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1. 发明授权

US08331104B2 Electronic device and circuit board 有权
标题翻译：电子设备和电路板
公开(公告)号：US08331104B2
公开(公告)日：2012-12-11
申请号：US12905843
申请日：2010-10-15
申请人： Daigo Suzuki
发明人： Daigo Suzuki
IPC分类号： H05K7/00
CPC分类号： H05K1/00 , H05K5/00
摘要： According to one embodiment, an electronic device includes a circuit board housed in a housing. The circuit board further includes a conductive layer, an insulating layer and a signal line. The conductive layer includes a base portion including a surface, a plurality of first projecting portions formed integrally with the base portion and extending in parallel with each other on the surface of the base portion, and a plurality of second projecting portions formed integrally with the base portion and extending in parallel with each other to cross the plurality of first projecting portions. The insulating layer is stacked on the conductive layer to cover the surface of the base portion, and the signal line is stacked on the insulating layer and extends in a direction crossing directions in which the first and second projecting portions extend.
摘要翻译：根据一个实施例，电子设备包括容纳在壳体中的电路板。电路板还包括导电层，绝缘层和信号线。所述导电层包括基部，所述基部包括表面，多个第一突出部分与所述基部一体地形成并且在所述基部的表面上彼此平行地延伸;以及多个第二突出部分，其与所述基部并且彼此平行地延伸以跨越多个第一突出部分。绝缘层层叠在导电层上以覆盖基部的表面，并且信号线堆叠在绝缘层上并沿与第一和第二突出部分延伸的方向交叉的方向延伸。

2. 发明申请

US20120049737A1 SELF-BALLASTED LAMP AND LIGHTING FIXTURE 有权
标题翻译：自封灯和照明灯具
公开(公告)号：US20120049737A1
公开(公告)日：2012-03-01
申请号：US13222837
申请日：2011-08-31
申请人： Toshitake KITAGAWA , Makoto Sakai , Daigo Suzuki , Michinobu Inoue
发明人： Toshitake KITAGAWA , Makoto Sakai , Daigo Suzuki , Michinobu Inoue
IPC分类号： H01J7/44
CPC分类号： F21V17/101 , F21K9/232 , F21K9/238 , F21K9/60 , F21V3/00 , F21V5/04 , F21V23/006 , F21Y2115/10
摘要： A self-ballasted lamp includes a base body, a light source unit attached to one side of the base body, a lens attached to the light source unit, a cap provided on the other side of the base body and a lighting circuit arranged in the space provided by the base body and the cap. The light source unit includes a light source constituted by semiconductor light emitting elements. The lens has a lens body facing the light source and an attachment leg for attaching the lens body to the light source unit. A claw portion to be secured to the light source unit can be provided on the attachment leg.
摘要翻译：一种自镇流灯包括基体，安装在基体一侧的光源单元，安装在光源单元上的透镜，设置在基体另一侧的盖和布置在基体中的点亮电路由基体和盖提供的空间。光源单元包括由半导体发光元件构成的光源。透镜具有面向光源的透镜体和用于将透镜体附接到光源单元的附接腿。可以在附接腿上设置要固定到光源单元的爪部。

3. 发明授权

US07872874B2 Printed-wiring board with built-in component, manufacturing method of printed-wiring board with built-in component, and electronic device 失效
标题翻译：具有内置元件的印刷电路板，具有内置元件的印刷电路板的制造方法和电子设备
公开(公告)号：US07872874B2
公开(公告)日：2011-01-18
申请号：US11701816
申请日：2007-02-01
申请人： Jun Karasawa , Daigo Suzuki , Hidenori Tanaka
发明人： Jun Karasawa , Daigo Suzuki , Hidenori Tanaka
IPC分类号： H05K7/10 , H05K7/12
CPC分类号： H05K1/111 , H05K3/284 , H05K3/3421 , H05K3/3442 , H05K2201/09381 , H05K2201/09663 , H05K2201/10636 , H05K2201/10689 , H05K2203/1178 , Y02P70/611 , Y02P70/613 , Y10T29/4913 , Y10T29/49147
摘要： According to one embodiment, there is provided a printed-wiring board with a component in which an electronic component is mounted on a pattern-forming surface of a base material. In the printed-wiring board, a guiding path for guiding, to the outside, a void formed in mounting the electronic component is formed on the pattern-forming surface.
摘要翻译：根据一个实施例，提供了一种印刷电路板，其具有将电子部件安装在基材的图案形成表面上的部件。在印刷电路板中，在图案形成表面上形成用于将安装电子部件形成的空隙引导到外部的引导路径。

