气冷却的燃料电池堆的冷却板装置，其中冷却板包括构造成从与身体热连通的一个或多个燃料电池接收热量的主体和形成在主体中的气流通道以允许冷却空气的流动穿过身体。绝缘结构设置在气流通道中，其中绝缘结构具有从冷却空气入口朝向冷却空气出口减小的厚度。

2. 发明授权

US07105245B2 Fluid cell system reactant supply and effluent storage cartridges 有权
标题翻译：流体池系统反应物供应和流出物储存筒
公开(公告)号：US07105245B2
公开(公告)日：2006-09-12
申请号：US10613887
申请日：2003-07-02
申请人： Leroy J. Ohlsen , Steven C. Tallman , George W. Hawkins
发明人： Leroy J. Ohlsen , Steven C. Tallman , George W. Hawkins
IPC分类号： H01M8/04
CPC分类号： H01M8/04208 , H01M8/04186
摘要： Reactant supply and effluent storage cartridges adapted for use with a closed liquid feed fuel cell system, as well as closed liquid feed fuel cell systems. The cartridge includes at least first and second volumes and comprises: a first reactant reservoir for holding a first reactant, the first reactant reservoir being configured to occupy substantially all of the first volume when filled with the first reactant; a second reactant reservoir for holding a second reactant, the second reactant reservoir being configured to occupy substantially all of the second volume when filled with the second reactant; and an effluent reservoir for holding effluent produced by the fuel cell system, the effluent reservoir being configured to occupy, when filled with the effluent produced by the fuel cell system, a portion of the first volume, a portion of the second volume, or a portion of the first and second volumes. The reactant supply cartridge of may further comprise an electrolyte reservoir for holding an electrolyte. In other embodiments, the present invention is directed to a computer system comprising the detachable cartridges and closed liquid feed fuel cell systems disclosed herein.
摘要翻译：适用于封闭的液体进料燃料电池系统以及封闭的液体进料燃料电池系统的反应物供应和流出物储存盒。所述筒包括至少第一和第二体积，并且包括：用于保持第一反应物的第一反应物储存器，所述第一反应物储存器被配置为当填充有所述第一反应物时占据所述第一体积; 用于保持第二反应物的第二反应物储存器，所述第二反应物储存器构造成当填充有第二反应物时占据基本上所有的第二体积; 以及用于容纳由所述燃料电池系统产生的流出物的流出物储存器，所述流出物储存器被配置为当填充有由所述燃料电池系统产生的流出物时占据所述第一体积的一部分，所述第二体积的一部分或第一和第二卷的一部分。反应物供应盒还可包括用于保持电解质的电解质储存器。在其他实施例中，本发明涉及一种包括本文公开的可拆卸筒和封闭的液体进料燃料电池系统的计算机系统。

3. 发明授权

US06300679B1 Flexible substrate for packaging a semiconductor component 失效
标题翻译：用于封装半导体部件的柔性基板
公开(公告)号：US06300679B1
公开(公告)日：2001-10-09
申请号：US09087674
申请日：1998-06-01
申请人： Prosanto K. Mukerji , Ronald E. Thomas , George W. Hawkins , Rajesh Srinivasan , Colin B. Bosch , James H. Knapp , Laura J. Norton , Michael J. Seddon
发明人： Prosanto K. Mukerji , Ronald E. Thomas , George W. Hawkins , Rajesh Srinivasan , Colin B. Bosch , James H. Knapp , Laura J. Norton , Michael J. Seddon
IPC分类号： H01L2350
CPC分类号： H01L23/4985 , H01L2224/05001 , H01L2224/05023 , H01L2224/0508 , H01L2224/05568 , H01L2224/16 , H01L2924/01079 , H01L2924/15311 , H01L2924/3011 , H05K1/189
摘要： A semiconductor component includes a semiconductor chip (341, 502, 601, 701, 1101, 1410, 1501) having first and second surfaces opposite each other, a semiconductor device (301) in the semiconductor chip (341, 502, 601, 701, 1101, 1410, 1501), and a flexible substrate (120, 401, 510, 610, 710, 1000, 1050, 1300, 1401, 1510, 1520) packaging the semiconductor chip (341, 502, 601, 701, 1101, 1410, 1501).
摘要翻译：半导体元件包括具有彼此相对的第一和第二表面的半导体芯片（341,502,601,701,1101,1410,1501），半导体芯片（341,502,601,701， 1101,1410,1501）以及将半导体芯片（341,502,601,701,1101,1410）封装的柔性基板（120,401,510,610,710,110,1050,1300,1401,1510,1520），1501）。

