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1. 发明公开

US20230295627A1 Novel Replicase Cycling Reaction (RCR) and the Related SamRNA Designs Thereof 审中-公开
公开(公告)号：US20230295627A1
公开(公告)日：2023-09-21
申请号：US18156231
申请日：2023-01-18
申请人： Shi-Lung Lin , Sam Lin , Chun-Hung Lin
发明人： Shi-Lung Lin , Sam Lin , Chun-Hung Lin
IPC分类号： C12N15/113 , C12N9/12 , C12Q1/686
CPC分类号： C12N15/113 , C12N9/127 , C12Q1/686 , C12N2310/141 , C12Y207/07048
摘要： This invention generally relates to a novel composition of RNA/mRNA medicines as well as vaccines produced by using replicase- and/or RNA-dependent RNA polymerase (RdRp)-mediated RNA cycling reaction (RCR). The present invention is useful for developing a variety of self-amplifying RNA/mRNA (samRNA) medicines and vaccines containing at least a replicase/RdRp-binding site in the 5′- or 3′-end, or both, of any desired RNA molecule, including but not limited to antisense RNA (aRNA), small interferring RNA (siRNA), short hairpin RNA (shRNA), microRNA (miRNA)/miRNA precursor, long non-coding RNA (lnRNA) and mRNA. These RNA molecules can be either in single-stranded or in double-stranded, or mixed, conformation. The samRNA so obtained is useful not only for producing RNA-based vaccines and/or medicines but also for generating the mRNA-associated proteins, peptides, and/or antibodies under a proper in-vitro or in-cell translation condition. The replicase/RdRp-binding sites used in samRNA are derived or modified from coronaviral (e.g. COVID-19) and/or hepatitis C viral (HCV) RNA-dependent RNA polymerases (RdRp) in either single-stranded or double-stranded compositions.

2. 发明申请

US20220411848A1 Novel Replicase Cycling Reaction (RCR) 有权
公开(公告)号：US20220411848A1
公开(公告)日：2022-12-29
申请号：US17648336
申请日：2022-01-19
申请人： Shi-Lung LIN , Sam LIN , Chun-Hung LIN
发明人： Shi-Lung LIN , Sam LIN , Chun-Hung LIN
IPC分类号： C12Q1/686 , C12N9/12
摘要： This invention generally relates to a novel RNA/mRNA production and amplification method using viral RNA replicase and/or RNA-dependent RNA polymerase (RdRp) enzymes as well as the associated mRNAs thereof. The present invention can be used for manufacturing and amplifying all varieties of RNA/mRNA sequences carrying at least an RdRp-binding site in the 5′- or 3′-end, or both. The RNA/mRNA so obtained is useful for not only producing mRNA vaccines and/or RNA-based medicines but also for generating the mRNA-associated proteins, peptides, and/or antibodies under an in-vitro as well as in-cell translation condition. Principally, the present invention is a novel RNA replicase-mediated RNA/mRNA amplification method, namely Replicase Cycling Reaction (RCR). The RNA replicases involved in RCR include but not limited to viral and/or bacteriophage RNA-dependent RNA polymerases (RdRp), particularly coronaviral and hepatitis C viral (HCV) RdRp enzymes.

3. 发明申请

US20220396778A1 Novel RNA Composition and Production Method for Use in iPS Cell Generation 有权
公开(公告)号：US20220396778A1
公开(公告)日：2022-12-15
申请号：US17648340
申请日：2022-01-19
申请人： Shi-Lung LIN , Sam LIN , Chun-Hung LIN
发明人： Shi-Lung LIN , Sam LIN , Chun-Hung LIN
IPC分类号： C12N5/074 , C12N15/113 , C12N9/12 , A61K31/713 , A61K38/45
摘要： This invention generally relates to a novel RNA composition and its production method useful for generating and expanding induced pluripotent stem cells (iPS cells; iPSC) as well as adult stem cells (ASC). The RNA composition so defined can be used for producing not only non-transgenic but also tumor-free iPS cells. The defined RNA composition contans at least two types of different RNA constructs; one is “miR-302 precursor RNA (pre-miR-302)” and the other is “RNA-dependent RNA polymerase (RdRp)” mRNA. Both of pre-miR-302 and RdRp mRNA contain highly structured RNA comformations, such as hairpin and stem-loop structures. To produce highly structured RNAs, a novel PCR-IVT methodology has been developed and used with a specially designed RNA polymerase-helicase mixture activity.