4. 发明申请

US20090168386A1 ELECTRONIC APPARATUS AND SUBSTRATE MOUNTING METHOD 审中-公开
标题翻译：电子装置和基板安装方法
公开(公告)号：US20090168386A1
公开(公告)日：2009-07-02
申请号：US12248748
申请日：2008-10-09
申请人： Daigo Suzuki , Akihiko Happoya
发明人： Daigo Suzuki , Akihiko Happoya
IPC分类号： H05K7/02 , H01L21/52
CPC分类号： H05K9/003 , H01L23/552 , H01L25/165 , H01L2924/1617 , H01L2924/3011 , H05K1/0218 , H05K1/141 , H05K1/181 , H05K2201/10378 , H05K2201/2018 , H05K2201/2036 , H05K2203/1572
摘要： According to one embodiment, an electronic apparatus comprises a frame with a hollow portion formed inside thereof, a shield coating applied to the inner surface of the frame, a plurality of connection terminals having lead portions provided on the outside surface of the frame, and a module substrate which mounts circuit components on the front and rear surfaces thereof and which is placed on the frame in a state where at least the rear side circuit components are housed in the hollow portion with the circuit components on the front and rear surfaces connected to the connection terminals.
摘要翻译：根据一个实施例，一种电子设备包括：在其内部形成有中空部分的框架，施加到框架内表面的屏蔽涂层;多个连接端子，其具有设置在框架的外表面上的引线部分;以及模块基板，其在其前表面和后表面上安装电路部件，并且在至少后侧电路部件容纳在中空部分中的状态下放置在框架上，其中电路部件在前后表面连接到中空部分连接端子。

5. 发明申请

US20070277998A1 Printed wiring board, its manufacturing method, and electronic equipment 审中-公开
标题翻译：印刷电路板，其制造方法和电子设备
公开(公告)号：US20070277998A1
公开(公告)日：2007-12-06
申请号：US11806203
申请日：2007-05-30
申请人： Daigo Suzuki , Jun Karasawa , Sadahiro Tamai
发明人： Daigo Suzuki , Jun Karasawa , Sadahiro Tamai
IPC分类号： H05K1/03
CPC分类号： H05K3/4691 , H05K1/0218 , H05K3/0035 , H05K3/429 , H05K3/4611 , H05K2201/0187 , H05K2201/0355 , H05K2201/0715 , H05K2201/09127 , H05K2203/0228
摘要： According to one embodiment, a printed wiring board includes a first layer, a flexible sheet member disposed at a part on a surface of the first layer, and a second layer which is disposed on the first layer and the flexible sheet member, a part of the second layer which corresponds to the flexible sheet member including an opening region.
摘要翻译：根据一个实施例，印刷电路板包括第一层，设置在第一层的表面上的一部分的柔性片构件，以及设置在第一层和柔性片构件上的第二层，所述第二层对应于包括开口区域的柔性片构件。

