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    • 6. 发明公开
    • Methods and apparatus for linear scan magnetron sputtering
    • Verfahren undGerätezur线性gerasterderMangetronzerstäubung
    • EP0858095A3
    • 2001-01-17
    • EP98300888.9
    • 1998-02-06
    • INTEVAC, INC.
    • Hughes, John L.Kolenkow, Robert J.Pond, Norman H.Davis, Gary A.Petersen, Carl T.Weiss, Robert E.
    • H01J37/34
    • H01J37/3455C23C14/35H01J37/3408
    • A magnetron sputtering source for depositing a material onto a substrate includes a target from which the material is sputtered, a magnet assembly disposed in proximity to the target for confining a plasma at the surface of the target and a drive assembly for scanning the magnet assembly relative to the target. The sputtering source may further include an anode for maintaining substantially constant plasma characteristics as the magnet assembly is scanned relative to the target. The anode may be implemented as variable voltage stationary electrodes positioned at or near the opposite ends of the scan path followed by the magnet assembly, spaced-apart anode wires positioned between the target and the substrate or a movable anode that is scanned with the magnet assembly. The magnet elements of the magnet assembly may have different spacings from-the surface of the target to enhance depositional thickness uniformity. The target may be fabricated in sections, each having a target element bonded to a backing element for reduced sensitivity to thermal variations. The target may be rotated from a first fixed position to a second fixed position relative to the magnet assembly at least once during its operating life for increased target utilization.
    • 用于将材料沉积到衬底上的磁控溅射源包括溅射材料的靶,设置在靶附近的磁体组件,用于限制靶的表面处的等离子体和用于扫描磁体组件相对的驱动组件 到目标 当磁体组件相对于靶被扫描时,溅射源还可以包括用于维持基本恒定的等离子体特性的阳极。 阳极可以被实现为位于扫描路径的相对端处或附近的可变电压固定电极,随后是磁体组件,位于靶和衬底之间的间隔开的阳极线或用磁体组件扫描的可移动阳极 。 磁体组件的磁体元件可以具有与靶的表面不同的间隔,以增强沉积厚度均匀性。 靶可以以各自的方式制造,每个具有结合到背衬元件的目标元件,以降低对热变化的敏感性。 目标可以在其使用寿命期间相对于磁体组件从第一固定位置旋转至第二固定位置,以增加目标利用率。