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1. 发明授权

US09659855B2 Cavity package with pre-molded substrate 有权
公开(公告)号：US09659855B2
公开(公告)日：2017-05-23
申请号：US14469811
申请日：2014-08-27
申请人： Ubotic Company Limited
发明人： Chun Ho Fan
IPC分类号： H01L23/498 , H01L21/48 , H01L23/047 , H01L23/10 , H01L23/495 , H01L23/00
CPC分类号： H01L21/4828 , H01L21/4817 , H01L21/4821 , H01L21/4825 , H01L21/4839 , H01L21/52 , H01L23/04 , H01L23/047 , H01L23/10 , H01L23/4952 , H01L23/49541 , H01L23/49582 , H01L23/49861 , H01L24/73 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/00012
摘要： A cavity package is set forth along with a method of manufacturing thereof. The method comprises applying a selective plating resist to a metallic substrate in a pattern to expose portions for a ring, tie bars, die attach pad and input/output wire bonding pads; elective depositing of metal plating using the selective plating resist; removing the selective metal plating resist; applying a selective etching resist to the substrate; selectively etching portions of the substrate not covered by the selective etching resist; stripping away the selective etching resist; pre-molding a leadframe to the substrate so as to surround the die attach pad portion; etching the tie bars away from the bottom surface of the substrate; attaching a semiconductor device die to the die attach pad; wire bonding the semiconductor device to the input/output wire bonding pads; and attaching a cap to the ring portion of the substrate and the die attach pad to protect the wire bonded semiconductor device die and permit electrical grounding.

2. 发明公开

EP2843697A3 Cavity package with pre-molded cavity leadframe 审中-公开
标题翻译：具有预制腔引线框腔壳
公开(公告)号：EP2843697A3
公开(公告)日：2015-05-06
申请号：EP14179605.2
申请日：2014-08-01
申请人： Ubotic Company Limited
发明人： Fan, Chun Ho
IPC分类号： H01L23/047 , H01L23/10 , H01L21/50
CPC分类号： H01L23/49503 , H01L21/4825 , H01L21/50 , H01L21/565 , H01L21/78 , H01L23/047 , H01L23/10 , H01L23/3114 , H01L23/4952 , H01L23/49537 , H01L23/49541 , H01L23/49575 , H01L23/49582 , H01L23/49861 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/85 , H01L24/92 , H01L24/97 , H01L2224/32245 , H01L2224/48247 , H01L2224/48257 , H01L2224/73265 , H01L2224/85439 , H01L2224/85444 , H01L2224/85455 , H01L2224/85464 , H01L2224/92247 , H01L2224/97 , H01L2924/00014 , H01L2924/15153 , H01L2924/15747 , H01L2924/16251 , H01L2924/165 , H01L2924/1659 , H01L2924/167 , H01L2224/83 , H01L2224/85 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A cavity package is disclosed comprising a metal leadframe, a metal ring connected to the metal leadframe, a plastic body molded to the metal leadframe forming a substrate cavity including an exposed die attach pad of the leadframe for affixing a semiconductor device, exposed lead fingers of the leadframe for wire bonding to the semiconductor device and an external circuit, and an exposed top surface of the metal ring, and a metal cap for closing and encapsulating the substrate cavity. The metal ring is integrated into the pre-molded cavity leadframe for providing an electrical ground path from the metal cap to the die attach pad and permitting attachment of the metal cap to the pre-molded leadframe using solder reflow.

