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1. 发明申请

US20110045577A1 Fabrication of conductive pathways, microcircuits and microstructures in microfluidic networks 有权
标题翻译：微流控网络中导电通路，微电路和微结构的制作
公开(公告)号：US20110045577A1
公开(公告)日：2011-02-24
申请号：US11920483
申请日：2006-05-18
申请人： Derek A. Bruzewicz , Mila Boncheva-Bettex , George M. Whitesides , Adam Siegel , Douglas B. Weibel , Sergey S. Shevkoplyas , Andres Martinez
发明人： Derek A. Bruzewicz , Mila Boncheva-Bettex , George M. Whitesides , Adam Siegel , Douglas B. Weibel , Sergey S. Shevkoplyas , Andres Martinez
IPC分类号： C12M1/00 , G01N33/00 , H01R43/00
CPC分类号： H05K3/101 , B01L3/5027 , B01L3/502707 , B01L2200/12 , B01L2300/0645 , B01L2300/0816 , B01L2300/0874 , B01L2400/0415 , B33Y80/00 , H05K1/0272 , H05K1/032 , H05K3/389 , H05K2201/0162 , H05K2201/0305 , H05K2203/128 , Y10T29/49117
摘要： Disclosed herein are a variety of microfluidic devices and solid, typically electrically conductive devices that can be formed using such devices as molds. In certain embodiments, the devices that are formed comprise conductive pathways formed by solidifying a liquid metal present in one or more microfluidic channels (such devices hereinafter referred to as “microsolidic” devices). In certain such devices, in which electrical connections can be formed and/or reformed between regions in a microfluidic structure; in some cases, the devices/circuits formed may be flexible and/or involve flexible electrical components. In certain embodiments, the solid metal wires/conductive pathways formed in microfluidic channel(s) may remain contained within the microfluidic structure. In certain such embodiments, the conductive pathways formed may be located in proximity to other microfluidic channel(s) of the structure that carry flowing fluid, such that the conductive pathway can create energy (e.g. electromagnetic and/or thermal energy) that interacts withy and/or affects the flowing fluid and/or a component contained therein or carried thereby. In other embodiments, a microsolidic structure may be removed from a microfluidic mold to form a stand-alone structure. In certain embodiments, the solid metal structures formed may interact with light energy incident upon a structure or may be used to fabricate a light-weight electrode. Another aspect of the invention relates to the formation of self-assembled structures that may comprise these electrically conductive pathways/connections.
摘要翻译：本文公开了各种微流体装置和可以使用诸如模具的装置形成的固体，通常导电的装置。在某些实施方案中，所形成的装置包括通过固化存在于一个或多个微流体通道中的液体金属形成的导电通路（以下称为“微溶体”装置）。在某些这样的器件中，其中可以在微流体结构中的区域之间形成和/或重组电连接; 在一些情况下，形成的器件/电路可以是柔性的和/或涉及柔性电气部件。在某些实施方案中，在微流体通道中形成的固体金属线/导电路径可以保持在微流体结构内。在某些这样的实施例中，所形成的导电路径可以位于结构的其它微流体通道附近，其携带流动的流体，使得导电路径可以产生与其相互作用的能量（例如电磁和/或热能） /或影响流动的流体和/或其中所含的或由其携带的部件。在其它实施方案中，微溶体结构可以从微流体模具中移除以形成独立结构。在某些实施方案中，所形成的固体金属结构可与入射到结构上的光能相互作用，或者可用于制造轻质电极。本发明的另一方面涉及可以包括这些导电路径/连接的自组装结构的形成。

