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    • 3. 发明授权
    • Low-K dielectric material
    • 低K电介质材料
    • US07646081B2
    • 2010-01-12
    • US10563801
    • 2004-07-08
    • Juha T. Rantala
    • Juha T. Rantala
    • H01L23/58
    • H01L21/31633C07B2200/11C07F7/1804C23C16/401C23C16/56H01L21/02126H01L21/02216H01L21/02274H01L21/02277H01L21/02345
    • Method for forming a low dielectric constant structure on a semiconductor substrate by CVD processing. The method comprises using a precursor containing chemical compound having the formula of (R1-R2)n-Si—(X1)4-n, wherein X1 is hydrogen, halogen, acyloxy, alkoxy or OH group, R2 is an optional group and comprises an aromatic group having 6 carbon atoms and R1 is a substituent at position 4 of R2 selected from an alkyl group having from 1 to 4 carbon atoms, an alkenyl group having from 2 to 5 carbon atoms, an alkynyl group having from 2 to 5 carbon atoms, Cl or F; n is an integer 1-3. The present precursors allow for a lowering of the electronic dielectric constant compared to conventional dielectric materials, such as silicon dioxide or phenyl modified organo-containing silicon dioxide.
    • 通过CVD处理在半导体衬底上形成低介电常数结构的方法。 该方法包括使用含有式(R1-R2)n-Si-(X1)4-n的化合物的前体,其中X 1是氢,卤素,酰氧基,烷氧基或OH基,R 2是任选的基团, 具有6个碳原子的芳族基团,R 1是选自具有1至4个碳原子的烷基,具有2至5个碳原子的烯基,具有2至5个碳原子的炔基的第4位的取代基 原子,Cl或F; n是整数1-3。 与常规电介质材料相比,本发明的前体允许降低电子介电常数,例如二氧化硅或苯基改性的含有机硅的二氧化硅。