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    • 1. 发明授权
    • Certified wafer inspection
    • US09324541B1
    • 2016-04-26
    • US14547111
    • 2014-11-18
    • Sri Rama Prasanna Pavani
    • Sri Rama Prasanna Pavani
    • G06K9/00H01J37/26H01J37/20H01J37/22
    • H01J37/263H01J37/28H01J2237/221H01L22/12H01L22/20
    • A method for certifying an inspection system using a calibrated surface, comprising: acquiring a calibrated list from said calibrated surface, with said calibrated list comprising information about features located on said calibrated surface; inspecting said calibrated surface with said inspection system to generate an estimated list, with said estimated list comprising information about features located on said calibrated surface; generating a matched list by searching for the presence of one or more calibrated features in said estimated list, wherein said calibrated features are listed in said calibrated list; computing an estimated characteristic parameter from said matched list, wherein said estimated characteristic parameter quantifies features in said matched list having a unifying characteristic; and comparing said estimated characteristic parameter with a calibrated characteristic parameter, wherein said calibrated characteristic parameter quantifies features in said calibrated list having said unifying characteristic, whereby the ability of said inspection system to detect features with one or more characteristics is certified. A system and method for imaging a surface to generate an adaptive resolution image, comprising: determining a weakly scattering feature, wherein said weakly scattering feature produces a weak image response to be resolved by said adaptive resolution image; determining a coarse spot size such that said weakly scattering feature is detected in an image captured with said coarse spot size; capturing a coarse image of region with said coarse spot size, wherein said coarse image of region comprises one or more pixels corresponding to a predetermined region of said surface; classifying said coarse image of region into a coarse image of feature and a coarse image of surface, wherein a feature is detected in said coarse image of feature and a feature is not detected in said coarse image of surface; estimating a feature position from said coarse image of feature, wherein said feature position is the location of feature on said surface; capturing a fine image of feature at said feature position, wherein said fine image of feature is captured with a fine spot size having a smaller spot size than said coarse spot size; and combining said fine image of feature and said coarse image of surface to generate said adaptive resolution image, whereby feature regions are captured with finer resolution than featureless surface regions in said adaptive resolution image.
    • 5. 发明授权
    • Computational wafer image processing
    • US10184901B2
    • 2019-01-22
    • US15420107
    • 2017-01-31
    • Exnodes Inc.
    • Sri Rama Prasanna Pavani
    • H04N7/18G01B5/30G01N21/95G01N21/88G06K9/00G06K9/46G06K9/62G06K9/60G06T7/00G01N21/94
    • A method for designing a filter to image a feature on a surface, comprising: acquiring an image of said feature, with said image of feature comprising information from multiple points of said feature; generating a structural model of said feature by extracting predetermined properties of said feature from said image of feature; computing a scattering model for said feature from said structural model of said feature, with said scattering model for feature having information on scattered electromagnetic field from feature propagating in a plurality of scattering angles, wherein said scattered electromagnetic field from feature is generated by scattering of an electromagnetic radiation by said feature; acquiring an image of said surface, with said image of surface comprising information from multiple points of said surface; generating a structural model of said surface by extracting predetermined properties of said surface from said image of surface; computing a scattering model for said surface from said structural model of said surface, with said scattering model for surface having information on scattered electromagnetic field from surface propagating in a plurality of scattering angles, wherein said scattered electromagnetic field from surface is generated by scattering of an electromagnetic radiation by said surface; and computing said filter by combining said scattering model for feature and said scattering model for surface to achieve a predetermined filter performance metric, whereby said filter is designed to modulate scattered electromagnetic field from said feature and scattered electromagnetic field from said surface to image a feature on said surface. A system and method for recognizing a feature, comprising: acquiring an image of said feature using an imaging module, with said image of feature comprising information from multiple points of said feature; computing a feature spread function from scattering model of a previously known feature and transfer function of said imaging module, wherein said feature spread function represents a model of an image of said previously known feature; and comparing said image of feature with said feature spread function by computing a match metric between said image of feature and said feature spread function, whereby said match metric determines if said feature is similar to said previously known feature.
    • 7. 发明授权
    • Computational wafer inspection filter design
    • US09696265B2
    • 2017-07-04
    • US14532036
    • 2014-11-04
    • Sri Rama Prasanna Pavani
    • Sri Rama Prasanna Pavani
    • G01N21/00G01R13/00G01R29/26G01N21/95G01N21/88G06K9/00G06K9/46G06K9/62G06K9/60G06T7/00
    • G01N21/9501G01N21/8851G01N21/94G01N2021/8883G01N2201/12G06K9/00134G06K9/0014G06K9/46G06K9/4609G06K9/4661G06K9/605G06K9/6201G06K9/624G06T7/0006G06T7/001G06T2207/10056G06T2207/20016G06T2207/30148
    • A method for designing a filter to image a feature on a surface, comprising: acquiring an image of said feature, with said image of feature comprising information from multiple points of said feature; generating a structural model of said feature by extracting predetermined properties of said feature from said image of feature; computing a scattering model for said feature from said structural model of said feature, with said scattering model for feature having information on scattered electromagnetic field from feature propagating in a plurality of scattering angles, wherein said scattered electromagnetic field from feature is generated by scattering of an electromagnetic radiation by said feature; acquiring an image of said surface, with said image of surface comprising information from multiple points of said surface; generating a structural model of said surface by extracting predetermined properties of said surface from said image of surface; computing a scattering model for said surface from said structural model of said surface, with said scattering model for surface having information on scattered electromagnetic field from surface propagating in a plurality of scattering angles, wherein said scattered electromagnetic field from surface is generated by scattering of an electromagnetic radiation by said surface; and computing said filter by combining said scattering model for feature and said scattering model for surface to achieve a predetermined filter performance metric, whereby said filter is designed to modulate scattered electromagnetic field from said feature and scattered electromagnetic field from said surface to image a feature on said surface. A system and method for recognizing a feature, comprising: acquiring an image of said feature using an imaging module, with said image of feature comprising information from multiple points of said feature; computing a feature spread function from scattering model of a previously known feature and transfer function of said imaging module, wherein said feature spread function represents a model of an image of said previously known feature; and comparing said image of feature with said feature spread function by computing a match metric between said image of feature and said feature spread function, whereby said match metric determines if said feature is similar to said previously known feature.
