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1. 发明公开

EP3718776A1 TABLET PRINTING APPARATUS AND HEAT DISSIPATION METHOD THEREOF 审中-公开
公开(公告)号：EP3718776A1
公开(公告)日：2020-10-07
申请号：EP20160772.8
申请日：2020-03-03
申请人： Shibaura Mechatronics Corporation
发明人： HIRANO, Azusa , TSURUOKA, Yasutsugu
IPC分类号： B41J3/407 , B41J11/00
摘要： According to one embodiment, a tablet printing apparatus (1) includes: a conveyor (21) configured to convey a tablet while sucking and holding the tablet by the discharge of air; an inkjet head (24) configured to perform printing on the tablet conveyed by the conveyor (21); an exhaust pipe (45) which the air discharged from the conveyor (21) passes through; an exhaust blower (46) as a heat source that generates heat; a heat conductive member (70) that is in contact with the exhaust pipe (45) and the exhaust blower (46); and a housing (5) configured to house the conveyor (21), the inkjet head (24), the exhaust pipe (45), the exhaust blower (46), and the heat conductive member (70).

2. 发明授权

EP2854164B1 Substrate processing device and substrate processing method 有权
公开(公告)号：EP2854164B1
公开(公告)日：2019-02-13
申请号：EP14187005.5
申请日：2014-09-30
申请人： Shibaura Mechatronics Corporation
发明人： Matsushita, Jun , Nagashima, Yuji , Hayashi, Konosuke , Miyazaki, Kunihiro
IPC分类号： H01L21/67 , B08B3/02 , B08B3/08

3. 发明公开

EP3301707A1 SUBSTRATE PROCESSING APPARATUS 审中-公开
标题翻译：基板处理装置
公开(公告)号：EP3301707A1
公开(公告)日：2018-04-04
申请号：EP17193691.7
申请日：2017-09-28
申请人： Shibaura Mechatronics Corporation
发明人： NAGASHIMA, Yuji , HAYASHI, Konosuke
IPC分类号： H01L21/67
CPC分类号： H01L21/67051 , B08B3/02 , B08B3/08 , B08B5/02 , F26B3/30 , H01L21/02052 , H01L21/67115 , H01L21/68764
摘要： According to one embodiment, a substrate processing apparatus includes a processing chamber (20), a support part (40), a heater (80), and an optical member (90). In the processing chamber (20), air flows from the top to the bottom. The support part (40) is located in the processing chamber (20) to support a substrate (W) having a surface to be treated (Wa). The heater (80) is arranged so as not to be above the support part (40) and emits light for heating. The optical member (90) is arranged in the processing chamber (20) so as not to be above the support part (40) to guide the light emitted by the heater (80) and having passed above the support part (40) to the surface to be treated (Wa) of the substrate (W) supported by the support part (40).
摘要翻译：根据一个实施例，衬底处理设备包括处理室（20），支撑部件（40），加热器（80）和光学构件（90）。在处理室（20）中，空气从顶部流向底部。支撑部（40）位于处理室（20）中以支撑具有待处理表面（Wa）的基板（W）。加热器（80）配置成不会位于支承部（40）的上方而发出用于加热的光。光学部件90配置在处理容器20内，使其不在支承部40的上方，将加热器80发出的光从支承部40的上方通过，（40）支撑的基板（W）的待处理表面（Wa）。

4. 发明公开

EP3051574A1 SUBSTRATE TREATMENT DEVICE, METHOD FOR SEPARATING BONDED SUBSTRATE, AND METHOD FOR REMOVING ADHSEIVE 审中-公开
标题翻译：基板处理装置，方法的接合基板和粘结材料去除的分离
公开(公告)号：EP3051574A1
公开(公告)日：2016-08-03
申请号：EP14849128.5
申请日：2014-09-24
申请人： Shibaura Mechatronics Corporation
发明人： KANAI, Takahiro , MATSUI, Emi , HAYASHI, Konosuke
IPC分类号： H01L21/02 , H01L21/304
CPC分类号： H01L21/02079 , H01L21/31133 , H01L21/67086 , H01L21/67092 , H01L21/68728
摘要： The embodiment of a substrate treatment device includes a treatment bath configured to store a treatment liquid in which a treatment object is to be immersed, a transport section configured to transport the treatment object, a temperature control section provided in at least one of the treatment bath and a position spaced from the treatment bath and configured to perform at least one of heating and cooling of the treatment object.
the treatment object is at least one of:
a laminated substrate including a device substrate, a support substrate, and an adhesive provided between the device substrate and the support substrate,
the device substrate with the adhesive attached thereto, and
the support substrate with the adhesive attached thereto.

