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1. 发明专利

JP2008141211A Wafer-level burn-in and test 审中-公开
标题翻译： WAFER-LEVEL BURN-IN和TEST
公开(公告)号：JP2008141211A
公开(公告)日：2008-06-19
申请号：JP2007332975
申请日：2007-12-25
申请人： Formfactor Inc , フォームファクター, インコーポレイテッド
发明人： KHANDROS IGOR Y , PEDERSEN DAVID V
IPC分类号： G01R31/26 , H01L21/66 , G01R1/067 , G01R1/073 , G01R3/00 , G01R31/28 , G01R31/30 , H01H1/00 , H01L21/60 , H01L23/32 , H01L23/48 , H01L23/485 , H01L23/498 , H05K3/20 , H05K3/34 , H05K3/40
CPC分类号： H01L23/49811 , G01R1/06716 , G01R1/06744 , G01R1/07342 , G01R3/00 , G01R31/287 , G01R31/2884 , G01R31/2889 , H01H1/0036 , H01L2224/0401 , H01L2224/04042 , H01L2224/06136 , H01L2224/11 , H01L2224/13 , H01L2224/45144 , H01L2924/00013 , H01L2924/0002 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01037 , H01L2924/01039 , H01L2924/01042 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01057 , H01L2924/01074 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/09701 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/1433 , H01L2924/3011 , H01L2924/3025 , H01L2924/351 , H05K3/20 , H05K3/3421 , H05K3/4015 , H01L2924/00 , H01L2224/13099 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide a technology for performing a wafer-level burn-in and test. SOLUTION: The invention includes a test substrate 108 having active electronic components 106a to 106d, and metallic spring contact elements 110 effecting interconnections with a plurality of devices DUTs 102a to 102d to be tested on a wafer 104 to be tested. The test substrate 108 receives a plurality of signals for testing the DUTs 102a to 102d over relatively few signal lines from a host controller 116 and transmits these signals over relatively many interconnections between the test substrate 108 and the DUTs 102a to 102d. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供进行晶片级老化和测试的技术。解决方案：本发明包括具有有源电子部件106a至106d的测试基板108和与要测试的晶片104上要测试的多个器件DUT 102a至102d进行互连的金属弹簧接触元件110。测试基板108通过相对较少的来自主机控制器116的信号线接收用于测试DUT 102a至102d的多个信号，并且在测试基板108和DUT 102a至102d之间的相对较多的互连上发送这些信号。版权所有（C）2008，JPO＆INPIT

2. 发明专利

JP2007201471A Method of testing semiconductor product die, and assembly including test die for its test 审中-公开
标题翻译：测试半导体产品的方法和包括测试测试的组件
公开(公告)号：JP2007201471A
公开(公告)日：2007-08-09
申请号：JP2007013166
申请日：2007-01-23
申请人： Formfactor Inc , フォームファクター, インコーポレイテッド
发明人： ELDRIDGE BENJAMIN N , KHANDROS IGOR Y , PEDERSEN DAVID V , WHITTEN RALPH G
IPC分类号： G01R1/06 , H01L21/66 , G01R1/073 , G01R31/28 , G01R31/3183 , H01L21/822 , H01L23/544 , H01L27/04
CPC分类号： H01L22/34 , H01L2924/0002 , H01L2924/01005 , H01L2924/01006 , H01L2924/14 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a design and a test method that break a linear relationship between a fault detection range or testability and costs of testing or producing a design. SOLUTION: A test assembly 2000 is designed for testing product circuitry of a product die 2011. In one embodiment, the test assembly comprises a test die 2010 and an interconnection substrate 2008 for electrically connecting the test die to a host controller 2002. The test die can be designed according to a design methodology for a test die and a product die that includes a step of concurrently designing test circuitry and product circuitry in a unified design. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供破坏故障检测范围或可测试性与测试或生产设计成本之间的线性关系的设计和测试方法。解决方案：测试组件2000被设计用于测试产品模具2011的产品电路。在一个实施例中，测试组件包括测试模具2010和用于将测试模具电连接到主机控制器2002的互连衬底2008。测试模具可以根据用于测试模具和产品模具的设计方法进行设计，其包括在统一设计中同时设计测试电路和产品电路的步骤。版权所有（C）2007，JPO＆INPIT