6. 发明申请

US20070200232A1 Printed-wiring board with built-in component, manufacturing method of printed-wiring board with built-in component, and electronic device 审中-公开
标题翻译：具有内置元件的印刷电路板，具有内置元件的印刷电路板的制造方法和电子设备
公开(公告)号：US20070200232A1
公开(公告)日：2007-08-30
申请号：US11711558
申请日：2007-02-27
申请人： Daigo Suzuki , Akihiko Happoya , Jun Karasawa , Hidenori Tanaka
发明人： Daigo Suzuki , Akihiko Happoya , Jun Karasawa , Hidenori Tanaka
IPC分类号： H01L23/34
CPC分类号： H05K1/186 , H01L23/50 , H01L23/5389 , H01L23/642 , H01L25/16 , H01L2224/82039 , H01L2924/01019 , H01L2924/01078 , H05K3/4626 , H05K3/4652 , H05K3/4655 , H05K3/4691 , H05K2201/0195 , H05K2201/10636 , Y02P70/611
摘要： According to one embodiment, there is provided a printed-wiring board with a built-in component including a first base material including a pattern forming surface on which a plurality of conductive patterns are formed. A circuit component is mounted on the pattern forming surface of the first base material, and is connected to the conductive patterns of the first base material. A filling material is stacked on the pattern forming surface of the first base material, and fills in a gap between the circuit component and the pattern forming surface. A second base material is stacked on the pattern forming surface of the first base material by interposing the filling material between the pattern forming surface and the second base material.
摘要翻译：根据一个实施例，提供了一种具有内置部件的印刷电路板，该内置部件包括第一基材，该第一基材包括形成有多个导电图案的图案形成表面。电路部件安装在第一基材的图案形成表面上，并连接到第一基材的导电图案。填充材料堆叠在第一基材的图案形成表面上，并且填充在电路部件和图案形成表面之间的间隙中。第二基材通过在图案形成表面和第二基材之间插入填充材料而堆叠在第一基材的图案形成表面上。

7. 发明申请

US20070099449A1 Printed circuit board, electronic device, and manufacturing method for printed circuit board 失效
标题翻译：印刷电路板，电子设备和印刷电路板的制造方法
公开(公告)号：US20070099449A1
公开(公告)日：2007-05-03
申请号：US11589332
申请日：2006-10-30
申请人： Daigo Suzuki , Akihiko Happoya , Hidenori Tanaka
发明人： Daigo Suzuki , Akihiko Happoya , Hidenori Tanaka
IPC分类号： H01R12/00
CPC分类号： H01L24/11 , H01L24/742 , H01L24/81 , H01L2224/1131 , H01L2224/13099 , H01L2224/13144 , H01L2224/16237 , H01L2224/81121 , H01L2224/81136 , H01L2224/81203 , H01L2224/81801 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/14 , H01L2924/19041 , H01L2924/19043 , H05K1/0269 , H05K1/112 , H05K1/186 , H05K3/303 , H05K3/4623 , H05K2201/09472 , H05K2201/09509 , H05K2201/09527 , H05K2201/10674 , H05K2203/166
摘要： According to one embodiment, a printed circuit board includes a first dielectric layer, a circuit component mounted on the first dielectric layer, and a second dielectric layer. The first dielectric layer is provided with a via hole which opens at a surface thereof and in which a conductive layer is provided, and a conductive pattern connected electrically to the conductive layer of the via hole. The circuit component is provided with a bump at least a part of which is inserted in the via hole and bonded to an inner surface of the via hole. The second dielectric layer is formed provided with another conductive pattern and laminated to the first dielectric layer to cover the circuit component.
摘要翻译：根据一个实施例，印刷电路板包括第一电介质层，安装在第一电介质层上的电路部件和第二电介质层。第一介电层设置有在其表面开口并且其中设置有导电层的通孔以及与通孔的导电层电连接的导电图案。电路部件设置有凸块，其中至少一部分插入通孔中并结合到通孔的内表面。第二电介质层被形成为设置有另一个导电图案并层压到第一电介质层以覆盖电路部件。

