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    • 8. 发明公开
    • Circuit board structure
    • Leiterplattenstruktur
    • EP2747315A1
    • 2014-06-25
    • EP13158323.9
    • 2013-03-08
    • Wistron Neweb Corporation
    • Kuo, Hsiang-ChenTsai, Tsung-Hsing
    • H04H40/90
    • G08B1/08H04H40/90
    • A circuit board structure (30) for a low noise block down-converter (10) is disclosed. The circuit board structure (30) is used for transmitting a first radio-frequency signal (SV) and a second radio-frequency signal (SH) across each other, and includes a first substrate (31) and a second substrate (32). The first substrate (31) includes a first wire (L1) for transmitting the first radio-frequency signal (SV), a first grounded wire (G1) formed in parallel to a side of the first wire (L1), and a second grounded wire (G2) formed in parallel to another side of the first wire (L1). The second substrate (32) is electrically connected to the first substrate (31), and includes a second wire (L2) for transmitting the second radio-frequency signal (SH), a third wire (L3) formed on a side of the second wire (L2) and a fourth wire (L4) formed on another side of the second wire (L2).
    • 公开了一种用于低噪声块下变频器(10)的电路板结构(30)。 电路板结构(30)用于彼此相对地发送第一射频信号(SV)和第二射频信号(SH),并且包括第一基板(31)和第二基板(32)。 第一基板(31)包括用于传输第一射频信号(SV)的第一布线(L1),与第一布线(L1)的一侧平行形成的第一接地线(G1)和第二布线 线(G2)与第一线(L1)的另一侧平行地形成。 第二基板(32)电连接到第一基板(31),并且包括用于传输第二射频信号(SH)的第二导线(L2),形成在第二基板 线(L2)和形成在第二线(L2)的另一侧上的第四线(L4)。