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81. 发明申请

WO2005094147A1 A PROCESS OF FORMING A SOLDER MASK 审中-公开
标题翻译：形成焊接掩模的过程
公开(公告)号：WO2005094147A1
公开(公告)日：2005-10-06
申请号：PCT/NL2005/000213
申请日：2005-03-21
申请人： DSM IP ASSETS B.V. , BINDA, Paul, Herman, Guillaume , MISEV, Tosko, Alexandar
发明人： BINDA, Paul, Herman, Guillaume , MISEV, Tosko, Alexandar
IPC分类号： H05K3/28
CPC分类号： H05K3/28 , H05K2203/105 , H05K2203/1355
摘要： The invention relates to a process of forming a solder mask on a printed circuit board comprising the steps of (a) charging powder paint particles in the presence of carrier particles (b) feeding the charged powder paint particles with carrier particles to a transporter (c) (optionally) transferring the charged powder paint particles from the transporter onto a transfer medium and (d) applying the powder paint particles to a printed circuit board to form a layer of powder paint particles.
摘要翻译：本发明涉及一种在印刷电路板上形成焊料掩模的方法，包括以下步骤：（a）在载体颗粒存在下（b）将带电荷的粉末涂料颗粒与载体颗粒一起送入转运体（c））（任选地）将带电的粉末涂料颗粒从转运体转移到转印介质上，和（d）将粉末涂料颗粒施加到印刷电路板上以形成一层粉末涂料颗粒。

82. 发明申请

WO1991003770A1 RESISTS 审中-公开
标题翻译：抵抗
公开(公告)号：WO1991003770A1
公开(公告)日：1991-03-21
申请号：PCT/GB1990001401
申请日：1990-09-11
申请人： COATES BROTHERS PLC , IVORY, Nicholas, Eric
发明人： COATES BROTHERS PLC
IPC分类号： G03F07/16
CPC分类号： G03F7/164 , H05K3/0079 , H05K2203/1105 , H05K2203/1355
摘要： In a process for the production of a patterned resist layer upon a substrate by the steps of: (i) forming a layer of radiation-sensitive material upon the substrate; (ii) imagewise exposing the layer of radiation-sensitive material to radiation to thereby cure portions of the layer exposed to the radiation; and (iii) removing uncured (unexposed) portions of the layer to form a patterned layer of cured material upon the substrate; the layer of radiation-sensitive material is formed upon the substrate by applying a layer of a powdered solid radiation-sensitive material to the substrate, heating the powdered material to cause it to melt or soften to form a continuous layer of radiation-sensitive material upon the substrate, and allowing the continuous layer to solidify.
摘要翻译：在通过以下步骤在衬底上生产图案化抗蚀剂层的方法中：（i）在衬底上形成辐射敏感材料层; （ii）将辐射敏感材料层成像曝光于辐射，从而固化暴露于辐射的层的部分; 和（iii）去除所述层的未固化（未曝光）部分以在所述基材上形成图案化的固化材料层; 通过将一层粉状固体辐射敏感材料施加到基底上，将辐射敏感材料层形成在基底上，加热粉末材料使其熔化或软化以形成连续的辐射敏感材料层底物，并允许连续层固化。

83. 发明申请

US20170009976A1 LIGHT SOURCE MODULE, FABRICATION METHOD THEREFOR, AND LIGHTING DEVICE INCLUDING THE SAME 审中-公开
标题翻译：光源模块，其制造方法和包括其的照明装置
公开(公告)号：US20170009976A1
公开(公告)日：2017-01-12
申请号：US15153082
申请日：2016-05-12
申请人： LG ELECTRONICS INC.
发明人： Jaepyo HONG , Jaechan KIM , Injoong KIM , Hyeuk CHANG , Sumin JUN
IPC分类号： F21V29/74
CPC分类号： F21V29/74 , H01L33/62 , H01L33/64 , H01L33/642 , H05K1/053 , H05K3/38 , H05K2201/0376 , H05K2201/0969 , H05K2201/10106 , H05K2201/2072 , H05K2203/107 , H05K2203/1355
摘要： A light source module includes at least one light source emitting light, and a body supporting the light source. The body includes a heat sink absorbing heat from the light source and dissipating the heat to the outside, an insulating layer having electrical insulating properties, the insulating layer being provided on at least one surface of the heat sink, and a conductive layer provided on the insulating layer to enable electric current to flow therein. The conductive layer includes an electrically conductive layer providing a path region in which electric current is applied to the light source, and a heat dissipation conductive layer diffusing generated by the light source. Accordingly, it is possible to obtain effects such as rapid fabrication processes, inexpensive fabrication cost, facilitation of mass production, improvement of product yield, and promotion of heat dissipation. Furthermore, it is possible to obtain various effects that can be understood through configurations described in embodiments.
摘要翻译：光源模块包括发射光的至少一个光源和支撑光源的主体。本体包括从光源吸收热量并将热量散发到外部的散热器，具有电绝缘性能的绝缘层，绝缘层设置在散热器的至少一个表面上，以及设置在该散热片上的导电层绝缘层以使电流流过其中。导电层包括提供电流施加到光源的路径区域的导电层和由光源产生的散热导电层。因此，可以获得诸如快速制造工艺，廉价的制造成本，便于批量生产，提高产品产量以及促进散热的效果。此外，可以获得通过实施例中描述的配置可以理解的各种效果。