4. 发明授权

US09502360B2 Stress compensation layer for 3D packaging 有权
标题翻译：应力补偿层用于3D包装
公开(公告)号：US09502360B2
公开(公告)日：2016-11-22
申请号：US13348449
申请日：2012-01-11
申请人： Chun-Hung Lin , Yu-Feng Chen , Han-Ping Pu , Hung-Jui Kuo
发明人： Chun-Hung Lin , Yu-Feng Chen , Han-Ping Pu , Hung-Jui Kuo
IPC分类号： H01L23/52 , H01L23/00 , H01L25/10 , H01L23/31 , H01L21/56 , H01L23/498
CPC分类号： H01L23/562 , H01L21/565 , H01L23/3121 , H01L23/3128 , H01L23/49822 , H01L25/105 , H01L2224/16225 , H01L2225/1023 , H01L2225/1058 , H01L2924/01322 , H01L2924/15311 , H01L2924/15321 , H01L2924/18161 , H01L2924/3511 , H01L2924/00
摘要： A stress compensation for use in packaging, and a method of forming, is provided. The stress compensation layer is placed on an opposing side of a substrate from an integrated circuit die. The stress compensation layer is designed to counteract at least some of the stress exerted structures on the die side of the substrate, such as stresses exerted by a molding compound that at least partially encapsulates the first integrated circuit die. A package may also be electrically coupled to the substrate.
摘要翻译：提供了用于包装的应力补偿，以及形成方法。应力补偿层从集成电路管芯放置在衬底的相对侧上。应力补偿层被设计成抵抗基板的模具侧上的应力施加结构中的至少一些，例如由至少部分地封装第一集成电路管芯的模制化合物施加的应力。封装还可以电耦合到衬底。

5. 发明授权

US09418947B2 Mechanisms for forming connectors with a molding compound for package on package 有权
标题翻译：用于在包装上封装的模塑料形成连接器的机构
公开(公告)号：US09418947B2
公开(公告)日：2016-08-16
申请号：US13406031
申请日：2012-02-27
申请人： Yu-Feng Chen , Chun-Hung Lin , Han-Ping Pu , Ming-Da Cheng , Kai-Chiang Wu
发明人： Yu-Feng Chen , Chun-Hung Lin , Han-Ping Pu , Ming-Da Cheng , Kai-Chiang Wu
IPC分类号： H01L23/48 , H01L23/00 , H01L25/10 , H01L23/498
CPC分类号： H01L25/0657 , H01L21/565 , H01L23/3107 , H01L23/49816 , H01L23/562 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/81 , H01L25/105 , H01L25/50 , H01L2224/03334 , H01L2224/0384 , H01L2224/0391 , H01L2224/0401 , H01L2224/05075 , H01L2224/05147 , H01L2224/05166 , H01L2224/05181 , H01L2224/05571 , H01L2224/06181 , H01L2224/11334 , H01L2224/1184 , H01L2224/1191 , H01L2224/13005 , H01L2224/13012 , H01L2224/13013 , H01L2224/13014 , H01L2224/13022 , H01L2224/13023 , H01L2224/13078 , H01L2224/131 , H01L2224/13111 , H01L2224/13113 , H01L2224/13116 , H01L2224/13139 , H01L2224/13147 , H01L2224/13155 , H01L2224/16145 , H01L2224/16147 , H01L2224/16225 , H01L2224/17181 , H01L2224/32145 , H01L2224/73204 , H01L2224/81191 , H01L2224/81193 , H01L2224/81815 , H01L2225/06513 , H01L2225/06517 , H01L2225/1023 , H01L2225/1058 , H01L2225/1088 , H01L2924/00014 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/12042 , H01L2924/1305 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/00012 , H01L2924/207 , H01L2924/206 , H01L2924/00 , H01L2224/05552
摘要： The described embodiments of mechanisms of forming connectors for package on package enable smaller connectors with finer pitch, which allow smaller package size and additional connections. The conductive elements on one package are partially embedded in the molding compound of the package to bond with contacts or metal pads on another package. By embedding the conductive elements, the conductive elements may be made smaller and there are is gaps between the conductive elements and the molding compound. A pitch of the connectors can be determined by adding a space margin to a maximum width of the connectors. Various types of contacts on the other package can be bonded to the conductive elements.
摘要翻译：所描述的形成用于封装封装的连接器的机构的实施例使得具有更细间距的较小连接器能够实现更小的封装尺寸和附加的连接。一个封装上的导电元件部分地嵌入封装的模制化合物中，以与另一封装上的触点或金属焊盘结合。通过嵌入导电元件，可以使导电元件更小，并且在导电元件和模塑料之间存在间隙。可以通过将连接器的最大宽度添加空间余量来确定连接器的间距。另一个封装上的各种类型的触点可以结合到导电元件上。