3. 发明公开

EP2843698A3 Cavity package with pre-molded substrate 审中-公开
标题翻译：带预成型基材的腔体包装
公开(公告)号：EP2843698A3
公开(公告)日：2015-04-01
申请号：EP14182490.4
申请日：2014-08-27
申请人： Ubotic Company Limited
发明人： Fan, Chun Ho
IPC分类号： H01L23/047 , H01L23/10 , H01L23/043 , H01L23/498 , H01L21/48
CPC分类号： H01L21/4828 , H01L21/4817 , H01L21/4821 , H01L21/4825 , H01L21/4839 , H01L21/52 , H01L23/04 , H01L23/047 , H01L23/10 , H01L23/4952 , H01L23/49541 , H01L23/49582 , H01L23/49861 , H01L24/73 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/00012
摘要： A cavity package is set forth along with a method of manufacturing thereof. The method comprises applying a selective plating resist to a metallic substrate in a pattern to expose portions for a ring, tie bars, die attach pad and input/output wire bonding pads; elective depositing of metal plating using the selective plating resist; removing the selective metal plating resist; applying a selective etching resist to the substrate; selectively etching portions of the substrate not covered by the selective etching resist; stripping away the selective etching resist; pre-molding a leadframe to the substrate so as to surround the die attach pad portion; etching the tie bars away from the bottom surface of the substrate; attaching a semiconductor device die to the die attach pad; wire bonding the semiconductor device to the input/output wire bonding pads; and attaching a cap to the ring portion of the substrate and the die attach pad to protect the wire bonded semiconductor device die and permit electrical grounding.
摘要翻译：阐述了一种空腔封装及其制造方法。该方法包括将选择性抗镀层以图案施加到金属衬底上以暴露环，连接条，管芯附着焊盘和输入/输出导线焊盘的部分; 使用选择性抗镀剂选择性沉积金属镀层; 去除选择性金属电镀抗蚀剂; 将选择性抗蚀剂涂覆到基板上; 选择性地蚀刻未被选择性抗蚀剂覆盖的基板部分; 剥去选择性抗蚀剂; 将引线框架预先模制到衬底以便围绕管芯附接垫部分; 将连接条从基底的底表面上蚀刻掉; 将半导体器件管芯附接到管芯附连焊盘; 将半导体器件引线键合到输入/输出引线键合焊盘; 以及将帽附接到衬底的环形部分和管芯附连垫以保护引线接合的半导体器件管芯并允许电接地。

4. 发明授权

US10458826B2 Mass flow sensor module and method of manufacture 有权
公开(公告)号：US10458826B2
公开(公告)日：2019-10-29
申请号：US15686394
申请日：2017-08-25
申请人： Ubotic Company Limited
发明人： Ming-Wa Tam
IPC分类号： G01F1/684 , B81B7/00 , H01L23/00 , G01F15/00 , G01F1/688
摘要： A mass flow sensor module and method of manufacture thereof are provided, wherein a semiconductor sensor die is integrated within an enhanced molded housing structure that maintains an air tight seal and protects the die from abrasive wear, and which also provides laminar flow of the liquid gas to be sensed. Since the die is embedded in the substrate; there is no need for a spacer for reducing die thickness induced flow turbulence. Moreover, the die surface is at the same level as the top surface of the substrate, such that there is no performance impact due to die thickness variation and therefore no die attach bond line thickness control requirement. In one embodiment, a thermal enhancement capability is provided.

5. 发明授权

US09257370B2 Cavity package with pre-molded cavity leadframe 有权
标题翻译：具有预成型腔引线框的腔封装
公开(公告)号：US09257370B2
公开(公告)日：2016-02-09
申请号：US14446390
申请日：2014-07-30
申请人： Ubotic Company Limited
发明人： Chun Ho Fan
IPC分类号： H01L23/495 , H01L23/047 , H01L23/10 , H01L23/498 , H01L21/50 , H01L23/00
CPC分类号： H01L23/49503 , H01L21/4825 , H01L21/50 , H01L21/565 , H01L21/78 , H01L23/047 , H01L23/10 , H01L23/3114 , H01L23/4952 , H01L23/49537 , H01L23/49541 , H01L23/49575 , H01L23/49582 , H01L23/49861 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/85 , H01L24/92 , H01L24/97 , H01L2224/32245 , H01L2224/48247 , H01L2224/48257 , H01L2224/73265 , H01L2224/85439 , H01L2224/85444 , H01L2224/85455 , H01L2224/85464 , H01L2224/92247 , H01L2224/97 , H01L2924/00014 , H01L2924/15153 , H01L2924/15747 , H01L2924/16251 , H01L2924/165 , H01L2924/1659 , H01L2924/167 , H01L2224/83 , H01L2224/85 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A cavity package is disclosed comprising a metal leadframe, a metal ring connected to the metal leadframe, a plastic body molded to the metal leadframe forming a substrate cavity including an exposed die attach pad of the leadframe for affixing a semiconductor device, exposed lead fingers of the leadframe for wire bonding to the semiconductor device and an external circuit, and an exposed top surface of the metal ring, and a metal cap for closing and encapsulating the substrate cavity. The metal ring is integrated into the pre-molded cavity leadframe for providing an electrical ground path from the metal cap to the die attach pad and permitting attachment of the metal cap to the pre-molded leadframe using solder reflow.
摘要翻译：公开了一种空腔封装，其包括金属引线框架，连接到金属引线框架的金属环，模制到金属引线框架的塑料体，形成衬底腔体，该衬底腔体包括用于固定半导体器件的引线框架的暴露管芯附着焊盘，暴露的引线指用于引线键合到半导体器件的引线框架和外部电路，以及金属环的暴露的顶表面，以及用于封闭和封装衬底腔的金属帽。金属环集成到预成型腔引线框架中，用于提供从金属帽到管芯附接垫的电接地路径，并允许使用回流焊将金属帽附接到预成型的引线框架上。