3. 发明专利

JP2007132950A Probe card assembly and kit, and method using them 有权
标题翻译：探针卡组件和套件，以及使用它们的方法
公开(公告)号：JP2007132950A
公开(公告)日：2007-05-31
申请号：JP2007000149
申请日：2007-01-04
申请人： Formfactor Inc , フォームファクター, インコーポレイテッド
发明人： KHANDROS IGOR Y , MATHIEU GAETAN L , ELDRIDGE BENJAMIN N , GRUBE GARY W
IPC分类号： G01R1/073 , B23K1/00 , B23K20/00 , B23K31/02 , C23C18/16 , C25D5/08 , C25D5/16 , C25D5/22 , C25D7/12 , C25D21/02 , G01R1/04 , G01R1/06 , G01R1/067 , G01R31/26 , G01R31/28 , H01L21/00 , H01L21/48 , H01L21/56 , H01L21/58 , H01L21/60 , H01L21/603 , H01L21/607 , H01L21/66 , H01L21/68 , H01L23/02 , H01L23/12 , H01L23/32 , H01L23/48 , H01L23/485 , H01L23/49 , H01L23/498 , H01L23/538 , H01L25/065 , H01L25/07 , H01L25/16 , H01L25/18 , H01R9/00 , H01R12/71 , H01R13/05 , H01R13/24 , H01R29/00 , H01R33/74 , H01R33/76 , H01R107/00 , H05H1/18 , H05K1/14 , H05K1/18 , H05K3/20 , H05K3/24 , H05K3/30 , H05K3/32 , H05K3/34 , H05K3/36 , H05K3/40 , H05K7/10
CPC分类号： H05K7/1069 , B23K1/0016 , B23K20/004 , B23K2201/40 , C25D5/08 , C25D5/22 , C25D7/12 , C25D21/02 , G01R1/0466 , G01R1/0483 , G01R1/06711 , G01R1/07314 , G01R1/07342 , G01R1/07357 , G01R1/07371 , G01R1/07378 , G01R31/2884 , G01R31/2886 , G01R31/2889 , H01L21/4853 , H01L21/4889 , H01L21/563 , H01L21/67138 , H01L22/20 , H01L23/32 , H01L23/49811 , H01L24/11 , H01L24/12 , H01L24/16 , H01L24/29 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/72 , H01L24/81 , H01L25/0652 , H01L25/16 , H01L2224/0401 , H01L2224/05124 , H01L2224/05166 , H01L2224/05599 , H01L2224/05647 , H01L2224/1134 , H01L2224/13099 , H01L2224/131 , H01L2224/13124 , H01L2224/13144 , H01L2224/13147 , H01L2224/13639 , H01L2224/13644 , H01L2224/13647 , H01L2224/13655 , H01L2224/13657 , H01L2224/16145 , H01L2224/29111 , H01L2224/45014 , H01L2224/45015 , H01L2224/45111 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/4554 , H01L2224/456 , H01L2224/48091 , H01L2224/48227 , H01L2224/48463 , H01L2224/48599 , H01L2224/48699 , H01L2224/48799 , H01L2224/49109 , H01L2224/73203 , H01L2224/73204 , H01L2224/73265 , H01L2224/78301 , H01L2224/81801 , H01L2224/85201 , H01L2225/0651 , H01L2225/06527 , H01L2225/06555 , H01L2225/06572 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/01022 , H01L2924/01023 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01037 , H01L2924/01039 , H01L2924/01042 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01057 , H01L2924/0106 , H01L2924/01074 , H01L2924/01075 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01088 , H01L2924/0132 , H01L2924/01322 , H01L2924/0133 , H01L2924/014 , H01L2924/07802 , H01L2924/10253 , H01L2924/10329 , H01L2924/12041 , H01L2924/12042 , H01L2924/12044 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/1517 , H01L2924/15312 , H01L2924/1532 , H01L2924/15787 , H01L2924/16195 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01R12/52 , H01R13/2407 , H01R13/2464 , H05K1/141 , H05K3/20 , H05K3/326 , H05K3/3421 , H05K3/368 , H05K3/4015 , H05K3/4092 , H05K2201/0397 , H05K2201/068 , H05K2201/1031 , H05K2201/10318 , H05K2201/10378 , H05K2201/10719 , H05K2201/10734 , H05K2201/10757 , H05K2201/10878 , Y02P70/611 , H01L2924/00 , H01L2924/01013 , H01L2924/01026 , H01L2924/3512 , H01L2224/29099 , H01L2224/48 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/00012 , H01L2924/20751 , H01L2924/20756 , H01L2924/20757 , H01L2924/00015 , H01L2924/2075
摘要： PROBLEM TO BE SOLVED: To provide a technique for applying a probe to a semiconductor element capable of an orientation of an edge of a probe element, without altering a position of a probe card. SOLUTION: The probe card assembly comprises an upper surface, a lower surface, and the probe card (electronic component) having a plurality of terminals on the upper surface: the upper surface, the lower surface and an intervention body (electronic component) which has the first plural contact structures with a restoring property extending from the terminals at the lower surface and the second plural contact structures with the restoring property extending from the terminals at the upper surface: the upper surface, the lower surface, an interval converter which has the plural contact pads (terminal) mounted at the lower surface and the third contact structures (probe element) with the restoring property extending from the terminals at the upper surface. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于将探针施加到能够探测元件的边缘的取向的半导体元件的技术，而不改变探针卡的位置。解决方案：探针卡组件包括上表面，下表面和在上表面上具有多个端子的探针卡（电子部件）：上表面，下表面和干涉体（电子部件），其具有第一多个接触结构，具有从下表面的端子延伸的恢复特性和具有从上表面的端子延伸的恢复特性的第二多个接触结构：上表面，下表面，间隔转换器其具有安装在下表面的多个接触垫（端子）和具有从上表面的端子延伸的恢复特性的第三接触结构（探针元件）。版权所有（C）2007，JPO＆INPIT

