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1. 发明申请

WO1998009003A1 PROCESS FOR PREPARING POROUS ELECTROLYTIC METAL FOIL 审中-公开
标题翻译：制备多孔电解金属箔的方法
公开(公告)号：WO1998009003A1
公开(公告)日：1998-03-05
申请号：PCT/JP1996002460
申请日：1996-08-30
申请人： CIRCUIT FOIL JAPAN CO., LTD. , KATO, Hitoshi , ASHIZAWA, Koichi , AKUTSU, Tsukasa
发明人： CIRCUIT FOIL JAPAN CO., LTD.
IPC分类号： C25D01/04
CPC分类号： H01M4/80 , C25D1/04 , C25D1/08 , H01M4/661 , H01M10/05
摘要： A process for preparing a porous electrolytic metal foil by electrodepositing a metal on a drum cathode by using a drum cathode and an anode to form a metal foil layer and separating the formed layer from the drum cathode, wherein a coating of an electrically insulating material is formed on the cathode surface exposed after the foil separation by subjecting the exposed surface to electrolytic oxidation, by spraying the exposed surface with a resin liquid, or by suspending a machine oil or the like in an electrolyte to deposit the machine oil onto the exposed surface. The metal foil thus obtained has a large number of interconnecting pores in the direction of thickness and, when used as a collector substrate of an electrode for a battery, can prevent the separation of a composite for a battery, thus contributing to an improvement in the cycle time of a battery.
摘要翻译：一种制备多孔电解金属箔的方法，该方法是通过使用鼓形阴极和阳极将鼓泡式阴极上的金属电沉积以形成金属箔层并将形成的层与鼓式阴极分离，其中电绝缘材料的涂层为通过将暴露的表面进行电解氧化，通过用树脂液体喷射暴露的表面，或者将机油等悬浮在电解液中，将机器油沉积在暴露的表面上，形成在箔分离后暴露的阴极表面上。由此获得的金属箔在厚度方向上具有大量互连孔，并且当用作电池用电极的集电体基板时，可以防止电池用复合体的分离，从而有助于改善电池的循环时间。

2. 发明专利

TWI276708B 高密度超微細電路板用銅箔 COPPER FOIL FOR HIGH-DENSITY ULTRA-FINE PRINTED WIRING BOARD 有权
简体标题：高密度超微细电路板用铜箔 COPPER FOIL FOR HIGH-DENSITY ULTRA-FINE PRINTED WIRING BOARD
公开(公告)号：TWI276708B
公开(公告)日：2007-03-21
申请号：TW090123289
申请日：2001-09-21
申请人：古河電路箔片股份有限公司 CIRCUIT FOIL JAPAN CO., LTD.
发明人：鈴木昭利 AKITOSHI SUZUKI , 福田伸 FUKUDA, SHIN , 星野和弘 KAZUHIRO HOSHINO , 中岡忠雄 TADAO NAKAOKA
IPC分类号： C25D , B32B , H05K
CPC分类号： B32B15/08 , B32B15/20 , C25D1/04 , C25D5/10 , C25D7/0614 , H05K3/025 , Y10T428/12431 , Y10T428/12493 , Y10T428/12514 , Y10T428/12535 , Y10T428/12569 , Y10T428/12611 , Y10T428/12771 , Y10T428/12861 , Y10T428/24917 , Y10T428/31678 , Y10T428/31681
摘要：本發明提供：於載子箔表面依序積層有剝離層、防止擴散層、電鍍銅層或依序積層有防止擴散層、剝離層、電鍍銅層，而電鍍銅層之表面係經粗面化的附載子極薄銅箔；樹脂基材上積層有附載子極薄銅箔的銅箔積層板；前述銅箔積層板之極薄銅箔上，形成有電路圖案的印刷電路板；以及複數積層前述印刷電路板所形成的多層印刷電路板。
简体摘要：本发明提供：于载子箔表面依序积层有剥离层、防止扩散层、电镀铜层或依序积层有防止扩散层、剥离层、电镀铜层，而电镀铜层之表面系经粗面化的附载子极薄铜箔；树脂基材上积层有附载子极薄铜箔的铜箔积层板；前述铜箔积层板之极薄铜箔上，形成有电路图案的印刷电路板；以及复数积层前述印刷电路板所形成的多层印刷电路板。

