专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明专利

JP2009302527A Light emitting diode package 审中-公开
标题翻译：发光二极管封装
公开(公告)号：JP2009302527A
公开(公告)日：2009-12-24
申请号：JP2009122347
申请日：2009-05-20
申请人： Alti Electronics Co Ltd , アルティ電子株式会社Alti−electronics Co.,Ltd.
发明人： KIM SUN-HONG , LEE JIN-WON , PARK KYOUNG-IL
IPC分类号： H01L23/02 , H01L23/04 , H01L33/54 , H01L33/56 , H01L33/60 , H01L33/62
CPC分类号： H01L33/62 , H01L23/49537 , H01L33/486 , H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide an LED package capable of preventing the generation of tilt when the LED package is mounted on a printed circuit board PCB.
SOLUTION: The LED package has a horizontal support part on the bottom of a housing, so that the LED package mounted on the PCB can be prevented from tilt due to a slope. The LED package has a step-like jaw formed by sinking an inner wall of the housing along a periphery of a window, thereby the molding resin filling the window can be prevented from being overflowed from the window. Consequently, during operation for filling the window with the molding resin, the quantity of the resin can be uniformed.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种当LED封装安装在印刷电路板PCB上时能够防止产生倾斜的LED封装。解决方案：LED封装在外壳的底部具有一个水平支撑部分，从而可以防止安装在PCB上的LED封装由于倾斜而倾斜。 LED封装具有通过沿着窗口的周边下沉壳体的内壁而形成的阶梯状夹爪，从而可以防止填充窗口的模塑树脂从窗口溢出。因此，在用模塑树脂填充窗的操作期间，树脂的数量可以均匀。版权所有（C）2010，JPO＆INPIT

2. 发明专利

JP2009177112A Light-emitting diode package 审中-公开
标题翻译：发光二极管封装
公开(公告)号：JP2009177112A
公开(公告)日：2009-08-06
申请号：JP2008106544
申请日：2008-04-16
申请人： Alti Electronics Co Ltd , アルティ電子株式会社Alti−electronics Co.,Ltd.
发明人： KIM SUN-HONG , KIM MIN-SIC , LEE JI-NA
IPC分类号： H01L33/48 , H01L33/60 , H01L33/62
CPC分类号： H01L33/60 , H01L33/486 , H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a light-emitting diode package having superior thermal efficiency, capable of suppressing deterioration in reliability which is caused by a package structure having a bent part in an electrode lead.
SOLUTION: The light-emitting diode package 100 includes: an electrode pad 130 on which a chip is placed; a housing 110 having a window 120 through which the chip is exposed; a housing wall 112 and an electrode lead 140 forming the window 110; and an electrode lead 140, extending from the electrode pad 130 in a direction of the housing to be exposed outside a surface of the housing 110, wherein the housing wall formed in the direction comprises a first portion and a second portion thicker than the first portion to cover the electrode lead 140. When the inner surface of the housing wall 112 is formed so as to incline, the inclination angle of the first portion can be formed larger than that of the second portion.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种具有优异的热效率的发光二极管封装，能够抑制由在电极引线中具有弯曲部分的封装结构引起的可靠性降低。解决方案：发光二极管封装100包括：放置芯片的电极焊盘130; 壳体110，其具有窗口120，芯片暴露在该窗口120中; 壳体壁112和形成窗口110的电极引线140; 以及电极引线140，其从电极焊盘130沿壳体的方向延伸露出外壳110的表面，其中沿该方向形成的壳体壁包括第一部分和比第一部分厚的第二部分以覆盖电极引线140.当壳体壁112的内表面形成为倾斜时，第一部分的倾斜角度可以形成为大于第二部分的倾斜角。版权所有（C）2009，JPO＆INPIT