8. 发明授权

US08618723B2 Luminaire 失效
标题翻译：灯具
公开(公告)号：US08618723B2
公开(公告)日：2013-12-31
申请号：US13602055
申请日：2012-08-31
申请人： Makoto Sakai , Takumi Suwa , Shinji Nakata , Michinobu Inoue , Izuru Komatsu , Daigo Suzuki , Kumiko Ioka , Kazuki Tateyama , Yasuhide Okada
发明人： Makoto Sakai , Takumi Suwa , Shinji Nakata , Michinobu Inoue , Izuru Komatsu , Daigo Suzuki , Kumiko Ioka , Kazuki Tateyama , Yasuhide Okada
IPC分类号： H01J1/02
CPC分类号： F21V29/004 , F21K9/135 , F21K9/232 , F21K9/60 , F21V29/503 , F21V29/506 , F21Y2115/10
摘要： A luminaire according to embodiments includes a body portion, a light source provided at one end portion of the body portion and having a light-emitting element, a globe provided so as to cover the light source, and a thermal transfer portion thermally joined to at least either one of the globe or a thermal radiating surface of the body portion on the end portion side. Then, an end surface of the thermal transfer portion on the side of the globe is exposed from the globe.
摘要翻译：根据实施例的照明装置包括主体部分，设置在主体部分的一个端部处并具有发光元件的光源，设置成覆盖光源的灯罩，以及热接合到至少球体中的任一个或主体部分的端部侧的热辐射表面。然后，在球体侧的热转印部分的端面从球体露出。

9. 发明授权

US08593820B2 Flexible printed wiring board and electronic apparatus 有权
标题翻译：柔性印刷线路板和电子设备
公开(公告)号：US08593820B2
公开(公告)日：2013-11-26
申请号：US13016568
申请日：2011-01-28
申请人： Daigo Suzuki , Gen Fukaya
发明人： Daigo Suzuki , Gen Fukaya
IPC分类号： H05K1/00
CPC分类号： H05K1/0281 , H05K1/148
摘要： According to one embodiment, the flexible printed wiring board of the one embodiment has a base, corrugated portion, and block. The base has therein a conductor that electrically connects a first end and a second end. The corrugated portion is formed in a middle part of the base and has a ridge and legs. The ridge is roundly bent. The legs continuously hang from opposite sides of the ridge. The block is located off the ridge within a gap where the legs face each other and is mounted on one of the legs.
摘要翻译：根据一个实施例，一个实施例的柔性印刷布线板具有底部，波纹部分和块体。基座中具有电连接第一端和第二端的导体。波纹部分形成在基部的中部，并具有脊和腿。山脊圆形弯曲。腿从脊的相对侧连续悬挂。该块位于腿部彼此面对的间隙内，并且安装在腿部之一中。

10. 发明申请

US20130063942A1 LUMINAIRE 失效
公开(公告)号：US20130063942A1
公开(公告)日：2013-03-14
申请号：US13602055
申请日：2012-08-31
申请人： Makoto SAKAI , Takumi Suwa , Shinji Nakata , Michinobu Inoue , Izuru Komatsu , Daigo Suzuki , Kumiko Ioka , Kazuki Tateyama , Yasuhide Okada
发明人： Makoto SAKAI , Takumi Suwa , Shinji Nakata , Michinobu Inoue , Izuru Komatsu , Daigo Suzuki , Kumiko Ioka , Kazuki Tateyama , Yasuhide Okada
IPC分类号： F21V7/20 , F21V29/00 , F21V3/00
CPC分类号： F21V29/004 , F21K9/135 , F21K9/232 , F21K9/60 , F21V29/503 , F21V29/506 , F21Y2115/10
摘要： A luminaire according to embodiments includes a body portion, a light source provided at one end portion of the body portion and having a light-emitting element, a globe provided so as to cover the light source, and a thermal transfer portion thermally joined to at least either one of the globe or a thermal radiating surface of the body portion on the end portion side. Then, an end surface of the thermal transfer portion on the side of the globe is exposed from the globe.
摘要翻译：根据实施例的照明装置包括主体部分，设置在主体部分的一个端部处并具有发光元件的光源，设置成覆盖光源的灯罩，以及热接合到至少球体中的任一个或主体部分的端部侧的热辐射表面。然后，在球体侧的热转印部分的端面从球体露出。

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