3. 发明公开

EP0860518A1 PROCESS FOR PREPARING POROUS ELECTROLYTIC METAL FOIL 失效
标题翻译：用于生产多孔金属箔ELKTROLYTISCHER
公开(公告)号：EP0860518A1
公开(公告)日：1998-08-26
申请号：EP96928719.2
申请日：1996-08-30
申请人： CIRCUIT FOIL JAPAN CO. LTD
发明人： KATO, Hitoshi , ASHIZAWA, Koichi, The Furukawa Electric Co., Ltd , AKUTSU, Tsukasa
IPC分类号： C25D1/04 , C25D1/08 , C25C5/02
CPC分类号： H01M4/80 , C25D1/04 , C25D1/08 , H01M4/661 , H01M10/05
摘要： A process for preparing a porous electrolytic metal foil by electrodepositing a metal on a drum cathode by using a drum cathode and an anode to form a metal foil layer and separating the formed layer from the drum cathode, wherein a coating of an electrically insulating material is formed on the cathode surface exposed after the foil separation by subjecting the exposed surface to electrolytic oxidation, by spraying the exposed surface with a resin liquid, or by suspending a machine oil or the like in an electrolyte to deposit the machine oil onto the exposed surface. The metal foil thus obtained has a large number of interconnecting pores in the direction of thickness and, when used as a collector substrate of an electrode for a battery, can prevent the separation of a composite for a battery, thus contributing to an improvement in the cycle time of a battery.

5. 发明公开

EP0709494A2 Method of surface-roughening treatment of copper foil 失效
标题翻译： Verfahren zurOberflächen-Aufrauhung von Kupferfolie
公开(公告)号：EP0709494A2
公开(公告)日：1996-05-01
申请号：EP95306782.4
申请日：1995-09-26
申请人： CIRCUIT FOIL JAPAN CO. LTD
发明人： Oguro, Ryoichi, c/o Circuit Foil Japan Co. Ltd. , Nakaoka, Tadao, c/o Circuit Foil Japan Co. Ltd. , Inoue, Kazuyuki, c/o Circuit Foil Japan Co. Ltd. , Hoshino, Kazuhiro, c/o Circuit Foil Japan Co. Ltd.
IPC分类号： C25D7/06 , C25D5/18 , C25D3/38
CPC分类号： C25D5/48 , C25D3/38 , C25D5/18 , H05K3/384 , H05K2201/0355 , H05K2203/0307 , H05K2203/0723
摘要： Disclosed is a method of surface-roughening treatment of a copper foil by subjecting at least one side of the copper foil to electro-plating treatment using an alternating current, wherein a sulfuric acid bath or a sulfuric acid-copper sulfate bath is used as an electrolyte.
摘要翻译：本发明公开了一种铜箔的表面粗糙化处理方法，其中，使用铜箔的至少一面进行电镀电镀处理，其中使用硫酸浴或硫酸 - 硫酸铜浴作为电解质。

6. 发明授权

EP0514074B1 Method of producing copper-clad laminated board 失效
标题翻译：一种制造铜包覆叠层板的方法
公开(公告)号：EP0514074B1
公开(公告)日：1996-02-28
申请号：EP92304081.0
申请日：1992-05-06
申请人： SUMITOMO BAKELITE COMPANY LIMITED , CIRCUIT FOIL JAPAN CO. LTD
发明人： Katoh, Kimikazu, Plastic Eng., c/o Sumitomo , Azuma, Keiji, Plastic Eng., c/o Sumitomo , Oguro, Ryoichi, Metal Eng., c/o Circuit Foil Japan
IPC分类号： H05K3/02
CPC分类号： B29C33/68 , B29L2031/3425 , B32B37/26 , H05K1/0366 , H05K3/022 , H05K2203/068 , Y10T29/49124