6. 发明授权

US10777457B2 Carrier substrate, package, and method of manufacture 有权
公开(公告)号：US10777457B2
公开(公告)日：2020-09-15
申请号：US15723566
申请日：2017-10-03
申请人： Ubotic Company Limited
发明人： Ming-Wa Tam
IPC分类号： H01L21/768 , H01L23/31 , H05K3/42 , H05K1/11 , H01L23/13 , H05K3/02 , H05K3/10 , H01L23/495 , H01L23/498
摘要： A method of manufacturing, a carrier, and a semiconductor package are provided. The method involves depositing a plurality of conductive vias, applying a molding material over the lead frame, grinding the molding material to expose the plurality of conductive vias, and depositing a metalized pattern over the molding material. The carrier is manufacture by this method and the semiconductor package is formed based on the carrier.

7. 发明授权

US09991194B1 Sensor package and method of manufacture 有权
公开(公告)号：US09991194B1
公开(公告)日：2018-06-05
申请号：US15490632
申请日：2017-04-18
申请人： Ubotic Company Limited
发明人： Ming-Wa Tam , Ken Lik Hang Wan , Wa San Leung
IPC分类号： H01L23/495 , H01L23/00 , H01L23/29 , H01L23/498 , H01L21/48
CPC分类号： H01L21/4842 , H01L21/52 , H01L23/055 , H01L23/24 , H01L23/293 , H01L23/49541 , H01L23/49861 , H01L24/97 , H01L2221/68327 , H01L2223/54473 , H01L2223/5446 , H01L2223/5448
摘要： A method of manufacture and a substrate for sensor packages is provided. The method involves premolding a lead frame with strips having V-grooves; cutting the substrate partially, and plating the exposed surfaces of the lead frame. The method subsequently involves attaching a die to a dies pad and connecting wires between the die and leads to form a sensor package. The sensor package is separated from the substrate by snapping along the score line. The substrate for assembly of sensor packages as well as substrate of sensor packages is manufactured using at least part of the method of manufacture.

8. 发明授权

US09887149B2 Cavity package with die attach pad 有权
公开(公告)号：US09887149B2
公开(公告)日：2018-02-06
申请号：US15420182
申请日：2017-01-31
申请人： Ubotic Company Limited
发明人： Chun Ho Fan
IPC分类号： H01L21/00 , H01L23/495 , H01L23/057 , H01L21/48 , H01L21/56 , H05K1/02
CPC分类号： H01L23/49506 , H01L21/4839 , H01L21/50 , H01L21/56 , H01L23/057 , H01L23/495 , H01L23/49517 , H01L23/49551 , H01L2924/0002 , H05K1/0271 , H05K2201/068 , H05K2201/10378 , H01L2924/00
摘要： A cavity package is provided. The package can include a metal leadframe and a substrate attached to an interposer formed as part of the leadframe. The substrate typically has a coefficient of thermal expansion matched to the coefficient of thermal expansion of a semiconductor device to be affixed to the substrate. The semiconductor device is typically attached to an exposed top surface of the substrate. The cavity package also includes a plastic portion molded to the leadframe forming a substrate cavity. The substrate cavity allows access to the exposed top surface of the substrate for affixing the semiconductor device. The cavity package also include a connective element for grounding a lid through an electrical path from the lid to the interposer.