3. 发明专利

JP2009177111A Side surface light-emitting diode package 审中-公开
标题翻译：侧面发光二极管封装
公开(公告)号：JP2009177111A
公开(公告)日：2009-08-06
申请号：JP2008100018
申请日：2008-04-08
申请人： Alti Electronics Co Ltd , アルティ電子株式会社Alti−electronics Co.,Ltd.
发明人： PARK IK-SEONG , KIM SUN-HONG , LEE JIN-WON , PARK KYOUNG-IL
IPC分类号： H01L33/00 , H01L33/48 , H01L33/60 , H01L33/62
CPC分类号： H01L33/486 , H01L33/60 , H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a side surface light-emitting diode package that emits light especially on the side surface relating to a light-emitting diode package.
SOLUTION: The side surface light-emitting diode package includes: a housing including a hollow reflective housing, and a support housing which has a surface recessed to the behind of the external surface of the reflective housing; and a lead frame which is elongated outside through the housing and bends on the recessed surface of the support housing. The elongated lead frame can be arranged in the space formed by recessing the support housing through the folding process. The end of the lead frame elongated through the housing is housed in the recessed space of the support housing, the capacity of the hollow is extended by allowing the reflective housing to occupy the space which the end of a conventional lead frame occupies, thereby achieving the effect which extends the area of a light emitting portion.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种特别是在与发光二极管封装有关的侧表面上发光的侧面发光二极管封装。解决方案：侧面发光二极管封装包括：包括中空反射壳体的壳体和具有凹入到反射壳体的外表面后面的表面的支撑壳体; 以及引线框架，其通过壳体伸长到外部并弯曲在支撑壳体的凹陷表面上。细长引线框架可以布置在通过折叠过程使支撑壳体凹陷形成的空间中。通过壳体伸长的引线框架的端部容纳在支撑壳体的凹陷空间中，通过允许反射壳体占据传统引线框架的端部占据的空间来延伸空腔的容量，从而实现延长发光部的面积的效果。版权所有（C）2009，JPO＆INPIT

4. 发明专利

JP2008098600A Light emitting diode package 审中-公开
标题翻译：发光二极管封装
公开(公告)号：JP2008098600A
公开(公告)日：2008-04-24
申请号：JP2007099898
申请日：2007-04-05
申请人： Alti Electronics Co Ltd , アルティ電子株式会社Alti−electronics Co.,Ltd.
发明人： KIM DONG-SEL , KIM DONG SOO
IPC分类号： H01L33/44 , H01L33/50 , H01L33/58 , H01L33/60 , H01L33/62
CPC分类号： H01L33/647 , H01L33/62 , H01L33/642 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide a high-output light-emitting diode package capable of effectively combining a heat sink, a lead frame and a housing without using a special combining means of the heat sink such as metal cutting and a tie.
SOLUTION: This high-output light-emitting diode package is equipped with a housing of insulating material with a cavity in the center, a lead frame of conductive material including an interior lead that exposes to the cavity covered by the housing and an exterior lead extending outside the housing, a heat sink 130 having an exposed surface through the cavity and connected to the bottom surface of the interior lead, a light-emitting diode chip 150 mounted on the exposed surface and electrically connected to the interior lead, a lens portion combined with the upper part of the housing so that the cavity may be covered, and an insulating adhesive sheet 140 that electrically insulates but thermally combines the interior lead and the heat sink.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够有效地组合散热器，引线框架和壳体的高输出发光二极管封装，而不使用散热器的特殊组合装置，例如金属切割和连接。
解决方案：该高输出发光二极管封装配备有绝缘材料的壳体，其中心具有空腔，导电材料的引线框架包括暴露于由壳体覆盖的空腔的内部引线，以及外部引线延伸到壳体外部，散热器130具有通过空腔的暴露表面并连接到内部引线的底表面;安装在暴露表面上并电连接到内部引线的发光二极管芯片150，透镜部分与壳体的上部结合，使得空腔可以被覆盖;以及绝缘粘合片140，其将内部引线和散热器电绝缘但热组合。版权所有（C）2008，JPO＆INPIT