2. 发明授权

US08486833B2 Fabrication of conductive pathways, microcircuits and microstructures in microfluidic networks 有权
标题翻译：微流控网络中导电通路，微电路和微结构的制作
公开(公告)号：US08486833B2
公开(公告)日：2013-07-16
申请号：US11920483
申请日：2006-05-18
申请人： Derek A. Bruzewicz , Mila Boncheva-Bettex , George M. Whitesides , Adam Siegel , Douglas B. Weibel , Sergey S. Shevkoplyas , Andres Martinez
发明人： Derek A. Bruzewicz , Mila Boncheva-Bettex , George M. Whitesides , Adam Siegel , Douglas B. Weibel , Sergey S. Shevkoplyas , Andres Martinez
IPC分类号： H01L21/44 , H01L21/4763
CPC分类号： H05K3/101 , B01L3/5027 , B01L3/502707 , B01L2200/12 , B01L2300/0645 , B01L2300/0816 , B01L2300/0874 , B01L2400/0415 , B33Y80/00 , H05K1/0272 , H05K1/032 , H05K3/389 , H05K2201/0162 , H05K2201/0305 , H05K2203/128 , Y10T29/49117
摘要： Disclosed herein are a variety of microfluidic devices and solid, typically electrically conductive devices that can be formed using such devices as molds. In certain embodiments, the devices that are formed comprise conductive pathways formed by solidifying a liquid metal present in one or more microfluidic channels (such devices hereinafter referred to as “microsolidic” devices). In certain such devices, in which electrical connections can be formed and/or reformed between regions in a microfluidic structure; in some cases, the devices/circuits formed may be flexible and/or involve flexible electrical components. In certain embodiments, the solid metal wires/conductive pathways formed in microfluidic channel(s) may remain contained within the microfluidic structure. In certain such embodiments, the conductive pathways formed may be located in proximity to other microfluidic channel(s) of the structure that carry flowing fluid, such that the conductive pathway can create energy (e.g. electromagnetic and/or thermal energy) that interacts withy and/or affects the flowing fluid and/or a component contained therein or carried thereby. In other embodiments, a microsolidic structure may be removed from a microfluidic mold to form a stand-alone structure. In certain embodiments, the solid metal structures formed may interact with light energy incident upon a structure or may be used to fabricate a light-weight electrode. Another aspect of the invention relates to the formation of self-assembled structures that may comprise these electrically conductive pathways/connections.
摘要翻译：本文公开了各种微流体装置和可以使用诸如模具的装置形成的固体，通常导电的装置。在某些实施方案中，所形成的装置包括通过固化存在于一个或多个微流体通道中的液体金属形成的导电通路（以下称为“微溶体”装置）。在某些这样的器件中，其中可以在微流体结构中的区域之间形成和/或重组电连接; 在一些情况下，形成的器件/电路可以是柔性的和/或涉及柔性电气部件。在某些实施方案中，在微流体通道中形成的固体金属线/导电路径可以保持在微流体结构内。在某些这样的实施例中，所形成的导电路径可以位于结构的其它微流体通道附近，其携带流动的流体，使得导电路径可以产生与其相互作用的能量（例如电磁和/或热能） /或影响流动的流体和/或其中所含的或由其携带的部件。在其它实施方案中，微溶体结构可以从微流体模具中移除以形成独立结构。在某些实施方案中，所形成的固体金属结构可与入射到结构上的光能相互作用，或者可用于制造轻质电极。本发明的另一方面涉及可以包括这些导电路径/连接的自组装结构的形成。

3. 发明专利

BG42597A1 SOLVENT FOR SURFACE STRUCTURISATION 未知
公开(公告)号：BG42597A1
公开(公告)日：1988-01-15
申请号：BG7640786
申请日：1986-09-15
申请人： DONCHEVA NADKA D , JANKULOV VENCESLAV G , IVANCHEVA TINKA L , PETROVA NEDJALKA N , BONCHEVA EMILIJA N
发明人： DONCHEVA NADKA D , JANKULOV VENCESLAV G , IVANCHEVA TINKA L , PETROVA NEDJALKA N , BONCHEVA EMILIJA N
IPC分类号： C08L61/00