9. 发明申请

US20140306333A1 CAVITY PACKAGE WITH DIE ATTACH PAD 有权
标题翻译： CAVITY包装与DIE ATTACH PAD
公开(公告)号：US20140306333A1
公开(公告)日：2014-10-16
申请号：US14250869
申请日：2014-04-11
申请人： Ubotic Company Limited
发明人： Chun Ho FAN
IPC分类号： H01L23/495 , H01L21/56
CPC分类号： H01L23/49506 , H01L21/4839 , H01L21/50 , H01L21/56 , H01L23/057 , H01L23/495 , H01L23/49517 , H01L23/49551 , H01L2924/0002 , H05K1/0271 , H05K2201/068 , H05K2201/10378 , H01L2924/00
摘要： A cavity package is provided. The package can include a metal leadframe and a substrate attached to an interposer formed as part of the leadframe. The substrate typically has a coefficient of thermal expansion matched to the coefficient of thermal expansion of a semiconductor device to be affixed to the substrate. The semiconductor device is typically attached to an exposed top surface of the substrate. The cavity package also includes a plastic portion molded to the leadframe forming a substrate cavity. The substrate cavity allows access to the exposed top surface of the substrate for affixing the semiconductor device. The cavity package also include a connective element for grounding a lid through an electrical path from the lid to the interposer.
摘要翻译：提供空腔包装。封装可以包括金属引线框架和附接到形成为引线框架的一部分的插入器的基板。衬底通常具有与要固定到衬底的半导体器件的热膨胀系数相匹配的热膨胀系数。半导体器件通常附着到衬底的暴露的顶表面。空腔封装还包括模塑到引导框架上的塑料部分，形成衬底空腔。衬底空腔允许接近暴露的衬底顶表面以固定半导体器件。空腔封装还包括一个连接元件，用于通过从盖子到插入器的电气路径将盖子接地。

10. 发明公开

EP2843698A2 Cavity package with pre-molded substrate 审中-公开
标题翻译： Hohlraumpaket mit vorgeformtem Substrat
公开(公告)号：EP2843698A2
公开(公告)日：2015-03-04
申请号：EP14182490.4
申请日：2014-08-27
申请人： Ubotic Company Limited
发明人： Fan, Chun Ho
IPC分类号： H01L23/047 , H01L23/10
CPC分类号： H01L21/4828 , H01L21/4817 , H01L21/4821 , H01L21/4825 , H01L21/4839 , H01L21/52 , H01L23/04 , H01L23/047 , H01L23/10 , H01L23/4952 , H01L23/49541 , H01L23/49582 , H01L23/49861 , H01L24/73 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/00012
摘要： A cavity package is set forth along with a method of manufacturing thereof. The method comprises applying a selective plating resist to a metallic substrate in a pattern to expose portions for a ring, tie bars, die attach pad and input/output wire bonding pads; elective depositing of metal plating using the selective plating resist; removing the selective metal plating resist; applying a selective etching resist to the substrate; selectively etching portions of the substrate not covered by the selective etching resist; stripping away the selective etching resist; pre-molding a leadframe to the substrate so as to surround the die attach pad portion; etching the tie bars away from the bottom surface of the substrate; attaching a semiconductor device die to the die attach pad; wire bonding the semiconductor device to the input/output wire bonding pads; and attaching a cap to the ring portion of the substrate and the die attach pad to protect the wire bonded semiconductor device die and permit electrical grounding.
摘要翻译：与其制造方法一起阐述了空腔包装。该方法包括以图案向金属基底施加选择性电镀抗蚀剂，以露出用于环，连接条，管芯附着垫和输入/输出引线接合焊盘的部分; 使用选择性电镀抗蚀剂选择性沉积金属电镀; 去除选择性金属电镀抗蚀剂; 向所述基底施加选择性抗蚀剂; 选择性地蚀刻未被选择性蚀刻抗蚀剂覆盖的衬底的部分; 剥离选择性抗蚀剂; 将引线框预先模制到基板以围绕芯片附接焊盘部分; 将连接条蚀刻离开基板的底表面; 将半导体器件管芯附接到管芯附接焊盘; 将半导体器件引线接合到输入/输出引线接合焊盘; 并且将盖附接到基板的环部分和管芯附接垫以保护引线接合半导体器件管芯并允许电接地。

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