7. 发明公开

EP0514074A3 Method of producing copper-clad laminated board 失效
标题翻译：生产铜箔层压板的方法
公开(公告)号：EP0514074A3
公开(公告)日：1993-05-19
申请号：EP92304081.0
申请日：1992-05-06
申请人： SUMITOMO BAKELITE COMPANY LIMITED , CIRCUIT FOIL JAPAN CO. LTD
发明人： Katoh, Kimikazu, Plastic Eng., c/o Sumitomo , Azuma, Keiji, Plastic Eng., c/o Sumitomo , Oguro, Ryoichi, Metal Eng., c/o Circuit Foil Japan
IPC分类号： H05K3/02
CPC分类号： B29C33/68 , B29L2031/3425 , B32B37/26 , H05K1/0366 , H05K3/022 , H05K2203/068 , Y10T29/49124
摘要： Disclosed is a method of producing a copper-clad laminated board comprising the steps of laminating a glass epoxy prepreg between both-side roughened copper foils, holding the upper and bottom copper foils with a polyamide-type films having a melting point of 170°C or higher, and heating and press-molding the resultant structure while holding the top and bottom of the structure with press plates. The use of a polyamide-type film as a mold releasing film prevents the film from being stuck at all on the both-side roughened copper foil or the press plates, yielding a high separation property, and can maintain the shapes of the ruggedness on the roughened surface.

8. 发明公开

EP1355518A1 FLEXIBLE PRINTED WIRING BOARD 有权
标题翻译：灵活的LEITERPLATTE
公开(公告)号：EP1355518A1
公开(公告)日：2003-10-22
申请号：EP02732182.7
申请日：2002-01-09
申请人： Sony Chemicals Corporation , Circuit Foil Japan Co., Ltd.
发明人： KUDO, Noriaki , TAKABAYASHI, Asaei , SUZUKI, Akitoshi , FUKUDA, Shin
IPC分类号： H05K1/09 , H05K1/03 , C25D7/06
CPC分类号： H05K3/384 , H05K1/0346 , H05K2201/0154 , H05K2201/0355 , H05K2203/0307 , H05K2203/0723 , Y10S428/901 , Y10S428/935 , Y10T428/12438 , Y10T428/12569 , Y10T428/12611 , Y10T428/12903 , Y10T428/24917 , Y10T428/31681 , Y10T428/31721
摘要： A flexible printed board contains an unroughened electrodeposited copper foil, a zinc-based metallic layer provided thereon in an amount of 0.25 to 0.40 mg/dm 2 , and a polyimide resin layer formed through the imidation of a polyamic acid layer provided on the zinc-based metallic layer.
摘要翻译：柔性印刷电路板包含非增韧的电沉积铜箔，其上设置有0.25〜0.40mg / dm 2的锌基金属层，以及通过酰亚胺化聚酰胺酸层形成的聚酰亚胺树脂层锌基金属层。

9. 发明授权

EP0709494B1 Method of surface-roughening treatment of copper foil 失效
标题翻译：一种用于铜箔的表面粗糙化处理
公开(公告)号：EP0709494B1
公开(公告)日：2000-01-05
申请号：EP95306782.4
申请日：1995-09-26
申请人： CIRCUIT FOIL JAPAN CO. LTD
发明人： Oguro, Ryoichi, c/o Circuit Foil Japan Co. Ltd. , Nakaoka, Tadao, c/o Circuit Foil Japan Co. Ltd. , Inoue, Kazuyuki, c/o Circuit Foil Japan Co. Ltd. , Hoshino, Kazuhiro, c/o Circuit Foil Japan Co. Ltd.
IPC分类号： C25D7/06 , C25D5/18 , C25D3/38
CPC分类号： C25D5/48 , C25D3/38 , C25D5/18 , H05K3/384 , H05K2201/0355 , H05K2203/0307 , H05K2203/0723

10. 发明授权

EP0519631B1 Both-side roughened copper foil with protection film 失效
标题翻译：与保护膜两面粗化铜箔
公开(公告)号：EP0519631B1
公开(公告)日：1998-04-15
申请号：EP92305243.5
申请日：1992-06-08
申请人： SUMITOMO BAKELITE COMPANY LIMITED , CIRCUIT FOIL JAPAN CO. LTD
发明人： Keiji, Azuma, c/o Sumitomo Bakelite , Kimikazu, Katoh, c/o Sumitomo Bakelite , Ryoichi, Oguro, c/o Circuit Foil Japan
IPC分类号： H05K3/46 , H05K3/28 , H05K3/02
CPC分类号： H05K3/022 , H05K3/025 , H05K3/382 , H05K3/4611 , H05K2201/0355

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