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    • 2. 发明授权
    • Methods of forming germanium-antimony-tellurium materials and methods of forming a semiconductor device structure including the same
    • 形成锗 - 锑 - 碲材料的方法和形成包括其的半导体器件结构的方法
    • US08759146B2
    • 2014-06-24
    • US13416646
    • 2012-03-09
    • Eugene P. Marsh
    • Eugene P. Marsh
    • H01L21/00
    • H01L45/1616C23C16/305C23C16/45531H01L45/06H01L45/1233H01L45/144
    • A method of forming a material comprises conducting an ALD layer cycle of a first metal, the ALD layer cycle comprising a reactive first metal precursor and a co-reactive first metal precursor. An ALD layer cycle of a second metal is conducted, the ALD layer cycle comprising a reactive second metal precursor and a co-reactive second metal precursor. An ALD layer cycle of a third metal is conducted, the ALD layer cycle comprising a reactive third metal precursor and a co-reactive third metal precursor. The ALD layer cycles of the first metal, the second metal, and the third metal are repeated to form a material, such as a GeSbTe material, having a desired stoichiometry. Additional methods of forming a material, such as a GeSbTe material, are disclosed, as is a method of forming a semiconductor device structure including a GeSbTe material.
    • 形成材料的方法包括进行第一金属的ALD层循环,所述ALD层循环包含反应性第一金属前体和共反应性第一金属前体。 进行第二金属的ALD层循环,ALD层循环包含反应性第二金属前体和共反应性第二金属前体。 进行第三金属的ALD层循环,ALD层循环包含反应性第三金属前体和共反应性第三金属前体。 重复第一金属,第二金属和第三金属的ALD层循环以形成具有所需化学计量的材料,例如GeSbTe材料。 公开了形成诸如GeSbTe材料的材料的附加方法,以及形成包括GeSbTe材料的半导体器件结构的方法。
    • 9. 发明申请
    • METHODS OF FORMING GERMANIUM-ANTIMONY-TELLURIUM MATERIALS AND METHODS OF FORMING A SEMICONDUCTOR DEVICE STRUCTURE INCLUDING THE SAME
    • 形成锗 - 抗微生物材料的方法及其形成包括其的半导体器件结构的方法
    • US20120171812A1
    • 2012-07-05
    • US13416646
    • 2012-03-09
    • Eugene P. Marsh
    • Eugene P. Marsh
    • H01L21/06
    • H01L45/1616C23C16/305C23C16/45531H01L45/06H01L45/1233H01L45/144
    • A method of forming a material comprises conducting an ALD layer cycle of a first metal, the ALD layer cycle comprising a reactive first metal precursor and a co-reactive first metal precursor. An ALD layer cycle of a second metal is conducted, the ALD layer cycle comprising a reactive second metal precursor and a co-reactive second metal precursor. An ALD layer cycle of a third metal is conducted, the ALD layer cycle comprising a reactive third metal precursor and a co-reactive third metal precursor. The ALD layer cycles of the first metal, the second metal, and the third metal are repeated to form a material, such as a GeSbTe material, having a desired stoichiometry. Additional methods of forming a material, such as a GeSbTe material, are disclosed, as is a method of forming a semiconductor device structure including a GeSbTe material.
    • 形成材料的方法包括进行第一金属的ALD层循环,所述ALD层循环包含反应性第一金属前体和共反应性第一金属前体。 进行第二金属的ALD层循环,ALD层循环包含反应性第二金属前体和共反应性第二金属前体。 进行第三金属的ALD层循环,ALD层循环包含反应性第三金属前体和共反应性第三金属前体。 重复第一金属,第二金属和第三金属的ALD层循环以形成具有所需化学计量的材料,例如GeSbTe材料。 公开了形成诸如GeSbTe材料的材料的附加方法,以及形成包括GeSbTe材料的半导体器件结构的方法。