84. 发明授权

US09185822B2 Thermal dissipation techniques for multi-sensory electromechanical products packaged in sealed enclosures 有权
标题翻译：封装在密封外壳中的多感觉机电产品的散热技术
公开(公告)号：US09185822B2
公开(公告)日：2015-11-10
申请号：US13493792
申请日：2012-06-11
申请人： Shridhara Shanbhogue , ShanoPrasad Kunjappan , Ashutosh Kumar Pandey , ArulSelvam Arumugam , Ramkrishna U. Pal , Dathathreya Durgadhahalli Ganesh
发明人： Shridhara Shanbhogue , ShanoPrasad Kunjappan , Ashutosh Kumar Pandey , ArulSelvam Arumugam , Ramkrishna U. Pal , Dathathreya Durgadhahalli Ganesh
IPC分类号： G06F1/16 , H05K5/00 , H05K7/20 , H05K7/14 , H05K1/14 , H05K9/00
CPC分类号： H05K7/142 , H05K1/144 , H05K5/0026 , H05K7/20409 , H05K9/0083 , H05K2203/1355
摘要： In general, the disclosure is directed to sealed enclosures and devices that include enclosures for protecting enclosed heat sensitive components from the heat generated by enclosed heat producing components. Heat producing components within the enclosure may be placed to achieve uniform distribution of heat produced by the heat producing components, to optimize the dissipation of heat from the heat producing components to the enclosure, and to minimize the heat experienced by the heat sensitive components. The exterior of the enclosure may be designed to increase thermal dissipation and to protect against thermal radiation.
摘要翻译：通常，本公开涉及密封的外壳和装置，其包括用于保护封闭的热敏组件免于由封闭的发热部件产生的热量的外壳。可以放置外壳内的产热部件以实现由发热部件产生的热量的均匀分布，以优化从发热部件到外壳的热耗散，并使热敏部件的热量最小化。外壳的外部可以设计成增加热耗散并防止热辐射。

85. 发明授权

US08715780B2 Method and device for producing a plastic coating 有权
标题翻译：用于生产塑料涂层的方法和装置
公开(公告)号：US08715780B2
公开(公告)日：2014-05-06
申请号：US13054565
申请日：2010-02-19
申请人： Alex Bruderer , Jurgen Herbert , Max Hunziker , Michel Probst
发明人： Alex Bruderer , Jurgen Herbert , Max Hunziker , Michel Probst
IPC分类号： B05D1/26 , B05D3/00 , B05C19/04
CPC分类号： B05C19/04 , B05C9/12 , B05C9/14 , B05C19/02 , B05C19/06 , B05D1/30 , B05D3/007 , B05D3/0254 , B05D2401/32 , H05K3/022 , H05K2201/0358 , H05K2203/1355 , H05K2203/1545
摘要： Method for producing a plastic layer having a layer thickness of less than 200 μm on an upper side of a substrate includes the following steps: applying plastic powder to the substrate upper side by means of a powder scattering device, then cleaning the substrate underside, then melting the applied plastic powder in a furnace, as a result of which the plastic layer is formed on the substrate, and cooling the substrate, wherein the substrate is transported continuously from method step to method step.
摘要翻译：在基板的上侧制造层厚度小于200μm的塑料层的方法包括以下步骤：通过粉末散射装置将塑料粉末施加到基板上侧，然后清洁基板下侧，然后在炉中熔化所施加的塑料粉末，由此在衬底上形成塑料层，并冷却衬底，其中衬底从方法步骤连续输送到方法步骤。

