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    • 3. 发明专利
    • MOLDING CIRCUIT BOARD
    • JPH10261445A
    • 1998-09-29
    • JP32277997
    • 1997-11-25
    • AMP INC
    • PUERNER DEAN ABABOW DAVID A
    • H01R24/00H01R43/00H05K3/46H01R9/09H01R9/07H01R23/02
    • PROBLEM TO BE SOLVED: To prevent separation of upper and lower plastic layers from a metal layer and to prevent generation of fine cracks in a plating material. SOLUTION: This molding circuit board comprises an upper plastic layer 408, a lower plastic layer 410, at least one metal layer 402 embedded between the upper plastic layer 408 and the lower plastic layer 410, and a plurality of joining parts 414 for integrally joining the upper plastic layer 408 and the lower plastic layer 410. Either one or both of the upper plastic layer 408 and the lower plastic layer 410 are formed with at least one opening 428 extending to the surface of the metal layer 402. A conductive circuit path 430 is formed of plating material along a main surface 406 of the upper plastic layer 408 and the lower plastic layer 410 with the opening 428 formed therein, the side wall of the opening 428 and the surface of the metal layer 402, and is provided for making an electrical connection between the metal layer 402 and the circuit selected from circuits arranged on the main surface 406. Some of the plurality of joining parts 414 pass through an edge part of the metal layer 402, and at least one pair of the plurality of joining parts 414 are arranged opposite to both sides of the opening 428.