4. 发明申请

WO2007061448A3 FABRICATION OF CONDUCTIVE PATHWAYS, MICROCIRCUITS AND MICROSTRUCTURES IN MICROFLUIDIC NETWORKS 审中-公开
标题翻译：微流控网络中导电路径，微型计算机和微结构的制造
公开(公告)号：WO2007061448A3
公开(公告)日：2008-08-28
申请号：PCT/US2006019787
申请日：2006-05-18
申请人： HARVARD COLLEGE , BRUZEWICZ DEREK A , BONCHEVA-BETTEX MILA , WHITESIDES GEORGE M , SIEGEL ADAM , WEIBEL DOUGLAS B , SHEVKOPLYAS SERGEY , MARTINEZ ANDRES
发明人： BRUZEWICZ DEREK A , BONCHEVA-BETTEX MILA , WHITESIDES GEORGE M , SIEGEL ADAM , WEIBEL DOUGLAS B , SHEVKOPLYAS SERGEY , MARTINEZ ANDRES
IPC分类号： H05K3/10 , B01F13/00 , B01L3/00 , B29C39/12
CPC分类号： H05K3/101 , B01L3/5027 , B01L3/502707 , B01L2200/12 , B01L2300/0645 , B01L2300/0816 , B01L2300/0874 , B01L2400/0415 , B33Y80/00 , H05K1/0272 , H05K1/032 , H05K3/389 , H05K2201/0162 , H05K2201/0305 , H05K2203/128 , Y10T29/49117
摘要： Disclosed herein are a variety of microfluidic devices and solid, typically electrically conductive devices that can be formed using such devices as molds. In certain embodiments, the devices that are formed comprise conductive pathways formed by solidifying a liquid metal present in one or more microfluidic channels (such devices hereinafter referred to as "microsolidic" devices). In certain such devices, in which electrical connections can be formed and/or reformed between regions in a microfluidic structure; in some cases, the devices/circuits formed may be flexible and/or involve flexible electrical components. In certain embodiments, the solid metal wires/conductive pathways formed in microfluidic channel(s) may remain contained within the microfluidic structure. In certain such embodiments, the conductive pathways formed may be located in proximity to other microfluidic channel(s) of the structure that carry flowing fluid, such that the conductive pathway can create energy (e.g. electromagnetic and/or thermal energy) that interacts withy and/or affects the flowing fluid and/or a component contained therein or carried thereby. In other embodiments, a microsolidic structure may be removed from a microfluidic mold to form a stand-alone structure. In certain embodiments, the solid metal structures formed may interact with light energy incident upon a structure or may be used to fabricate a light-weight electrode. Another aspect of the invention relates to the formation of self-assembled structures that may comprise these electrically conductive pathways/connections.
摘要翻译：本文公开了各种微流体装置和可以使用诸如模具的装置形成的固体，通常导电的装置。在某些实施方案中，形成的装置包括通过固化存在于一个或多个微流体通道（这种装置在下文中称为“微溶体”装置）中的液态金属形成的导电通路。在某些这样的装置中，其中可以在微流体结构的区域之间形成和/或重组电连接; 在一些情况下，所形成的器件/电路可能是柔性的和/或涉及柔性电气部件。在某些实施方案中，在微流体通道中形成的固体金属线/导电路径可以保持在微流体结构内。在某些这样的实施例中，所形成的导电路径可以位于结构的其它微流体通道附近，其携带流动的流体，使得导电路径可以产生与...相互作用的能量（例如电磁和/或热能） /或影响流动的流体和/或其中所含的或由其携带的部件。在其它实施方案中，微溶体结构可以从微流体模具中移除以形成独立结构。在某些实施方案中，形成的固体金属结构可与入射到结构上的光能相互作用，或者可用于制造轻质电极。本发明的另一方面涉及可以包括这些导电路径/连接的自组装结构的形成。

