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1. 发明授权

US07151366B2 Integrated process condition sensing wafer and data analysis system 有权
标题翻译：集成工艺条件检测晶片和数据分析系统
公开(公告)号：US07151366B2
公开(公告)日：2006-12-19
申请号：US10718269
申请日：2003-11-19
申请人： Wayne Glenn Renken , Earl Jensen , Roy Gordon
发明人： Wayne Glenn Renken , Earl Jensen , Roy Gordon
IPC分类号： G01R31/28
CPC分类号： H01L21/67253 , H01L2224/48091 , H01L2924/01087 , H01L2924/10253 , H01L2924/12041 , H01L2924/15153 , H01L2924/15157 , H01L2924/15165 , H01L2924/16152 , H01L2924/16153 , H01L2924/16195 , H01L2924/19041 , H01L2924/3011 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： A process condition measuring device and a handling system may be highly integrated with a production environment where the dimensions of the process condition measuring device are close to those of a production substrate and the handling system is similar to a substrate carrier used for production substrates. Process conditions may be measured with little disturbance to the production environment. Data may be transferred from a process condition measuring device to a user with little or no human intervention.
摘要翻译：处理条件测量装置和处理系统可以与生产环境高度集成，其中处理条件测量装置的尺寸接近制造基板的尺寸，并且处理系统类似于用于生产基板的基板载体。可以对生产环境几乎没有干扰地测量工艺条件。数据可以从过程状态测量装置传送到用户很少或没有人为干预。

2. 发明申请

US20050246127A1 Integrated process condition sensing wafer and data analysis system 有权
标题翻译：集成工艺条件检测晶片和数据分析系统
公开(公告)号：US20050246127A1
公开(公告)日：2005-11-03
申请号：US11158983
申请日：2005-06-21
申请人： Wayne Renken , Earl Jensen , Roy Gordon
发明人： Wayne Renken , Earl Jensen , Roy Gordon
IPC分类号： H01L21/00 , G01R27/28
CPC分类号： H01L21/67253 , H01L2224/48091 , H01L2924/01087 , H01L2924/10253 , H01L2924/12041 , H01L2924/15153 , H01L2924/15157 , H01L2924/15165 , H01L2924/16152 , H01L2924/16153 , H01L2924/16195 , H01L2924/19041 , H01L2924/3011 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： A process condition measuring device and a handling system may be highly integrated with a production environment where the dimensions of the process condition measuring device are close to those of a production substrate and the handling system is similar to a substrate carrier used for production substrates. Process conditions may be measured with little disturbance to the production environment. Data may be transferred from a process condition measuring device to a user with little or no human intervention.
摘要翻译：处理条件测量装置和处理系统可以与生产环境高度集成，其中处理条件测量装置的尺寸接近制造基板的尺寸，并且处理系统类似于用于生产基板的基板载体。可以对生产环境几乎没有干扰地测量工艺条件。数据可以从过程状态测量装置传送到用户很少或没有人为干预。

3. 发明授权

US09134186B2 Process condition measuring device (PCMD) and method for measuring process conditions in a workpiece processing tool configured to process production workpieces 有权
标题翻译：工艺条件测量装置（PCMD）和用于测量工件处理工具中的工艺条件的方法，该工件处理工具被配置为处理生产工件
公开(公告)号：US09134186B2
公开(公告)日：2015-09-15
申请号：US13020770
申请日：2011-02-03
申请人： Mei Sun , Farhat Quli , Earl Jensen , Paul Arleo , Vaibhaw Vishal
发明人： Mei Sun , Farhat Quli , Earl Jensen , Paul Arleo , Vaibhaw Vishal
IPC分类号： G01K17/00 , G01K1/16 , H01L21/67
CPC分类号： G01K17/00 , H01L21/67248
摘要： A process condition measuring device (PCMD) may include first and second substrate components. One or more temperature sensors are embedded within each substrate component. The first and second substrate components are sandwiched together such that each temperature sensor in the second substrate component is aligned in tandem with a corresponding temperature sensor located in the first substrate component. Alternatively first and second temperature sensors may be positioned in parallel in the same substrate. Temperature differences may be measured between pairs of corresponding temperature sensors when the PCMD is subjected to process conditions in a workpiece processing tool. Process conditions in the tool may be calculated from the temperature differences.
摘要翻译：工艺条件测量装置（PCMD）可以包括第一和第二衬底部件。一个或多个温度传感器嵌入每个基板部件内。将第一和第二基板部件夹在一起，使得第二基板部件中的每个温度传感器与位于第一基板部件中的对应的温度传感器串联对准。或者，第一和第二温度传感器可以在同一衬底中平行定位。当PCMD在工件处理工具中经受工艺条件时，可以在成对的相应温度传感器之间测量温差。工具中的工艺条件可以根据温差计算。

