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热词
    • 9. 发明授权
    • Light-emitting diode devices
    • 发光二极管器件
    • US08710531B2
    • 2014-04-29
    • US13600440
    • 2012-08-31
    • Syue-Min Li
    • Syue-Min Li
    • H01L33/62H01L33/50
    • H01L33/0004H01L33/382H01L33/62H01L2224/48247H01L2224/49107H01L2924/3025H01L2224/48091H01L2924/00014H01L2924/00
    • An LED device includes a die carrier having a die mounting surface and electrical connection regions. An LED die is mounted on the die mounting surface of the die carrier. The LED die includes a substrate, a first type semiconductor layer disposed atop the substrate, a second type semiconductor layer disposed atop the first type semiconductor layer, an another first type semiconductor layer disposed atop the second type semiconductor layer, at least three through holes each extending from the substrate to a corresponding semiconductor layer, an insulative layer formed on inner walls of the through holes, and electrically conductive linkers mounted within the through holes. Each electrically conductive linker has an end electrically connected to a corresponding semiconductor layer and an opposite end protruding outwardly from the corresponding through hole for electrical connection to a corresponding electrical connection region. A light transmissible protective layer covers the LED die.
    • LED器件包括具有管芯安装表面和电连接区域的管芯载体。 LED模具安装在模具载体的模具安装表面上。 LED管芯包括衬底,设置在衬底顶部的第一类型半导体层,设置在第一类型半导体层顶上的第二类型半导体层,设置在第二类型半导体层顶部的另一个第一类型半导体层,每个至少三个通孔 从衬底延伸到相应的半导体层,形成在通孔的内壁上的绝缘层和安装在通孔内的导电接头。 每个导电接头具有电连接到对应的半导体层的端部和从相应的通孔向外突出的相对端,用于电连接到相应的电连接区域。 透光保护层覆盖LED管芯。