5. 发明申请

WO2007061448A2 FABRICATION OF CONDUCTIVE PATHWAYS, MICROCIRCUITS AND MICROSTRUCTURES IN MICROFLUIDIC NETWORKS 审中-公开
标题翻译：微流控网络中导电通路，微环境和微结构的制作
公开(公告)号：WO2007061448A2
公开(公告)日：2007-05-31
申请号：PCT/US2006/019787
申请日：2006-05-18
申请人： PRESIDENT AND FELLOWS OF HARVARD COLLEGE , BRUZEWICZ, Derek, A. , BONCHEVA-BETTEX, Mila , WHITESIDES, George, M. , SIEGEL, Adam , WEIBEL, Douglas, B. , SHEVKOPLYAS, Sergey , MARTINEZ, Andres
发明人： BRUZEWICZ, Derek, A. , BONCHEVA-BETTEX, Mila , WHITESIDES, George, M. , SIEGEL, Adam , WEIBEL, Douglas, B. , SHEVKOPLYAS, Sergey , MARTINEZ, Andres
IPC分类号： H05K3/10
CPC分类号： H05K3/101 , B01L3/5027 , B01L3/502707 , B01L2200/12 , B01L2300/0645 , B01L2300/0816 , B01L2300/0874 , B01L2400/0415 , B33Y80/00 , H05K1/0272 , H05K1/032 , H05K3/389 , H05K2201/0162 , H05K2201/0305 , H05K2203/128 , Y10T29/49117
摘要： Disclosed herein are a variety of microfluidic devices and solid, typically electrically conductive devices that can be formed using such devices as molds. In certain embodiments, the devices that are formed comprise conductive pathways formed by solidifying a liquid metal present in one or more microfluidic channels (such devices hereinafter referred to as "microsolidic" devices). In certain such devices, in which electrical connections can be formed and/or reformed between regions in a microfluidic structure; in some cases, the devices/circuits formed may be flexible and/or involve flexible electrical components. In certain embodiments, the solid metal wires/conductive pathways formed in microfluidic channel(s) may remain contained within the microfluidic structure. In certain such embodiments, the conductive pathways formed may be located in proximity to other microfluidic channel(s) of the structure that carry flowing fluid, such that the conductive pathway can create energy (e.g. electromagnetic and/or thermal energy) that interacts withy and/or affects the flowing fluid and/or a component contained therein or carried thereby. In other embodiments, a microsolidic structure may be removed from a microfluidic mold to form a stand-alone structure. In certain embodiments, the solid metal structures formed may interact with light energy incident upon a structure or may be used to fabricate a light-weight electrode. Another aspect of the invention relates to the formation of self-assembled structures that may comprise these electrically conductive pathways/connections.
摘要翻译：这里公开了各种微流体装置和固体，典型地导电装置，其可以使用诸如模具的装置形成。在某些实施例中，形成的器件包括通过凝固存在于一个或多个微流体通道中的液态金属（以下称为“微型固态”器件）形成的导电通路。在某些这样的装置中，其中可以在微流体结构中的区域之间形成和/或重新形成电连接; 在一些情况下，形成的器件/电路可以是柔性的和/或涉及柔性电子部件。在某些实施方案中，在微流体通道中形成的固体金属丝/导电通路可保持包含在微流体结构内。在某些这样的实施例中，所形成的导电通路可位于承载流动流体的结构的其他微流体通道附近，使得导电通路可产生与其相互作用的能量（例如电磁能和/或热能），并且 /或影响流动的流体和/或包含在其中或由其承载的组件。在其他实施例中，可以将微观结构从微流体模具移除以形成独立结构。在某些实施方案中，所形成的固体金属结构可与入射在结构上的光能相互作用或可用于制造轻质电极。本发明的另一方面涉及可以包括这些导电通路/连接的自组装结构的形成。