86. 发明申请

US20120085573A1 STACKED STRUCTURE AND METHOD OF MANUFACTURING THE SAME 审中-公开
标题翻译：堆叠结构及其制造方法
公开(公告)号：US20120085573A1
公开(公告)日：2012-04-12
申请号：US13377882
申请日：2010-05-07
申请人： Hitoshi Noguchi , Naoki Tanaka , Tatsuya Nakamura
发明人： Hitoshi Noguchi , Naoki Tanaka , Tatsuya Nakamura
IPC分类号： H05K1/16 , H05K3/10
CPC分类号： H05K1/162 , H01G4/1209 , H01G4/30 , H01G4/33 , H05K2201/0195 , H05K2203/1355
摘要： A problem to be solved is to suppress deterioration of insulating properties in a stacked structure with a dielectric film formed by powder spraying coating process, and in a method of manufacturing the stacked structure. In a stacked structure according to the present invention, a dielectric layer 3 is provided between a first conductive layer 1 and a second conductive layer 2. The dielectric layer 3 includes an underlying layer 31 formed by applying a dispersion solution containing dielectric particles onto the first conductive layer 1, and a dielectric film 32 formed on the underlying layer 31 by powder spraying coating process. A method of manufacturing the stacked structure according to the present invention includes a dielectric layer forming step of forming the dielectric layer 3 on the first conductive layer 1, and a conductive layer forming step of forming the second conductive layer 2 on the dielectric layer 3. The dielectric layer forming step includes an underlying layer forming step of forming the underlying layer 31 by applying a dispersion solution containing dielectric particles onto the first conductive layer 1, and a dielectric film forming step of forming the dielectric film 32 on the underlying layer 31 by powder spraying coating process.
摘要翻译：要解决的问题是通过用粉末喷涂法形成的电介质膜来抑制层叠结构中的绝缘性的劣化，以及制造层叠结构的方法。在根据本发明的堆叠结构中，电介质层3设置在第一导电层1和第二导电层2之间。电介质层3包括通过将包含电介质颗粒的分散溶液施加到第一导电层1上而形成的下层31 导电层1和通过粉末喷涂法在下层31上形成的电介质膜32。根据本发明的制造叠层结构的方法包括在第一导电层1上形成电介质层3的介电层形成步骤和在电介质层3上形成第二导电层2的导电层形成步骤。电介质层形成步骤包括通过将含有电介质颗粒的分散溶液施加到第一导电层1上形成下层31的下层形成步骤，以及电介质膜形成步骤，通过在第一导电层1上形成介电膜32在下层31上粉末喷涂工艺。

87. 发明申请

US20070101573A1 Manufacturing method of three-dimensional circuit board 审中-公开
标题翻译：三维电路板的制造方法
公开(公告)号：US20070101573A1
公开(公告)日：2007-05-10
申请号：US11594785
申请日：2006-11-09
申请人： Yasufumi Masaki , Masahide Mutou , Takashi Shindou , Masato Kawashima , Yoshio Mori , Tsuguo Wada , Yoshiyuki Uchinono , Norimasa Kaji
发明人： Yasufumi Masaki , Masahide Mutou , Takashi Shindou , Masato Kawashima , Yoshio Mori , Tsuguo Wada , Yoshiyuki Uchinono , Norimasa Kaji
IPC分类号： H05K3/10 , B23P17/00
CPC分类号： H05K3/10 , H05K1/0284 , H05K1/053 , H05K1/056 , H05K1/183 , H05K3/0058 , H05K3/16 , H05K3/44 , H05K2201/0382 , H05K2201/09036 , H05K2203/0323 , H05K2203/105 , H05K2203/1355 , H05K2203/1366 , Y10T29/49128 , Y10T29/49155 , Y10T29/49798
摘要： In order to obtain a 3D circuit board manufacturing method capable of improving productivity and accuracy of circuit formation, the metal hoop material 1 provided with the positioning pilot holes 2 is employed. Since the 3D structures 3 are formed on the hoop material 1 with a preset interval maintained therebetween in a lengthwise direction of the hoop material 1, the series of processes can be conducted on a roll 1A (winding of the hoop material 1) basis, which results that handling between the individual processes can be done more easily while increase of troubles and manufacturing costs can be prevented. Further, since the positioning pilot holes 2 serve to facilitate accurate positioning, plating and/or laser processing can be conducted continuously with high precision while a tact time for the positioning work can be reduced.
摘要翻译：为了获得能够提高电路形成的生产率和精度的3D电路板的制造方法，使用具有定位导向孔2的金属箍材1。由于三维结构体3在环箍材料1上沿环箍材料1的长度方向以预定的间隔形成在一起，所以可以在卷1A（环箍材1的卷绕）的基础上进行一系列的处理，结果，可以更容易地进行各个处理之间的处理，同时可以防止麻烦和制造成本的增加。此外，由于定位导向孔2用于促进精确的定位，因此可以以高精度连续地进行电镀和/或激光加工，同时可以减少定位工作的节拍时间。