5. 发明公开

EP3051573A1 SUCTION STAGE, BONDING DEVICE, AND METHOD FOR MANUFACTURING BONDED SUBSTRATE 审中-公开
标题翻译：负压阶段，结合装置和方法制造键合衬底
公开(公告)号：EP3051573A1
公开(公告)日：2016-08-03
申请号：EP14846963.8
申请日：2014-09-24
申请人： Shibaura Mechatronics Corporation
发明人： MATSUI, Emi , HAYASHI, Konosuke , KANAI, Takahiro
IPC分类号： H01L21/02 , G11B7/26 , H01L21/683
CPC分类号： H01L21/6838 , B32B37/10 , B32B37/14 , H01L21/67092 , H01L21/6875
摘要： According to the embodiment, a suction stage includes a mounting section configured to mount a first substrate, and an evacuation section configured to evacuate air between the first substrate and the mounting section. The mounting section includes a first wall part provided on an outer peripheral side of one end surface of the mounting section and shaped like a ring, and a second wall part provided inside the first wall part and shaped like a ring. The evacuation section includes a first control valve provided between the evacuation section and a first region between the first wall part and the second wall part, a second control valve provided between the evacuation section and a second region inside the second wall part, and a control section configured to control the first control valve and the second control valve. The control section is configured to control the first control valve and the second control valve so that suction of the first substrate and deactivation of the suction of the first substrate are alternately performed in at least one of the first region and the second region. While the suction of the first substrate is deactivated in one of the first region and the second region, the suction of the first substrate is performed in the other region.

6. 发明公开

EP2854163A1 Substrate processing device and substrate processing method 审中-公开
标题翻译：基板处理装置和基板处理方法
公开(公告)号：EP2854163A1
公开(公告)日：2015-04-01
申请号：EP14187002.2
申请日：2014-09-30
申请人： Shibaura Mechatronics Corporation
发明人： Nagashima, Yuji , Matsushita, Jun , Hayashi, Konosuke , Miyazaki, Kunihiro , Furuya, Masaaki , Azumano, Hidehito , Tauchi, Toyoyasu
IPC分类号： H01L21/67
CPC分类号： B08B3/10 , H01L21/67028
摘要： A substrate processing device 100 includes a solvent replacing unit (organic solvent supply unit 15 and solvent supply unit 34) replacing a cleaning liquid with a volatile solvent of a low concentration, and thereafter further performing replacement with a volatile solvent of a high concentration.
摘要翻译：基板处理装置100包括用低浓度的挥发性溶剂替换清洁液并且之后用高浓度的挥发性溶剂进一步替换的溶剂替换单元（有机溶剂供应单元15和溶剂供应单元34）。

7. 发明公开

EP2782129A2 Substrate processing device and substrate processing method 有权
标题翻译： Substratverarbeitungsvorrichtung und Substratverarbeitungsverfahren
公开(公告)号：EP2782129A2
公开(公告)日：2014-09-24
申请号：EP14160176.5
申请日：2014-03-17
申请人： Shibaura Mechatronics Corporation
发明人： Hayashi, Konosuke , Furuya, Masaaki , Ootagaki, Takashi , Nagashima, Yuji , Kinase, Atsushi , Abe, Masahiro
IPC分类号： H01L21/67
摘要： In a substrate processing device 10 having a heating and drying unit 103 for drying a surface of a substrate W, the heating and drying unit 103 heats upward a vertically downward surface of the substrate W to dry the surface of the substrate by dropping and removing, by gravity, the droplets of the volatile solvent formed on the surface of the substrate W by the heating operation.
摘要翻译：在具有用于干燥基板W的表面的加热和干燥单元103的基板处理装置10中，加热和干燥单元103向上加热基板W的垂直向下的表面，以通过脱落来干燥基板的表面，通过重力，通过加热操作形成在基板W的表面上的挥发性溶剂的液滴。