4. 发明授权

US5119171A Semiconductor die having rounded or tapered edges and corners 失效
标题翻译：半导体管芯具有圆形或锥形边缘和拐角
公开(公告)号：US5119171A
公开(公告)日：1992-06-02
申请号：US674291
申请日：1991-03-22
申请人： Israel A. Lesk , Ronald E. Thomas , George W. Hawkins
发明人： Israel A. Lesk , Ronald E. Thomas , George W. Hawkins
IPC分类号： H01L21/02 , H01L29/06
CPC分类号： H01L29/0657
摘要： An improved semiconductor die for plastic encapsulated semiconductor device packages which impedes the inherent delamination caused by the differing expansion coefficients of the semiconductor die and plastic encapsulation. Rounded or tapered die corners and die edges decrease the stress from the plastic encapsulation that acts upon the semiconductor die. This reduced stress slows the delamination progression and leaves the operational circuitry unaffected for an increased period of time thereby increasing device lifetime.
摘要翻译：用于塑料封装的半导体器件封装的改进的半导体管芯，其阻止由半导体管芯和塑料封装的不同膨胀系数引起的固有分层。圆角或锥形模角和模头边缘减小了作用在半导体管芯上的塑料封装的应力。这种减小的应力使得分层进程减慢，并使操作电路不受影响的时间增加，从而增加器件寿命。

5. 发明授权

US4924291A Flagless semiconductor package 失效
标题翻译：无旗半导体封装
公开(公告)号：US4924291A
公开(公告)日：1990-05-08
申请号：US261439
申请日：1988-10-24
申请人： Israel A. Lesk , George W. Hawkins , Ronald E. Thomas , William L. Hunter , James J. Casto , Michael B. McShane
发明人： Israel A. Lesk , George W. Hawkins , Ronald E. Thomas , William L. Hunter , James J. Casto , Michael B. McShane
IPC分类号： H01L23/34 , H01L23/16 , H01L23/28 , H01L23/31 , H01L23/433 , H01L23/495 , H01L23/50
CPC分类号： H01L23/49568 , H01L23/16 , H01L23/3107 , H01L23/4334 , H01L23/49503 , H01L23/49513 , H01L23/49541 , H01L2224/32245 , H01L2924/10253 , H01L2924/12044 , H01L2924/1815
摘要： A molded semiconductor package having a flagless leadframe wherein a semiconductor die is disposed in or above a die opening of a leadframe. This allows for thin, symmetrical packages and packages having a minimum number of material interfaces to be manufactured because no leadframe flags and minimal die bond material are employed. The present invention further includes guard rings to protect high stress areas of the semiconductor die from damage and heat spreaders to more effectively spread heat dissipated by the semiconductor die.