6. 发明授权

US08510564B2 Automatic configuration and continuation of federation relationships 有权
标题翻译：自动配置和继续联盟关系
公开(公告)号：US08510564B2
公开(公告)日：2013-08-13
申请号：US12852209
申请日：2010-08-06
申请人： David J. Nicholson , David Lewis Fisher , Michael D. Ritche , Chun-Hung Lin , Christopher B. Dove , Kavitha Radhakrishnan
发明人： David J. Nicholson , David Lewis Fisher , Michael D. Ritche , Chun-Hung Lin , Christopher B. Dove , Kavitha Radhakrishnan
IPC分类号： H04L9/32
CPC分类号： H04L63/0815 , H04L63/0876 , H04L63/126
摘要： Embodiments are directed to establishing the integrity of a portion of data on at least one level of a plurality of network stack levels and automatically continuing an established federation relationship between at least two federation computer systems. In an embodiment, a first federation computer system receives a digital signature corresponding to a computer system signed by a digital signature which includes the computer system's identity and other federation relationship information configured to establish a trusted federation relationship between a first federation computer system and a second federation computer system. The first federation computer system attempts to validate the received digital signature at a first level of a network stack and determines that the validation at the first network stack layer was unsuccessful. The first federation computer system then validates the received digital signature at a second, different level of the network stack.
摘要翻译：实施例涉及在多个网络堆栈级别的至少一个级别上建立数据的一部分的完整性，并且自动地在至少两个联合计算机系统之间继续建立的联合关系。在一个实施例中，第一联合计算机系统接收与由数字签名签名的计算机系统相对应的数字签名，数字签名包括计算机系统的身份和其他联合关系信息，其被配置为在第一联合计算机系统和第二联合计算机系统之间建立信任的联合关系联合计算机系统。第一联合计算机系统尝试在网络堆栈的第一级验证接收到的数字签名，并确定第一网络堆栈层的验证不成功。第一联合计算机系统然后在网络堆栈的第二个不同级别验证所接收的数字签名。

7. 发明申请

US20130048248A1 HEAT PIPE MANUFACTURING METHOD AND HEAT PIPE THEREOF 审中-公开
标题翻译：热管制造方法及其热管
公开(公告)号：US20130048248A1
公开(公告)日：2013-02-28
申请号：US13218424
申请日：2011-08-25
申请人： Chun-Hung Lin , Han-Lin Chen , Chang-Yin Chen
发明人： Chun-Hung Lin , Han-Lin Chen , Chang-Yin Chen
IPC分类号： F28D15/04 , B21D53/02
CPC分类号： B21C37/154 , B21C37/16 , F28D15/0233 , F28D15/046 , Y10T29/49353
摘要： A heat pipe includes a step pipe, a mesh, and a supporting component. The step pipe has an evaporating section and two condensing sections. The condensing sections are on the two ends of the step pipe, respectively. The evaporating section lies between the two condensing sections. The inner spaces of the two condensing sections and the evaporating section are interconnected. The peripheral dimension of the evaporating section is larger than the peripheral dimension of each of the condensing sections. The mesh is contained in the step pipe and located inside the evaporating section. The supporting component is contained in the step pipe and wrapped in the mesh. The combination of these structures increases air's flow rate inside the heat pipe and improves the heat pipe's heat conduction efficiency.
摘要翻译：热管包括台阶管，网和支撑构件。步进管具有蒸发段和两个冷凝段。冷凝段分别位于台阶管的两端。蒸发部分位于两个冷凝部分之间。两个冷凝部分和蒸发部分的内部空间相互连接。蒸发部分的周边尺寸大于每个冷凝部分的周边尺寸。网状物包含在台阶管中，位于蒸发段内。支撑部件包含在台阶管中并包裹在网中。这些结构的组合增加了热管内空气的流量，提高了热管的热传导效率。

8. 发明申请

US20120288981A1 METHOD OF MANUFACTURING SOLAR CELL WITH TWO EXPOSED SURFACES OF ARC LAYER DISPOED AT DIFFERENT LEVELS 有权
标题翻译：在不同水平上制造具有两层暴露的ARC层的太阳能电池的方法
公开(公告)号：US20120288981A1
公开(公告)日：2012-11-15
申请号：US13549814
申请日：2012-07-16
申请人： Sheng Yung Liu , Chin-Tien Yang , Chun-Hung Lin
发明人： Sheng Yung Liu , Chin-Tien Yang , Chun-Hung Lin
IPC分类号： H01L31/18
CPC分类号： H01L31/022433 , H01L31/02168 , Y02E10/50 , Y02E10/52
摘要： A method of manufacturing a solar cell includes the steps of: providing a substrate having a front side, a back side and a doped region; forming a conductor layer on the front side; firing the conductor layer at a temperature such that the conductor layer is formed with a first portion embedded into the doped region and a second portion other than the first portion; forming an anti-reflection coating (ARC) layer on the front side and the second portion, wherein the ARC layer covers the conductor layer so that the second portion of the conductor layer is disposed in the ARC layer; and removing the ARC layer on the conductor layer so that the conductor layer has an exposed surface exposed out of the ARC layer, wherein the exposed surface of the conductor layer is substantially flush with a first exposed surface of the ARC layer.
摘要翻译：一种制造太阳能电池的方法包括以下步骤：提供具有正面，背面和掺杂区域的基板; 在前侧形成导体层; 在使得导体层形成有嵌入掺杂区域的第一部分和除了第一部分之外的第二部分的温度下烧制导体层; 在前侧和第二部分形成防反射涂层（ARC）层，其中ARC层覆盖导体层，使得导体层的第二部分设置在ARC层中; 以及去除所述导体层上的所述ARC层，使得所述导体层具有暴露在所述ARC层外部的暴露表面，其中所述导体层的所述暴露表面基本上与所述ARC层的第一暴露表面齐平。