4. 发明专利

JP2006013526A Assembly of electronic component equipped with spring packaging 审中-公开
标题翻译：装配弹簧包装的电子元件组装
公开(公告)号：JP2006013526A
公开(公告)日：2006-01-12
申请号：JP2005201965
申请日：2005-07-11
申请人： Formfactor Inc , フォームファクター,インコーポレイテッド
发明人： PEDERSEN DAVID V , ELDRIDGE BENJAMIN N , KHANDROS IGOR Y
IPC分类号： H01L23/32 , H05K1/18 , B23K1/00 , B23K20/00 , C23C18/16 , C25D5/08 , C25D5/22 , C25D7/12 , C25D21/02 , G01R1/04 , G01R1/067 , G01R1/073 , G01R31/01 , G01R31/26 , G01R31/28 , H01L21/00 , H01L21/48 , H01L21/56 , H01L21/60 , H01L21/603 , H01L21/66 , H01L23/04 , H01L23/12 , H01L23/13 , H01L23/48 , H01L23/485 , H01L23/49 , H01L23/498 , H01L23/538 , H01L25/065 , H01L25/16 , H05K1/14 , H05K3/20 , H05K3/32 , H05K3/34 , H05K3/36 , H05K3/40
CPC分类号： H01L25/16 , B23K1/0016 , B23K20/004 , B23K2201/40 , C25D5/08 , C25D5/22 , C25D21/02 , G01R1/0408 , G01R1/0433 , G01R1/06711 , G01R1/07342 , G01R1/07378 , G01R31/01 , G01R31/2863 , G01R31/2886 , G01R31/2889 , H01L21/4853 , H01L21/4889 , H01L21/563 , H01L22/20 , H01L23/04 , H01L23/13 , H01L23/32 , H01L23/49811 , H01L23/5385 , H01L24/06 , H01L24/11 , H01L24/12 , H01L24/16 , H01L24/45 , H01L24/49 , H01L24/72 , H01L24/81 , H01L25/0652 , H01L2223/54473 , H01L2224/0401 , H01L2224/04042 , H01L2224/05553 , H01L2224/05599 , H01L2224/06136 , H01L2224/1134 , H01L2224/13099 , H01L2224/16145 , H01L2224/45144 , H01L2224/49109 , H01L2224/73203 , H01L2224/81136 , H01L2224/81801 , H01L2224/85201 , H01L2224/85399 , H01L2225/0651 , H01L2225/06527 , H01L2225/06555 , H01L2225/06572 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01028 , H01L2924/01033 , H01L2924/01051 , H01L2924/01061 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/12042 , H01L2924/12044 , H01L2924/14 , H01L2924/1433 , H01L2924/1532 , H01L2924/15787 , H01L2924/16152 , H01L2924/19043 , H05K1/141 , H05K3/20 , H05K3/325 , H05K3/326 , H05K3/3421 , H05K3/368 , H05K3/4015 , H05K2201/09472 , H05K2201/1031 , H05K2201/10318 , H05K2201/10757 , H05K2201/10878 , H05K2201/10909 , H05K2201/10946 , Y02P70/611 , H01L2924/00 , H01L2224/48
摘要： PROBLEM TO BE SOLVED: To provide a product and an assembly for receiving a long and thin mutual contact element such as a spring contact element extending from an electronic part such as a semiconductor device. SOLUTION: A capture pad is provided in a socket board for receiving an end part of a long and thin mutual contact element extending from an electronic part. The structures of various capture pads are disclosed. A fixing device such as a housing surely positions the electronic part on the socket board. Connection to an external device is carried out through a conductive trace adjacent to the surface of the socket board. The socket board can be supported by a support board. In a particularly preferred embodiment, the capture pad is directly formed on a primary substrate such as a printed circuit board. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种产品和组件，用于接收诸如从诸如半导体器件的电子部件延伸的弹簧接触元件的长而薄的相互接触元件。解决方案：捕获垫设置在插座板中，用于接收从电子部件延伸的长而薄的相互接触元件的端部。公开了各种捕获垫的结构。诸如外壳之类的固定装置将电子部件确定地定位在插座板上。通过邻近插座板表面的导电迹线与外部设备连接。插座板可以由支撑板支撑。在特别优选的实施例中，捕获垫直接形成在诸如印刷电路板的初级衬底上。版权所有（C）2006，JPO＆NCIPI

5. 发明专利

JP2005164601A Method and apparatus for planarizing semiconductor contactor 审中-公开
标题翻译：用于平面化半导体接触器的方法和装置
公开(公告)号：JP2005164601A
公开(公告)日：2005-06-23
申请号：JP2004353370
申请日：2004-12-06
申请人： Formfactor Inc , フォームファクター,インコーポレイテッド
发明人： MATHIEU GAETAN L , ELDRIDGE BENJAMIN N , GRUBE GARY W
IPC分类号： G01R31/26 , G01R1/073 , H01L21/66
CPC分类号： G01R1/07307
摘要： PROBLEM TO BE SOLVED: To provide a method for adjusting the planarity of a contact element for a probe card assembly.
SOLUTION: A planarizing apparatus includes a first control element extending from a substrate of the probe card assembly. The first control element extends, through at least one substrate of the probe card assembly, and can be accessed from the exposed side of the outer substrate of the probe card assembly. By operating the first control element, the substrate connected to the first control element is made warped.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种用于调整用于探针卡组件的接触元件的平面度的方法。解决方案：平面化装置包括从探针卡组件的基底延伸的第一控制元件。第一控制元件通过探针卡组件的至少一个衬底延伸，并且可以从探针卡组件的外部衬底的暴露侧进入。通过操作第一控制元件，连接到第一控制元件的基板变形。版权所有（C）2005，JPO＆NCIPI

