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    • 2. 发明专利
    • Camera system with multiple pixel arrays on a chip
    • 具有多个像素阵列的相机系统
    • JP2014027669A
    • 2014-02-06
    • JP2013188994
    • 2013-09-12
    • Capso Vision Incカプソ・ビジョン・インコーポレイテッドCapso Vision, Inc.
    • LUO JIAFUWANG KANG-HUAIGORDON WILSON
    • H04N5/225G02B13/06G03B15/00G03B35/08H04N5/369H04N7/24H04N9/09
    • H04N5/3415A61B1/041G02B13/06H04N5/23238H04N5/3745H04N5/378
    • PROBLEM TO BE SOLVED: To provide a camera system having a more simple and compact configuration than a conventional one to capture a plurality of images.SOLUTION: The camera system of the present invention uses one or more image sensor IC chips in which each image sensor IC chip has a plurality of pixel arrays on the same semiconductor substrate (that is, "a plurality of pixel arrays on one chip"). The camera system includes: (a) a plurality of optical components which are arranged physically in close proximity with each other (within several millimeters or less, or several centimeters or less, for example) and generate a plurality of images; and (b) one sensor substrate ("chip") including a plurality of two-dimensional pixel arrays which are matched so as to capture the plurality of images to convert the plurality of images into electrical signals. The pixel arrays can be manufactured by using CCD or CMOS compatible processes. The chip typically has a side of 2 centimeters or less.
    • 要解决的问题:提供一种具有比常规的更简单和紧凑的配置以拍摄多个图像的相机系统。解决方案:本发明的相机系统使用一个或多个图像传感器IC芯片,其中每个图像传感器 IC芯片在同一半导体基板上具有多个像素阵列(即,“一个芯片上的多个像素阵列”)。 相机系统包括:(a)多个光学部件,其物理上彼此靠近地布置(例如在几毫米或更少,或几厘米或更小)内并且产生多个图像; 和(b)一个传感器基板(“芯片”),其包括多个二维像素阵列,这些二维像素阵列被匹配以便捕捉多个图像以将多个图像转换为电信号。 可以通过使用CCD或CMOS兼容工艺制造像素阵列。 芯片通常具有2厘米或更小的一侧。