5. 发明专利

JP2010016358A Side view light emitting diode package 审中-公开
标题翻译：侧视图发光二极管封装
公开(公告)号：JP2010016358A
公开(公告)日：2010-01-21
申请号：JP2009130134
申请日：2009-05-29
申请人： Alti Electronics Co Ltd , アルティ電子株式会社Alti−electronics Co.,Ltd.
发明人： KIM SUNGHOON , LEE JIN-WON , PARK KYOUNG-IL
IPC分类号： H01L33/48
CPC分类号： H01L33/62 , H01L33/486 , H01L33/642 , H01L33/647 , H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a side view light emitting diode package capable of radiating heat generated by a light emitting diode chip in the light emitting diode package to the outside.
SOLUTION: This side view light emitting diode package includes: a housing that includes a front side part having a light emission part, and a rear side part integrally formed with the front side part; and a lead frame that is located between the front side part and the rear side part. In the side view light emitting diode package, the lead frame includes a first lead connected to a first electrode of a light emitting diode chip and a second lead connected to a second electrode of the light emitting diode chip; the front side part includes a first groove and a second groove on its rear surface; the first lead and the second lead are respectively extended to the outside of the package through the first groove; and a heat radiation part extended by the first lead through the second groove is extended to the outside of the package.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够将发光二极管封装中的发光二极管芯片产生的热辐射到外部的侧视发光二极管封装。解决方案：该侧视图发光二极管封装包括：壳体，其包括具有发光部分的前侧部分和与前侧部分一体形成的后侧部分; 以及位于前侧部和后侧部之间的引线框架。在侧视发光二极管封装中，引线框架包括连接到发光二极管芯片的第一电极的第一引线和连接到发光二极管芯片的第二电极的第二引线; 前侧部分在其后表面上包括第一凹槽和第二凹槽; 第一引线和第二引线分别通过第一凹槽延伸到封装的外部; 并且由第一引线延伸穿过第二凹槽的散热部分延伸到封装的外部。版权所有（C）2010，JPO＆INPIT

6. 发明专利

JP2009043728A Display device having backlight unit 审中-公开
标题翻译：具有背光单元的显示设备
公开(公告)号：JP2009043728A
公开(公告)日：2009-02-26
申请号：JP2008204469
申请日：2008-08-07
申请人： Alti Electronics Co Ltd , アルティ電子株式会社Alti−electronics Co.,Ltd.
发明人： KIM DONG SOO , CHOI HAW-KYUNG
IPC分类号： F21V21/06 , F21V8/00 , F21V21/00 , F21V21/002 , F21V21/40 , F21V23/06 , G09F13/04
CPC分类号： G02F1/133308 , G02F2201/503
摘要： PROBLEM TO BE SOLVED: To provide a display device having a case with a slit formed.
SOLUTION: The display device in one embodiment includes a case having a setting space inside, a display region opened to a front face, and a slit communicating to the setting space formed on a side face, a display panel exposed to the display region to be fixed and connected to the case in the setting space, and a backlight unit slid and mounted in the setting space of a back part of the display panel through the slit.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种具有形成狭缝的壳体的显示装置。解决方案：一个实施例中的显示装置包括：具有内部设置空间的壳体，向前表面开口的显示区域和与形成在侧面上的设置空间相通的狭缝;暴露于显示器的显示面板区域被固定并连接到设置空间中的壳体，并且背光单元通过狭缝滑动并安装在显示面板的后部的设置空间中。版权所有（C）2009，JPO＆INPIT

7. 发明专利

JP2009177188A Light-emitting diode package 审中-公开
标题翻译：发光二极管封装
公开(公告)号：JP2009177188A
公开(公告)日：2009-08-06
申请号：JP2009015724
申请日：2009-01-27
申请人： Alti Electronics Co Ltd , アルティ電子株式会社Alti−electronics Co.,Ltd.
发明人： LEE JIN-WON , PARK KYOUNG-IL , KIM SUN-HONG
IPC分类号： H01L33/48 , H01L33/56 , H01L33/60 , H01L33/62
CPC分类号： H01L33/486 , H01L33/62 , H01L2224/45139 , H01L2224/48091 , H01L2224/48247 , H01L2924/01322 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a light-emitting diode package for decreasing the loss of light emitted from a light source, and increasing luminance and light efficiency. SOLUTION: The light-emitting diode package includes: a housing that is made of high heat conductive ceramics, or a thermal conductive plastic material, and includes a groove having an internal space of which upper surface is opened; a substrate formed by the same material as that of the housing; at least one pad frame inserted and fixed onto the substrate by a conductive material and fixed between the housing and the substrate; and a light-emitting diode chip packaged onto the pad frame and positioned at the center section of the groove. The housing projects to a lower portion of the light-emitting diode chip and is expanded. The thickness of the housing facing through the groove should be mutually the same. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于减少从光源发射的光的损失并提高亮度和光效率的发光二极管封装。解决方案：发光二极管封装包括：由高导热陶瓷或导热塑料材料制成的壳体，并且包括具有其上表面打开的内部空间的凹槽; 由与壳体相同的材料形成的基板; 至少一个衬垫框架通过导电材料插入并固定到衬底上并固定在壳体和衬底之间; 以及封装在焊盘框架上并位于槽的中心部分的发光二极管芯片。壳体投射到发光二极管芯片的下部，并扩展。通过槽对置的壳体的厚度应相互相同。版权所有（C）2009，JPO＆INPIT