    • 8. 发明授权
    • Wide field illumination for wafer inspection
    • 宽视场照明用于晶圆检查
    • US09250194B1
    • 2016-02-02
    • US14511189
    • 2014-10-10
    • Sri Rama Prasanna Pavani
    • Sri Rama Prasanna Pavani
    • G01N21/00G01N21/88G01N21/95
    • G01N21/8806G01N21/9501
    • A system and method for illuminating a surface, comprising: providing a reflective layer around said surface; directing an electromagnetic beam to be incident on said layer; aligning said layer, said beam, and said surface so that said beam undergoes a plurality of reflections on said layer for illuminating a predetermined region of said surface, whereby the size of said region is larger than the size of said beam, and the intensity of illumination on said region is higher than the value obtained by multiplying the intensity of said beam and the ratio of the size of said beam to the size of said region.
    • 一种用于照射表面的系统和方法,包括:在所述表面周围提供反射层; 引导入射在所述层上的电磁波束; 对准所述层,所述光束和所述表面,使得所述光束在所述层上经历多次反射以照射所述表面的预定区域,由此所述区域的尺寸大于所述光束的尺寸,并且强度 所述区域上的照明高于通过将所述光束的强度与所述光束的尺寸与所述区域的大小的比率相乘所获得的值。
    • 9. 发明申请
    • COMPUTATIONAL WAFER IMAGE PROCESSING
    • US20170140517A1
    • 2017-05-18
    • US15420107
    • 2017-01-31
    • Exnodes Inc.
    • Sri Rama Prasanna Pavani
    • G06T7/00G06K9/62G06K9/00G06K9/46G01N21/95G01N21/94
    • G01N21/9501G01N21/8851G01N21/94G01N2021/8883G01N2201/12G06K9/00134G06K9/0014G06K9/46G06K9/4609G06K9/4661G06K9/605G06K9/6201G06K9/624G06T7/0006G06T7/001G06T2207/10056G06T2207/20016G06T2207/30148
    • A method for designing a filter to image a feature on a surface, comprising: acquiring an image of said feature, with said image of feature comprising information from multiple points of said feature; generating a structural model of said feature by extracting predetermined properties of said feature from said image of feature; computing a scattering model for said feature from said structural model of said feature, with said scattering model for feature having information on scattered electromagnetic field from feature propagating in a plurality of scattering angles, wherein said scattered electromagnetic field from feature is generated by scattering of an electromagnetic radiation by said feature; acquiring an image of said surface, with said image of surface comprising information from multiple points of said surface; generating a structural model of said surface by extracting predetermined properties of said surface from said image of surface; computing a scattering model for said surface from said structural model of said surface, with said scattering model for surface having information on scattered electromagnetic field from surface propagating in a plurality of scattering angles, wherein said scattered electromagnetic field from surface is generated by scattering of an electromagnetic radiation by said surface; and computing said filter by combining said scattering model for feature and said scattering model for surface to achieve a predetermined filter performance metric, whereby said filter is designed to modulate scattered electromagnetic field from said feature and scattered electromagnetic field from said surface to image a feature on said surface. A system and method for recognizing a feature, comprising: acquiring an image of said feature using an imaging module, with said image of feature comprising information from multiple points of said feature; computing a feature spread function from scattering model of a previously known feature and transfer function of said imaging module, wherein said feature spread function represents a model of an image of said previously known feature; and comparing said image of feature with said feature spread function by computing a match metric between said image of feature and said feature spread function, whereby said match metric determines if said feature is similar to said previously known feature.
    • 10. 发明授权
    • Distributed wafer inspection
    • US09612273B2
    • 2017-04-04
    • US14556058
    • 2014-11-28
    • Sri Rama Prasanna Pavani
    • Sri Rama Prasanna Pavani
    • G01R31/26G01N33/00
    • G01R31/26G01N21/9501G01N33/00G01N2021/8416G01N2033/0095G06Q10/06395G06Q50/04Y02P90/30
    • A system and method for inspecting a surface with cloud based processing, comprising: generating surface data by inspecting a surface; transferring said surface data from a client to a cloud, wherein said cloud comprises multiple interconnected computing nodes that are remotely located from said client; computing surface properties using said surface data on said cloud; generating surface analytics from said surface properties and a prior information set, with said prior information set comprising surface properties previously stored in said cloud; and transferring said surface properties and said surface analytics from said cloud to said client, whereby said surface properties and said surface analytics are generated with processing power, memory, and storage that are scalable, reliable, and upgradable on demand. A method for improving production yield of an article with cloud based processing, comprising: storing said process information in said cloud; transferring functional results to said cloud, with said functional results comprising identifying information of said articles that have failed a functional test and identifying information of said articles that have passed said functional test; generating a probable cause list from said process information in said cloud, wherein said probable cause list comprises a list of differences between said process information of one or more failed articles and said process information of one or more passed articles; and generating a root cause list from said probable cause list in said cloud, wherein said root cause list comprises process information responsible for failure in failed articles, whereby root causes of failures are analytically determined with processing power, memory, and storage that are scalable, reliable, and upgradable on demand.