4. 发明申请

US20140192840A1 HIGH TEMPERATURE SENSOR WAFER FOR IN-SITU MEASUREMENTS IN ACTIVE PLASMA 有权
标题翻译：高温传感器用于现场等离子体测量
公开(公告)号：US20140192840A1
公开(公告)日：2014-07-10
申请号：US13787178
申请日：2013-03-06
申请人： Mei Sun , Earl Jensen , Farhat Quli , Stephen Sharratt
发明人： Mei Sun , Earl Jensen , Farhat Quli , Stephen Sharratt
IPC分类号： G01K1/14
CPC分类号： G01K1/14 , G01K1/12 , G01K2215/00
摘要： Aspects of the present disclosure disclose a component module in a process condition measuring device comprises a support for supporting a component, one or more legs configured to suspend the support in a spaced-apart relationship with respect to a substrate. An electrically conductive or low-resistivity semiconductor enclosure is configured to enclose the component, the support and the legs between the substrate and the enclosure. It is emphasized that this abstract is provided to comply with the rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims.
摘要翻译：本公开的方面公开了一种处理状态测量装置中的部件模块，包括用于支撑部件的支撑件，一个或多个腿部，其配置成以相对于基板间隔开的关系悬挂支撑件。导电或低电阻率半导体外壳被配置为将部件，支撑件和支脚封闭在基板和外壳之间。要强调的是，该摘要被提供以符合要求抽象的规则，允许搜索者或其他读者快速确定技术公开内容的主题。提交它的理解是，它不会用于解释或限制权利要求的范围或含义。

5. 发明申请

US20140122654A1 AUTOMATED INTERFACE APPARATUS AND METHOD FOR USE IN SEMICONDUCTOR WAFER HANDLING SYSTEMS 有权
标题翻译：自动化接口装置和半导体波形处理系统中使用的方法
公开(公告)号：US20140122654A1
公开(公告)日：2014-05-01
申请号：US13664349
申请日：2012-10-30
申请人： Earl Jensen
发明人： Earl Jensen
IPC分类号： H04L29/08
CPC分类号： H04L29/08702 , G05B19/41865 , G05B2219/45031 , H04L67/12 , H04L67/34 , Y10S901/50
摘要： Aspects of the present disclosure describe a smart docking station. The smart docking station may contain a data transfer and an electrical connection which allow a sensor wafer to be charged and to upload and download data. The smart docking station may be located at an off-track storage position above a tool. This location enables an automated materials handling system (AMHS) to retrieve the sensor wafer and deliver it to a tool requiring analysis. The sensor wafer may be stored in a smart front opening unified pod (FOUP). It is emphasized that this abstract is provided to comply with the rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims.
摘要翻译：本公开的方面描述了智能对接站。智能对接站可以包含允许传感器晶片被充电并且上传和下载数据的数据传输和电连接。智能对接站可以位于工具上方的离轨存储位置。该位置使得自动化材料处理系统（AMHS）能够检索传感器晶片并将其传送到需要分析的工具。传感器晶片可以存储在智能前开口统一盒（FOUP）中。要强调的是，该摘要被提供以符合要求抽象的规则，允许搜索者或其他读者快速确定技术公开的主题。提交它的理解是，它不会用于解释或限制权利要求的范围或含义。

6. 发明申请

US20120318966A1 WAFER LEVEL SPECTROMETER 有权
公开(公告)号：US20120318966A1
公开(公告)日：2012-12-20
申请号：US13491442
申请日：2012-06-07
申请人： Earl Jensen , Mei Sun , Kevin O'Brien
发明人： Earl Jensen , Mei Sun , Kevin O'Brien
IPC分类号： G01J3/50 , B82Y15/00
CPC分类号： G01J3/0259 , G01J1/58 , G01J3/0205 , G01J3/021 , G01J3/0256 , G01J3/0262 , G01J3/36 , G01J2003/1213
摘要： A sensor apparatus for measuring characteristics of optical radiation has a substrate and a low profile spectrally selective detection system located within the substrate at one or more spatially separated locations. The spectrally selective detection system includes a generally laminar array of wavelength selectors optically coupled to a corresponding array of optical detectors. It is emphasized that this abstract is provided to comply with the rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims.
摘要翻译：用于测量光辐射特性的传感器装置具有位于一个或多个空间分离位置的衬底内的衬底和低剖面光谱选择性检测系统。光谱选择性检测系统包括光学耦合到相应阵列的光学检测器的波长选择器的大体层流阵列。要强调的是，该摘要被提供以符合要求抽象的规则，允许搜索者或其他读者快速确定技术公开内容的主题。提交它的理解是，它不会用于解释或限制权利要求的范围或含义。