88. 发明申请

US20030170568A1 UV curable powder suitable for use as a photoresist 审中-公开
标题翻译：适用于光致抗蚀剂的紫外线固化粉末
公开(公告)号：US20030170568A1
公开(公告)日：2003-09-11
申请号：US10283362
申请日：2002-10-30
发明人： Tosko A. Misev , Svetlana A. Bratslavsky , Robert Van De Berg Jeths , Paul H. Binda , Steven R. Schmid
IPC分类号： G03C001/725
CPC分类号： G03F7/027 , G03F7/031 , G03F7/032 , G03F7/033 , G03F7/035 , G03F7/164 , G03F7/32 , H05K3/0079 , H05K3/064 , H05K2203/105 , H05K2203/1355
摘要： The invention relates to a radiation curable powder photoresist composition comprising the components A a polymer, B a reactive compound having unsaturated groups and C a free radical photoinitiator, wherein the powder photoresist composition is soluble in a developer and wherein the powder photoresist composition has a Tg between 40 and 120null C.
摘要翻译：本发明涉及一种可辐射固化粉末光致抗蚀剂组合物，其包含组分A为聚合物，B为具有不饱和基团的反应性化合物，C为自由基光引发剂，其中所述粉末光致抗蚀剂组合物可溶于显影剂，并且其中所述粉末光致抗蚀剂组合物具有Tg 在40和120℃之间

89. 发明授权

US4254163A Strippable resists 失效
标题翻译：耐剥离性
公开(公告)号：US4254163A
公开(公告)日：1981-03-03
申请号：US29951
申请日：1979-04-13
申请人： John R. Piazza
发明人： John R. Piazza
IPC分类号： B41M7/02 , C23F1/02 , H05K3/06
CPC分类号： B41M7/02 , C23F1/02 , H05K3/061 , H05K2203/0522 , H05K2203/1355
摘要： A printed circuit board is formed from a metal-clad substrate by applying a solvent-free, non-dryable ink in a predetermined pattern on the substrate, dusting powdered resin over the surface, removing any resin powder not retained by the ink from the surface, heating the substrate having the ink powder thereon to a temperature so as to fuse the powdered resin to form a strippable resist, etching the uncoated portion of the metal laminate and stripping the resist subsequent to etching.
摘要翻译：印刷电路板由金属包覆基板形成，通过在基板上施加预定图案的无溶剂的不可干燥的油墨，在表面上撒粉状树脂，从表面除去未被油墨保留的任何树脂粉末将其上具有油墨粉末的基板加热到一定温度以熔化粉末状树脂以形成可剥离抗蚀剂，蚀刻金属层压板的未涂覆部分并在蚀刻后剥离抗蚀剂。

90. 发明授权

US4107837A Method of fabricating a printed circuit board 失效
标题翻译：制造印刷电路板的方法
公开(公告)号：US4107837A
公开(公告)日：1978-08-22
申请号：US785480
申请日：1977-04-07
申请人： Joseph Jawshin Chang
发明人： Joseph Jawshin Chang
IPC分类号： B32B15/08 , H05K1/05 , H05K3/00 , H05K3/44
CPC分类号： H05K1/056 , H05K3/445 , H05K2201/09827 , H05K2203/105 , H05K2203/1355 , H05K2203/1545 , H05K3/0097 , Y10T29/49165 , Y10T29/49224
摘要： A method of fabricating a printed circuit board is disclosed. The method comprises forming a metal substrate having a through-hole pattern. The metal substrate is coated with a dielectric powder having a suitable flow length value to form a dielectric coat on the substrate having a sufficient through-hole edge coverage. The dielectric coated substrate is then treated with a second powder to form a satisfactory topcoat thereon. Electrical circuitry is then formed on the topcoat in conjunction with the through hole pattern.
摘要翻译：公开了一种制造印刷电路板的方法。该方法包括形成具有通孔图案的金属基板。用具有合适流动长度值的电介质粉末涂覆金属基底，以在具有足够的通孔边缘覆盖的基底上形成电介质涂层。然后用第二粉末处理电介质涂覆的基底以在其上形成令人满意的外涂层。然后结合通孔图案在顶涂层上形成电路。

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