6. 发明申请

WO2007061448A9 FABRICATION OF CONDUCTIVE PATHWAYS, MICROCIRCUITS AND MICROSTRUCTURES IN MICROFLUIDIC NETWORKS 审中-公开
标题翻译：导电路径的制造，微流控网络中的微处理器和微结构
公开(公告)号：WO2007061448A9
公开(公告)日：2007-07-26
申请号：PCT/US2006019787
申请日：2006-05-18
申请人： HARVARD COLLEGE , BRUZEWICZ DEREK A , BONCHEVA-BETTEX MILA , WHITESIDES GEORGE M , SIEGEL ADAM , WEIBEL DOUGLAS B , SHEVKOPLYAS SERGEY , MARTINEZ ANDRES
发明人： BRUZEWICZ DEREK A , BONCHEVA-BETTEX MILA , WHITESIDES GEORGE M , SIEGEL ADAM , WEIBEL DOUGLAS B , SHEVKOPLYAS SERGEY , MARTINEZ ANDRES
IPC分类号： H05K3/10
CPC分类号： H05K3/101 , B01L3/5027 , B01L3/502707 , B01L2200/12 , B01L2300/0645 , B01L2300/0816 , B01L2300/0874 , B01L2400/0415 , B33Y80/00 , H05K1/0272 , H05K1/032 , H05K3/389 , H05K2201/0162 , H05K2201/0305 , H05K2203/128 , Y10T29/49117
摘要： Disclosed herein are a variety of microfluidic devices and solid, typically electrically conductive devices that can be formed using such devices as molds. In certain embodiments, the devices that are formed comprise conductive pathways formed by solidifying a liquid metal present in one or more microfluidic channels (such devices hereinafter referred to as "microsolidic" devices). In certain such devices, in which electrical connections can be formed and/or reformed between regions in a microfluidic structure; in some cases, the devices/circuits formed may be flexible and/or involve flexible electrical components. In certain embodiments, the solid metal wires/conductive pathways formed in microfluidic channel(s) may remain contained within the microfluidic structure. In certain such embodiments, the conductive pathways formed may be located in proximity to other microfluidic channel(s) of the structure that carry flowing fluid, such that the conductive pathway can create energy (e.g. electromagnetic and/or thermal energy) that interacts withy and/or affects the flowing fluid and/or a component contained therein or carried thereby. In other embodiments, a microsolidic structure may be removed from a microfluidic mold to form a stand-alone structure. In certain embodiments, the solid metal structures formed may interact with light energy incident upon a structure or may be used to fabricate a light-weight electrode. Another aspect of the invention relates to the formation of self-assembled structures that may comprise these electrically conductive pathways/connections.
摘要翻译：本文公开了各种微流体装置和可以使用诸如模具的装置形成的固体，通常导电的装置。在某些实施方案中，所形成的装置包括通过固化存在于一个或多个微流体通道中的液体金属形成的导电通路（以下称为“微溶体”装置）。在某些这样的器件中，其中可以在微流体结构中的区域之间形成和/或重组电连接; 在一些情况下，形成的器件/电路可以是柔性的和/或涉及柔性电气部件。在某些实施方案中，在微流体通道中形成的固体金属线/导电路径可以保持在微流体结构内。在某些这样的实施例中，所形成的导电路径可以位于结构的其他微流体通道附近，该流体通道携带流动的流体，使得导电路径可产生与其相互作用的能量（例如电磁和/或热能） /或影响流动的流体和/或其中所含的或由其携带的部件。在其它实施方案中，微溶体结构可以从微流体模具中移除以形成独立结构。在某些实施方案中，所形成的固体金属结构可与入射到结构上的光能相互作用，或者可用于制造轻质电极。本发明的另一方面涉及可以包括这些导电路径/连接的自组装结构的形成。

7. 发明专利

BG36748A1 FLOW- METER FOR LIQUIDS AND GASES 未知
公开(公告)号：BG36748A1
公开(公告)日：1985-01-15
申请号：BG6252283
申请日：1983-10-03
申请人： VASILEV , BONCHEVA MLADENOVA , MILENOV
发明人： VASILEV , BONCHEVA-MLADENOVA , MILENOV
IPC分类号： G01F1/68

8. 发明专利

BG42589A1 ADHESIVE COMPOSITION FOR POLYSTURENE ITEMS 未知
公开(公告)号：BG42589A1
公开(公告)日：1988-01-15
申请号：BG7640586
申请日：1986-09-15
申请人： DONCHEVA NADKA D , JANKULOV VENCESLAV G , IVANCHEVA TINKA L , PETROVA NEDJALKA N , BONCHEVA EMILIJA N
发明人： DONCHEVA NADKA D , JANKULOV VENCESLAV G , IVANCHEVA TINKA L , PETROVA NEDJALKA N , BONCHEVA EMILIJA N
IPC分类号： B29C65/48 , C08J5/12

9. 发明专利

SU1037357A1 METHOD AND APPARATUS FOR ASSEMBLING ELECTROMAGNETIC RELAY COILS 未知
公开(公告)号：SU1037357A1
公开(公告)日：1983-08-23
申请号：SU3387254
申请日：1982-02-02
申请人： CHERNYJ IOSIF S , KOGAN ZINOVIJ R , BONCHEVA LYUDMILA M
发明人： CHERNYJ IOSIF S , KOGAN ZINOVIJ R , BONCHEVA LYUDMILA M
IPC分类号： H01H49/00

10. 发明专利

BG42768A1 REINFORCING COMPOSITION FOR THINNED VACUUM WORK- PIECES 未知
公开(公告)号：BG42768A1
公开(公告)日：1988-02-15
申请号：BG7640686
申请日：1986-09-15
申请人： DONCHEVA NADKA D , JANKULOV VENCESLAV G , IVANCHEVA TINKA L , PETROVA NEDJALKA N , BONCHEVA EMILIJA N
发明人： DONCHEVA NADKA D , JANKULOV VENCESLAV G , IVANCHEVA TINKA L , PETROVA NEDJALKA N , BONCHEVA EMILIJA N
IPC分类号： B29C65/48 , C09J5/02

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