6. 发明授权

US4872088A Radial mounting for stacked wafer modules with cooling 失效
标题翻译：用于具有冷却的堆叠晶片模块的径向安装
公开(公告)号：US4872088A
公开(公告)日：1989-10-03
申请号：US237795
申请日：1988-08-29
申请人： George W. Hawkins
发明人： George W. Hawkins
IPC分类号： H01L23/467 , H05K7/20
CPC分类号： H01L23/467 , H01L2924/0002 , Y10S165/908
摘要： A modular packaging structure consisting of a plurality of modules, each capable of performing different functions, coupled to a central core. The modules are comprised of a pair of half semiconductor wafers bonded together. Each wafer contains a plurality of semiconductor devices inset in the wafer and having interconnect lines connecting the devices to the wafer. The module has a plurality of contacts along the straight edge to allow coupling. The straight edge of the module is inserted into a core of the modular computer. The core acts as a power and signal bus to the modules and serves to clamp the modules in place. A slot in the core is left for the external electrical connections. A cooling manifold can be disposed about the modules to provide air cooling. The structure is then placed in a housing having a fan to pump air through the cooling manifold.
摘要翻译：由多个模块组成的模块化封装结构，每个模块能够执行不同的功能，耦合到中心核心。这些模块由结合在一起的一对半半导体晶片组成。每个晶片包含多个半导体器件，其插入晶片中并且具有将器件连接到晶片的互连线。该模块沿着直边缘具有多个触点以允许耦合。模块的直边插入模块化计算机的核心。核心作为模块的电源和信号总线，用于将模块固定到位。核心中的一个插槽用于外部电气连接。可以围绕模块设置冷却歧管以提供空气冷却。然后将结构放置在具有风扇的壳体中以将空气泵送通过冷却歧管。

7. 发明授权

US4832996A Semiconductor die for plastic encapsulation having an adhesion promoter 失效
标题翻译：具有粘合促进剂的用于塑料封装的半导体管芯
公开(公告)号：US4832996A
公开(公告)日：1989-05-23
申请号：US159975
申请日：1988-02-24
申请人： Israel A. Lesk , Ronald E. Thomas , George W. Hawkins
发明人： Israel A. Lesk , Ronald E. Thomas , George W. Hawkins
IPC分类号： H01L23/29 , H01L23/28 , H01L23/31
CPC分类号： H01L23/3142 , H01L2924/0002 , Y10S428/901 , Y10T428/23 , Y10T428/239 , Y10T428/24777 , Y10T428/24851 , Y10T428/24917 , Y10T428/24926 , Y10T428/31518 , Y10T428/31522 , Y10T428/31525 , Y10T428/31623 , Y10T428/31681 , Y10T428/31721
摘要： A semiconductor die for plastic encapsulation having an adhesion promoter selectively disposed on an outer surface enabling better adhesion between the semiconductor die and a plastic encapsulation. The improved adhesion allows for less relative motion between the semiconductor die and the plastic encapsulation. The reduction of relative motion significantly decreases the delamination progression throughout the semiconductor device and allows for an increased semiconductor device lifetime.
摘要翻译：一种用于塑料封装的半导体管芯，其具有选择性地设置在外表面上的粘合促进剂，从而能够在半导体管芯和塑料封装之间实现更好改善的粘附性允许半导体管芯和塑料封装之间的较小的相对运动。相对运动的减小显着降低了整个半导体器件的分层进程，并且允许增加的半导体器件寿命。