8. 发明公开

EP2782127A2 Substrate processing device and substrate processing method 有权
标题翻译：基板处理装置和基板处理方法
公开(公告)号：EP2782127A2
公开(公告)日：2014-09-24
申请号：EP14160174.0
申请日：2014-03-17
申请人： Shibaura Mechatronics Corporation
发明人： Hayashi, Konosuke , Furuya, Masaaki , Ootagaki, Takashi , Nagashima, Yuji , Kinase, Atsushi , Abe, Masahiro
IPC分类号： H01L21/67
CPC分类号： B08B3/10 , H01L21/67028 , H01L21/67034
摘要： A substrate processing device 10 includes a suction drying unit 65 drying a surface of a substrate W by absorbing and removing a liquid droplet of volatile solvent formed on the surface of the substrate W by a heating operation of a heating unit 64.
摘要翻译：基板处理装置10具备吸引干燥部65，该吸引干燥部65通过利用加热部64的加热动作吸附除去在基板W的表面形成的挥发性溶剂的液滴，从而对基板W的表面进行干燥。

9. 发明授权

EP2194566B1 Method for judging arc of glow discharger and high-frequency arc discharge suppressor 有权
标题翻译：程序评估Glimmentladers和高频电弧抑制的圆弧
公开(公告)号：EP2194566B1
公开(公告)日：2012-05-09
申请号：EP10002108.8
申请日：2002-09-30
申请人： Shibaura Mechatronics Corporation
发明人： Kuriyama, Noboru
IPC分类号： H01J37/32
CPC分类号： C23C14/564 , H01J37/32045 , H01J37/32082 , H01J37/32935 , H01J2237/0206 , H01L21/67069

10. 发明公开

EP1959487A1 SURFACE ROUGHNESS TESTER 有权
标题翻译：表面粗糙度测试仪
公开(公告)号：EP1959487A1
公开(公告)日：2008-08-20
申请号：EP06834019.9
申请日：2006-12-05
申请人： Shibaura Mechatronics Corporation
发明人： HAYASHI, Yoshinori , MORI, Hideki
IPC分类号： H01L21/66
CPC分类号： G01B11/303 , G01N21/9501
摘要： [PROBLEM] To provide a surface roughness inspection system enabling suitable inspection even when the surface of the object being inspected is curved.
[MEANS FOR SOLUTION] A system having an imaging unit 20 having a line sensor 22 and scanning the surface of an object being inspected 101 in a direction perpendicular to the direction of extension of the line sensor 22 and outputting a density signal for each pixel from the line sensor 22 and a processing unit 50 processing the density signal from the line sensor 22 of the imaging unit 20, the processing unit 50 having a means for acquiring a pixel density value based on a density signal from the line sensor 22 (S2) and a density state generating means for generating a density state information Pf showing the density state in the scan direction of the object surface based on all of the pixel density values acquired for the object surface 101 being inspected (S7).
摘要翻译：发明内容为了提供一种表面粗糙度检查系统，即使在检查对象物的表面弯曲的情况下也能够进行适当的检查。用于解决问题的手段具有成像单元20的系统，成像单元20具有线传感器22，并且在垂直于线传感器22的延伸方向的方向上扫描被检查对象101的表面，并且输出来自每个像素的密度信号线传感器22和处理单元50处理来自成像单元20的线传感器22的密度信号，处理单元50具有用于基于来自线传感器22的密度信号获取像素密度值的装置（S2）以及密度状态产生装置，用于基于针对被检查对象表面101获取的所有像素密度值，产生表示对象表面的扫描方向上的密度状态的密度状态信息Pf（S7）。

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