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1. 发明公开

US20240210743A1 ELECTRO-OPTIC MODULATOR AND PREPARATION METHOD THEREFOR 审中-公开
公开(公告)号：US20240210743A1
公开(公告)日：2024-06-27
申请号：US18598186
申请日：2024-03-07
申请人： PICMORE TECHNOLOGY (SUZHOU) LTD.
发明人： Mengxi JI , Xianyao LI , Yuzhou SUN
IPC分类号： G02F1/035
CPC分类号： G02F1/035 , G02F2202/20
摘要： A preparation method for an electro-optic modulator includes: providing a base substrate, and forming a waveguide and bottom electrodes on an upper surface of the base substrate; forming a covering dielectric layer and metal electrodes; forming a supporting substrate on an upper surface of the covering dielectric layer; removing the base substrate; providing a lithium niobate thin film, and bonding the lithium niobate thin film to a surface of the covering dielectric layer remote from the supporting substrate, the lithium niobate thin film being located directly below the waveguide.

2. 发明公开

EP4400901A1 ELECTRO-OPTIC MODULATOR AND PREPARATION METHOD THEREFOR 审中-实审
公开(公告)号：EP4400901A1
公开(公告)日：2024-07-17
申请号：EP22866082.5
申请日：2022-04-07
申请人： Picmore Technology (Suzhou) Ltd.
发明人： JI, Mengxi , LI, Xianyao , SUN, Yuzhou
IPC分类号： G02F1/03 , G02F1/035 , G02F1/00
CPC分类号： G02F1/035 , G02F1/03 , G02F1/00
摘要： The present application specifically relates to an electro-optic modulator and a preparation method therefor, comprising: providing a substrate, and forming a waveguide and a bottom electrode on an upper surface of the substrate; forming a covering dielectric layer and a metal electrode; forming a supporting substrate on an upper surface of the covering dielectric layer; removing the substrate; providing a lithium niobate thin film, and bonding the lithium niobate thin film to a surface of the covering dielectric layer distant from the supporting substrate; the lithium niobate thin film being located directly below the waveguide. In the preparation method for an electro-optic modulator in the above embodiment, by means of bonding a lithium niobate thin film to an electro-optic chip that has a waveguide, the lithium niobate thin film does not need to be patterned into a lithium niobate waveguide, light can be self-aligned in the waveguide and the lithium niobate thin film, and no coupling is needed.

3. 发明公开

EP4403986A1 HYBRID PACKAGE CHIP AND OPTICAL TRANSMITTER 审中-实审
公开(公告)号：EP4403986A1
公开(公告)日：2024-07-24
申请号：EP22868778.6
申请日：2022-06-23
申请人： Picmore Technology (Suzhou) Ltd.
发明人： JI, Mengxi , LI, Xianyao , SUN, Yuzhou
IPC分类号： G02F1/035 , G02B6/34 , G02B6/42
CPC分类号： G02B6/42 , G02F1/035 , G02B6/34
摘要： The present application discloses a hybrid package chip and an optical transmitter, the hybrid package chip comprises: a first sub-chip, which comprises at least one first waveguide and at least one first electrode; and a second sub-chip, which comprises at least one second waveguide and at least one second electrode. The first waveguide is optically coupled to the corresponding second waveguide; a first electrode of the first sub-chip and a corresponding second electrode of the second sub-chip are electrically connected to one another by means of a first conductive structure, so as to receive a modulated electrical signal; and in a working state, the first sub-chip receives external input light and outputs the light by means of the first waveguide, the at least one first electrode modulates the input light so as to output modulated light, and the second waveguide receives a portion of light coupled from the first sub-chip. By using a non-bonding means, the present application improves the means by which a silicon photonic sub-chip and a thin-film lithium niobate based optoelectronic sub-chip are integrated, and reduces the difficulty of coupling between a lithium niobate waveguide and a silicon optical waveguide while reducing the difficulty of the process.

4. 发明公开

EP4400902A1 ELECTRO-OPTIC MODULATOR 审中-实审
公开(公告)号：EP4400902A1
公开(公告)日：2024-07-17
申请号：EP22866084.1
申请日：2022-04-07
申请人： Picmore Technology (Suzhou) Ltd.
发明人： JI, Mengxi , LI, Xianyao , SUN, Yuzhou
IPC分类号： G02F1/065 , G02F1/061
CPC分类号： G02F1/065 , G02F1/061
摘要： The present application specifically relates to an electro-optic modulator, comprising: a substrate; a first dielectric layer, located on the substrate; an opening being formed in the first dielectric layer, and the opening exposing a portion of the substrate; a waveguide, located on the substrate and located at the bottom of the opening or below the opening; a first electrode, located in the first dielectric layer, located on one side of the waveguide, and spaced apart from the waveguide; a second electrode, located in the first dielectric layer, located on the side of the waveguide distant from the first electrode, and spaced apart from the waveguide; and an organic electro-optic material layer, at least located in the opening and at least covering the waveguide. In the electro-optic modulator of the embodiments, a common waveguide different from a slit waveguide is used, and the manufacturing process requirements are low; the organic electro-optic material layer is covered on the waveguide, so that a light field can be leaked into the organic electro-optic material to the maximum extent, thereby effectively reducing optical loss and having high electro-optic modulation efficiency.

5. 发明公开

US20240295762A1 HYBRID PACKAGE CHIP AND OPTICAL TRANSMITTER 审中-公开
公开(公告)号：US20240295762A1
公开(公告)日：2024-09-05
申请号：US18602641
申请日：2024-03-12
申请人： PICMORE TECHNOLOGY (SUZHOU) LTD.
发明人： Mengxi JI , Xianyao LI , Yuzhou SUN
IPC分类号： G02F1/035
CPC分类号： G02F1/035 , G02F2201/302 , G02F2201/58 , G02F2202/20
摘要： A hybrid package chip and an optical transmitter includes a first sub-chip including a first waveguide and at least one first electrode, and a second sub-chip including a second waveguide and at least one second electrode. The first waveguide is optically coupled to the second waveguide. A first electrode of the first sub-chip and a corresponding second electrode of the second sub-chip are electrically connected to one another by means of a first conductive structure, so as to receive a modulation electrical signal. The first sub-chip is configured to receive external input light and output the light by means of the first waveguide. The at least one first electrode modulates the input light so as to output the modulated light. The second waveguide receives a portion of light from the first sub-chip through coupling.

6. 发明公开

US20240210742A1 ELECTRO-OPTIC MODULATOR 审中-公开
公开(公告)号：US20240210742A1
公开(公告)日：2024-06-27
申请号：US18599130
申请日：2024-03-07
申请人： PICMORE TECHNOLOGY (SUZHOU) LTD.
发明人： Mengxi JI , Xianyao LI , Yuzhou SUN
IPC分类号： G02F1/025 , G02F1/015 , G02F1/03
CPC分类号： G02F1/025 , G02F1/0155 , G02F1/0316
摘要： The present application specifically relates to an electro-optic modulator, comprising: a substrate; a first dielectric layer, located on the substrate; an opening being formed in the first dielectric layer, and the opening exposing a portion of the substrate; a waveguide, located on the substrate and located at the bottom of the opening or below the opening; a first electrode, located in the first dielectric layer, located on one side of the waveguide, and spaced apart from the waveguide; a second electrode, located in the first dielectric layer, located on the side of the waveguide distant from the first electrode, and spaced apart from the waveguide; and an organic electro-optic material layer, at least located in the opening and at least covering the waveguide.

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