8. 发明授权

US5756380A Method for making a moisture resistant semiconductor device having an organic substrate 失效
标题翻译：制造具有有机基板的防潮半导体装置的方法
公开(公告)号：US5756380A
公开(公告)日：1998-05-26
申请号：US556782
申请日：1995-11-02
申请人： Howard M. Berg , Sankaranarayanan Ganesan , Gary L. Lewis , George W. Hawkins , James W. Sloan , Scott C. Bolton
发明人： Howard M. Berg , Sankaranarayanan Ganesan , Gary L. Lewis , George W. Hawkins , James W. Sloan , Scott C. Bolton
IPC分类号： H01L23/31 , H01L21/60
CPC分类号： H01L24/32 , H01L23/3128 , H01L2224/32057 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/73265 , H01L2224/83385 , H01L2224/85444 , H01L24/48 , H01L24/73 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/12044 , H01L2924/15173 , H01L2924/15183 , H01L2924/15311 , H01L2924/181
摘要： A method for making moisture resistant semiconductor devices having organic substrates targets each of the potentially critical interfaces within a semiconductor device having the potential for delamination and cracking. An organic substrate (110) is designed to include a solid pad (116) having a chemically created oxide layer (118) formed thereon. A silicone-based die attach material (108) is dispensed and gelled very soon after dispensing to prevent excessive bleed. A semiconductor die (102) is mounted to the substrate after undergoing a cleaning operation to remove contaminants from the backside of the die. Prior to molding compound encapsulation and subsequent to die attach material cure, the substrate is cleaned to improve adhesion to the die attach material fillet (122). In practicing these operations, the following interfaces are targeted and their adhesion characteristics are improved: die attach material to die pad; die attach material to die; molding compound to die pad; and molding compound to die attach material.
摘要翻译：一种制造具有有机衬底的耐湿半导体器件的方法，其目标是具有分层和破裂潜力的半导体器件内的每个潜在关键界面。有机基板（110）被设计成包括其上形成有化学产生的氧化物层（118）的固体焊盘（116）。在分配之后，非常快速地分配并凝胶化有机硅基的管芯附着材料（108），以防止过量的流出。在经历清洁操作之后将半导体管芯（102）安装到基板上以从模具的背面去除污染物。在模塑复合物封装之后和随后的模具附着材料固化之后，清洁基底以提高对芯片连接材料圆角（122）的粘附。在实施这些操作时，以下接口是针对性的，并且其粘附特性得到改善：芯片附着材料到芯片焊盘; 模具附着材料; 模塑复合材料到模具垫; 并将模塑复合物模塑附着材料。

9. 发明授权

US5145633A Blow molding a container having three handles 失效
标题翻译：吹塑一个具有三个手柄的容器
公开(公告)号：US5145633A
公开(公告)日：1992-09-08
申请号：US647874
申请日：1991-01-30
申请人： George W. Hawkins, III
发明人： George W. Hawkins, III
IPC分类号： B29C33/00 , B29C49/48
CPC分类号： B29C49/4817 , B29C33/00 , B29C49/482
摘要： A container such as a jerry can can be produced with one or more handles molded with the blow molded body of the container. This invention eliminates the need for separate injection molded inserts. A first pair of molds, and a second pair of molds having a lower and upper section, are used in the apparatus to close a top portion and a bottom and/or draped portions of a standard parison.
摘要翻译：可以利用用容器的吹塑成型体模制的一个或多个手柄来生产诸如杰瑞的容器。本发明消除了对单独的注射成型插入件的需要。在设备中使用第一对模具和具有下部和上部的第二对模具来封闭标准型坯的顶部和底部和/或悬垂部分。

10. 发明授权

US4928162A Die corner design having topological configurations 失效
标题翻译：具有拓扑结构的模角设计
公开(公告)号：US4928162A
公开(公告)日：1990-05-22
申请号：US158486
申请日：1988-02-22
申请人： Israel A. Lesk , Ronald E. Thomas , George W. Hawkins , James M. Rugg
发明人： Israel A. Lesk , Ronald E. Thomas , George W. Hawkins , James M. Rugg
IPC分类号： H01L23/50 , H01L23/485 , H01L23/495
CPC分类号： H01L24/06 , H01L23/49503 , H01L24/49 , H01L2224/05554 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/49 , H01L24/48 , H01L2924/00014 , H01L2924/01014 , H01L2924/01015 , H01L2924/01082 , H01L2924/10253
摘要： An improved semiconductor die for plastic encapsulated semiconductor devices which impedes the inherent delamination caused by the differing expansion coefficients of the semiconductor die and plastic encapsulation. Topological configurations are processed in the die corners of the semiconductor die which are void of circuitry. The topological configurations act as barriers and slow the delamination progression. This leaves the operational circuitry unaffected for an increased time thereby increasing device lifetime.
摘要翻译：用于塑料封装的半导体器件的改进的半导体管芯，其阻止由半导体管芯和塑料封装的不同膨胀系数引起的固有分层。拓扑结构在半导体管芯的模具角处被处理，这些电路没有电路。拓扑结构作为障碍，减缓分层进程。这使得操作电路不受影响以增加时间，从而增加器件寿命。

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