9. 发明申请

US20120282724A1 METHOD OF MANUFACTURING SOLAR CELL WITH UPPER AND LOWER CONDUCTOR LAYERS STACKED TOGETHER 有权
标题翻译：制造太阳能电池的方法与上层和下层导体层堆叠在一起
公开(公告)号：US20120282724A1
公开(公告)日：2012-11-08
申请号：US13549877
申请日：2012-07-16
申请人： SHEN YUNG LIU , CHIN-TIEN YANG , CHUN-HUNG LIN
发明人： SHEN YUNG LIU , CHIN-TIEN YANG , CHUN-HUNG LIN
IPC分类号： H01L31/18
CPC分类号： H01L31/022433 , H01L31/02168 , Y02E10/50 , Y02E10/52
摘要： A method of manufacturing a solar cell comprises the steps of: forming a lower conductor layer on a front side of a substrate; firing the lower conductor layer at a first temperature to form a first portion embedded into a doped region of the substrate and a second portion; forming an anti-reflection coating (ARC) layer on the front side and the second portion, wherein the ARC layer covers the lower conductor layer such that the second portion is disposed in the ARC layer; forming an upper conductor layer, corresponding to the lower conductor layer and electrically connected to the lower conductor layer, on the ARC layer; and firing the upper conductor layer at a second temperature to form a first portion embedded into the ARC layer and a second portion, which is exposed out of the ARC layer.
摘要翻译：一种制造太阳能电池的方法包括以下步骤：在基板的正面形成下导体层; 在第一温度下焙烧下导体层以形成嵌入衬底的掺杂区域中的第一部分和第二部分; 在前侧和第二部分形成防反射涂层（ARC）层，其中ARC层覆盖下导体层，使得第二部分设置在ARC层中; 在ARC层上形成对应于下导体层并电连接到下导体层的上导体层; 以及在第二温度下烧制所述上导体层以形成嵌入到所述ARC层中的第一部分和暴露在所述ARC层外的第二部分。

10. 发明授权

US08199314B2 System and method for improving immersion scanner overlay performance 有权
标题翻译：提高浸没式扫描仪覆盖性能的系统和方法
公开(公告)号：US08199314B2
公开(公告)日：2012-06-12
申请号：US13288133
申请日：2011-11-03
申请人： Jui-Chung Peng , Tzung-Chi Fu , Chin-Hsiang Lin , Chien-Hsun Lin , Chun-Hung Lin , Yao-Wen Guo , Shy-Jay Lin , Heng-Hsin Liu
发明人： Jui-Chung Peng , Tzung-Chi Fu , Chin-Hsiang Lin , Chien-Hsun Lin , Chun-Hung Lin , Yao-Wen Guo , Shy-Jay Lin , Heng-Hsin Liu
IPC分类号： G03B27/52 , G03B27/58 , G03B27/60 , G03B27/68 , G03B27/42 , G03B27/32
CPC分类号： G03F7/70875 , G03F7/70341 , G03F7/70783
摘要： System and method for improving immersion scanner overlay performance are described. One embodiment is a method of improving overlay performance of an photolithography immersion scanner including a wafer table having lens cooling water (“LCW”) disposed in a water channel therein, the wafer table having an input for receiving the LCW into the water channel and an output for expelling the LCW from the water channel. The method includes providing a water tank that connects to at least one of the wafer table input and the wafer table output; monitoring a pressure of water in the water tank; and maintaining the pressure of the water in the water tank at a predetermined level.
摘要翻译：描述了用于提高浸没式扫描仪覆盖性能的系统和方法。一个实施例是一种提高光刻浸没扫描仪的覆盖性能的方法，该扫描仪包括设置在其中的水通道中的具有透镜冷却水（“LCW”）的晶片台，晶片台具有用于将LCW接收到水通道中的输入端，输出用于从水道排出LCW。该方法包括：提供连接到晶片台输入和晶片台输出中的至少一个的水箱; 监测水箱内的水压; 并且将水箱中的水的压力保持在预定水平。

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