6. 发明专利

JP2003232809A MICROELECTRONIC CONTACT STRUCTURE AND ITS MANUFACTURING METHOD 审中-公开
公开(公告)号：JP2003232809A
公开(公告)日：2003-08-22
申请号：JP2002367883
申请日：2002-12-19
申请人： FORMFACTOR INC
发明人： KHANDROS IGOR Y , ELDRIDGE BENJAMIN N , MATHIEU GAETAN L , GARY W GRUBE
IPC分类号： G01R1/073 , G01R1/067 , G01R3/00 , G01R31/28 , G01R31/316 , H01H1/00 , H01L21/66 , H01L23/48 , H01L23/485 , H01L23/498 , H01R13/24 , H05K3/20 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide a microminiature spring contact suitable for probing of an active semiconductor device, and its manufacturing method. SOLUTION: A cantilever-shaped contact element 100 is long and narrow and has two ends 102, 104 and a center part 106 between the ends. The end 102 is a base part, and the contact element 100 is fitted with an electronic part (unillustrated) on the end 102. A coupling fixture 110 is provided on the base part 102. The coupling fixture 110 can be formed as a tab or a stud to facilitate brazing on a substrate at the assembly time. The end 104 is a free end, and a device to be tested is brought into contact with the end 104. An integrated projecting fixture 108, for example, in a pyramidal geometric shape, is provided on the tip 104 to assist connection by pressure to the terminal of the device to be tested. The contact element 100 has a step-shaped structure. The contact element can be easily manufactured by using a known lithography technology. COPYRIGHT: (C)2003,JPO

7. 发明专利

JP2002174669A SIMULTANEOUS TEST FOR INTEGRATED CIRCUIT DEVICE, USING INTER-DUT COMPARISON AND INTRA-DUT COMARISON 审中-公开
公开(公告)号：JP2002174669A
公开(公告)日：2002-06-21
申请号：JP2001296088
申请日：2001-09-27
申请人： FORMFACTOR INC
发明人： ROY RICHARD S , MILLER CHARLES A
IPC分类号： G01R31/28 , G01R31/319 , G01R31/3193 , G11C29/48 , G11C29/56 , H01L21/66 , G11C29/00
摘要： PROBLEM TO BE SOLVED: To provide a means for testing a plurality of integrated circuit devices at the same time. SOLUTION: This system for testing the plurality of integrated circuit(IC) devices (DUT) of testing objects is provided with an interface circuit coupled to a tester to receives a data value from a single channel or a plurality of channels so as to provide error information as to the DUT. The interface circuit transmits the data value (received from the tester via the single channel) to the plurality of DUTs. The interface circuit conducts comarison using the data value read from the DUT, and generates an error value for showing a comarison result in response thereto. The error value is returned to the tester via the same channel or a different channel.

8. 发明公开

KR20200135823A 내장된 스케이트를 갖는 프로브 팁 审中-公开
公开(公告)号：KR20200135823A
公开(公告)日：2020-12-03
申请号：KR20207030017
申请日：2019-03-22
申请人： FORMFACTOR INC
发明人： KISTER JANUARY , WANG CHUN CHIH
IPC分类号： G01R1/067 , G01R3/00 , G01R31/28
摘要： 전기디바이스들을테스트하기위한프로브의팁 상의스케이트는두께가감소되는프로브팁 접촉부이다. 그러한스케이트는유리하게는, 접촉압력을증가시킬수 있지만, 바람직하지않게는, 스케이트의빠른기계적마모로인해프로브수명을감소시킬수 있다. 여기에서, 종래의핀-유사스케이트구성과대조적으로, 프로브팁의전체형상이매끄러운곡선표면인다층스케이트프로브들이제공된다. 스케이트층은구조에서가장기계적으로내마모성층이고, 이에따라프로브팁의연마프로세싱은스케이트층에의해정의된프로브스케이트로이어진다. 결과적인프로브들은감소된수명의단점없이증가된접촉압력의이점을제공한다.