7. 发明申请

US20120203495A1 PROCESS CONDITION MEASURING DEVICE (PCMD) AND METHOD FOR MEASURING PROCESS CONDITIONS IN A WORKPIECE PROCESSING TOOL CONFIGURED TO PROCESS PRODUCTION WORKPIECES 有权
标题翻译：工艺条件测量装置（PCMD）和方法，用于在配置加工生产工作的工件加工工具中测量工艺条件
公开(公告)号：US20120203495A1
公开(公告)日：2012-08-09
申请号：US13020770
申请日：2011-02-03
申请人： Mei Sun , Farhat Quli , Earl Jensen , Paul Arleo , Vaibhaw Vishal
发明人： Mei Sun , Farhat Quli , Earl Jensen , Paul Arleo , Vaibhaw Vishal
IPC分类号： G01K17/00 , G06F15/00
CPC分类号： G01K17/00 , H01L21/67248
摘要： A process condition measuring device (PCMD) may include first and second substrate components. One or more temperature sensors are embedded within each substrate component. The first and second substrate components are sandwiched together such that each temperature sensor in the second substrate component is aligned in tandem with a corresponding temperature sensor located in the first substrate component. Alternatively first and second temperature sensors may be positioned in parallel in the same substrate. Temperature differences may be measured between pairs of corresponding temperature sensors when the PCMD is subjected to process conditions in a workpiece processing tool. Process conditions in the tool may be calculated from the temperature differences.
摘要翻译：工艺条件测量装置（PCMD）可以包括第一和第二衬底部件。一个或多个温度传感器嵌入每个基板部件内。将第一和第二基板部件夹在一起，使得第二基板部件中的每个温度传感器与位于第一基板部件中的对应的温度传感器串联对准。或者，第一和第二温度传感器可以在同一衬底中平行定位。当PCMD在工件处理工具中经受工艺条件时，可以在成对的相应温度传感器之间测量温差。工具中的工艺条件可以根据温差计算。

8. 发明申请

US20070251338A1 Process Condition Measuring Device with Shielding 有权
标题翻译：带屏蔽的工艺条件测量装置
公开(公告)号：US20070251338A1
公开(公告)日：2007-11-01
申请号：US11380985
申请日：2006-05-01
申请人： Lynn Wiese , Earl Jensen
发明人： Lynn Wiese , Earl Jensen
IPC分类号： G01D7/02
CPC分类号： H01L22/22 , H01L2924/0002 , H01L2924/3025 , H01L2924/00
摘要： A process condition measuring device has electronic components sandwiched between two conductive substrate portions. The conductive substrate portions are joined by an electrically conductive pathway. Native oxide is removed from substrate portions and electrically conductive contact pads are formed that are then joined together with electrically conductive adhesive to form the electrically conductive pathway.
摘要翻译：工艺条件测量装置具有夹在两个导电衬底部分之间的电子部件。导电基板部分通过导电路径连接。从衬底部分去除氧化皮，并且形成导电接触焊盘，然后使用导电粘合剂将其接合在一起以形成导电通路。

9. 发明授权

US2775989A Dispenser and supporting means 失效
标题翻译：分配器和支撑装置
公开(公告)号：US2775989A
公开(公告)日：1957-01-01
申请号：US44854254
申请日：1954-08-09
申请人： EARL JENSEN JAMES
发明人： EARL JENSEN JAMES
IPC分类号： A47K5/18
CPC分类号： A47K5/18

10. 发明授权

US09360302B2 Film thickness monitor 有权
标题翻译：胶片厚度监视器
公开(公告)号：US09360302B2
公开(公告)日：2016-06-07
申请号：US13679128
申请日：2012-11-16
申请人： Earl Jensen , Kevin O'Brien , Farhat Quli , Mei Sun
发明人： Earl Jensen , Kevin O'Brien , Farhat Quli , Mei Sun
IPC分类号： G01N21/00 , G01B11/06 , G01B9/02
CPC分类号： G01B11/06 , G01B9/02051 , G01B11/0625 , G01B11/0641 , G01B11/0675 , G01B11/0683
摘要： A measurement unit comprising a light source and a photodetector may be formed in a cavity in a substrate. The light source produces light that impinges a material layer and is reflected back to the photodetector. Through methods such as interferometry and ellipsometry, the thickness of the material layer may be calculated from the light intensity data measured by the photodetector. It is emphasized that this abstract is provided to comply with the rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims.
摘要翻译：包括光源和光电检测器的测量单元可以形成在基板中的空腔中。光源产生照射材料层并被反射回光电检测器的光。通过诸如干涉测量和椭偏仪的方法，材料层的厚度可以由光电检测器测量的光强度数据计算。要强调的是，该摘要被提供以符合要求抽象的规则，允许搜索者或其他读者快速确定技术公开内容的主题。提交它的理解是，它不会用于解释或限制权利要求的范围或含义。

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