8. 发明专利

JP2008028377A Cooling device for led module and method for fabricating the same 审中-公开
标题翻译：用于LED模块的冷却装置及其制造方法
公开(公告)号：JP2008028377A
公开(公告)日：2008-02-07
申请号：JP2007153869
申请日：2007-06-11
申请人： Alti Electronics Co Ltd , アルティ電子株式会社Alti Electronics Co., Ltd.
发明人： KIM DONG SOO
IPC分类号： H01L33/62 , H01L33/64
CPC分类号： F21V29/508 , F21V29/004 , F21Y2115/10 , H01L2224/48091 , H01L2224/48247 , H05K1/021 , H05K1/182 , H05K3/0061 , H05K2201/10106 , Y10T29/49124 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide a cooling device for an LED module and a method for fabricating the same. SOLUTION: The cooling device for the LED module includes a dissipation board which dissipates heat, a printed circuit board which is mounted on the dissipation board, and has a through part penetrated by a portion with an LED package, and an electrode pad on the upper surface, and the LED package mounted by inserting via the through part of the printed circuit board. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于LED模块的冷却装置及其制造方法。解决方案：用于LED模块的冷却装置包括耗散热量的散热板，安装在散热板上的印刷电路板，并具有穿过LED封装的部分的通孔部分，以及电极焊盘在上表面上，并且通过经由印刷电路板的通孔插入而安装的LED封装。版权所有（C）2008，JPO＆INPIT

9. 发明专利

JP2009177187A Light-emitting diode package 审中-公开
标题翻译：发光二极管封装
公开(公告)号：JP2009177187A
公开(公告)日：2009-08-06
申请号：JP2009015723
申请日：2009-01-27
申请人： Alti Electronics Co Ltd , アルティ電子株式会社Alti−electronics Co.,Ltd.
发明人： LEE JIN-WON , PARK KYOUNG-IL , KIM SUN-HONG
IPC分类号： H01L33/48 , H01L33/60 , H01L33/62 , H01L33/64
CPC分类号： H01L33/486 , H01L25/167 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2924/01322 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a light-emitting diode package for effectively radiating heat generated from a light-emitting diode chip. SOLUTION: The light-emitting diode package includes: a plate-like substrate; a pad frame having a conductive lead divided by an insulator for mutual insulation on the substrate; a light-emitting diode chip packaged onto the conductive lead; and a housing in which the light-emitting diode chip and the conductive lead are surrounded, the light-emitting diode chip and one portion of the conductive lead are exposed outside, and an opened groove is provided. The conductive lead to which the light-emitting diode is packaged should have a projection extended in both the directions. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于有效辐射由发光二极管芯片产生的热量的发光二极管封装。解决方案：发光二极管封装包括：板状衬底; 衬垫框架，具有由绝缘体分隔的导电引线，用于在衬底上相互绝缘; 封装在导电引线上的发光二极管芯片; 以及发光二极管芯片和导电引线被围绕的壳体，发光二极管芯片和导电引线的一部分暴露在外部，并且设置有开放的槽。封装有发光二极管的导电引线应具有沿两个方向延伸的突起。版权所有（C）2009，JPO＆INPIT

10. 发明专利

JP2009044157A Light emitting diode package and method of manufacturing the same 审中-公开
标题翻译：发光二极管封装及其制造方法
公开(公告)号：JP2009044157A
公开(公告)日：2009-02-26
申请号：JP2008204470
申请日：2008-08-07
申请人： Alti Electronics Co Ltd , アルティ電子株式会社Alti−electronics Co.,Ltd.
发明人： KIM DONG SOO , CHOI HAW-KYUNG
IPC分类号： H01L33/54 , H01L33/56 , H01L33/62
CPC分类号： H01L33/486 , H01L25/0753 , H01L2224/32188 , H01L2224/48091 , H01L2224/48247 , H01L2924/01327 , H01L2924/078 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a light emitting diode package capable of improving light efficiency of light emitted from an LED chip, and to provide a method of manufacturing the light emitting diode package. SOLUTION: The light emitting diode package includes a substrate having a plurality of sub patterns adhered by an insulation adhesive, the LED chip mounted on the substrate and electrically connected to the substrate and a molding cap covering the LED chip. COPYRIGHT: (C)2009,JPO&INPIT

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式