9. 发明专利

JP2011075342A Probe head control mechanism for probe card assembly 审中-公开
标题翻译：探头卡组件探头控制机制
公开(公告)号：JP2011075342A
公开(公告)日：2011-04-14
申请号：JP2009225635
申请日：2009-09-29
申请人： Formfactor Inc , フォームファクター, インコーポレイテッド
发明人： MCFARLAND ANDREW W , LIEW BRANDON , PORTER JAMES M JR , YASUMURA KEVIN Y
IPC分类号： G01R31/28 , G01R1/06 , H01L21/66
摘要： PROBLEM TO BE SOLVED: To overcome the problem with a conventional probe card assembly, wherein usable material characteristics of components are varied, resulting in limiting the sphere and the accuracy in adjustment of movement by heat.
SOLUTION: The probe card assembly includes a first probe head having a contact element which is disposed on the respective surface for forming electric contact with a corresponding terminal of a corresponding electronic device, a second probe head having the contact element which is disposed on the respective surface for forming the electric contact with a corresponding terminal of a corresponding electronic device, and a control mechanism which is connected to the first and second probe heads and controls movement of the first and second probe heads to a first direction parallel substantially to the respective surfaces thereof, more than to a second direction perpendicular substantially to the respective surfaces.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：为了克服常规探针卡组件的问题，其中组件的可用材料特性是变化的，导致球体的限制和由热量调节的精度。解决方案：探针卡组件包括具有接触元件的第一探针头，该接触元件设置在相应的表面上，用于与对应的电子设备的相应端子形成电接触;第二探针头，其具有布置的接触元件在相应的表面上形成与对应的电子设备的相应端子的电接触;以及控制机构，其连接到第一和第二探头，并且控制第一和第二探头的运动到基本相同的第一方向其各自的表面大于垂直于相应表面垂直的第二方向。版权所有（C）2011，JPO＆INPIT

10. 发明专利

JP2010073698A Sharpened oriented tip structure 审中-公开
标题翻译：锐化的尖端结构
公开(公告)号：JP2010073698A
公开(公告)日：2010-04-02
申请号：JP2009283375
申请日：2009-12-14
申请人： Formfactor Inc , フォームファクター, インコーポレイテッド
发明人： ELDRIDGE BENJAMIN N , GRUBE GARY W , KHANDROS IGOR Y , MADSEN ALEC , MATHIEU GAETAN L
IPC分类号： G01R1/073 , H01R13/24 , G01R1/06 , H01R4/26 , H01R4/58 , H01R12/55 , H01R12/71 , H01R43/16
CPC分类号： H01R13/2407 , G01R1/06711 , G01R1/06727 , H01R4/26 , H01R9/091 , H01R12/57 , H01R13/2442 , H01R2201/20 , Y10T29/49004 , Y10T29/49128 , Y10T29/49165
摘要： PROBLEM TO BE SOLVED: To provide a device and a method of producing an improved mutual connection element and a tip structure for carrying out pressure connection between terminals of electronic parts. SOLUTION: The tip structure includes a sharp blade, and this blade is arranged so that the length of the blade will become substantially in parallel with a horizontal movement direction of the tip structural when the tip structure bends and crosses the terminals of the electronic parts. In this way, the sharp blade arranged substantially in parallel clearly cuts in through a certain non-conductive layer (singular or multiple), and brings about sure electric connection between the interconnection element and the terminals of the electronic parts. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：解决的问题：提供一种制造改进的相互连接元件的装置和方法以及用于在电子部件的端子之间进行压力连接的尖端结构。解决方案：尖端结构包括锋利的刀片，并且该刀片布置成使得当尖端结构弯曲并穿过尖端结构的端子时，叶片的长度将变得基本上与尖端结构的水平移动方向平行电子零件。以这种方式，基本上平行布置的锋利的刀片明显地穿过某个非导电层（单个或多个），并且导致互连元件和电子部件的端子之间的电连接。版权所有（C）2010，JPO＆INPIT

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