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    • 85. 发明公开
    • Fabrication of electronic devices with an internal window
    • 芬斯特·芬克斯(Anstenung von elektronischen)Anordnungen mit internem Fenster。
    • EP0618625A2
    • 1994-10-05
    • EP94302070.1
    • 1994-03-23
    • AT&T Corp.
    • Vakhshoori, DaryooshWynn, James DennisZydzik, George John
    • H01L33/00H01S3/085H01L21/266H01S3/19
    • H01S5/18327H01L33/0062H01S5/0201H01S5/2063H01S5/423
    • A process is described of producing devices, such as vertical cavity surface emitting lasen or resonant cavity light emitting devices, with an insulating region between an active region and top electrode, the insulating region having a centrally located window permitting passage of the electric current from the top electrode to the bottom electrode centrally of the active region. The insulating region is formed by ion implantation. The window is defined by a photoresist mask formed by angle etching a photoresist masking layer by RIE, so as to form the mask with parallel side walls inclined at an angle to the normal to the masked surface. The ion implantation is conducted at the same angle and parallel to the side walls of the of the mask. This permits fabrication of devices individually or in arrays. An exemplary independently addressable top emitting 8×18 VCSEL array (VCSELA) with GaAs multi-quantum well gain region was fabricated with excellent properties using the angle etched masks. The typical threshold current and voltage of the exemplary devices in this array are approximately 4 mA and 2.65V respectively. The L-I-V characteristics of the devices do not change by current annealing. Also, a comparison between devices produced by using the novel angled implantation mask and devices produced by using conventional lithography implantation mask indicates the importance of the implantation mask preparation on the final VCSEL operating characteristics.
    • 具有在绝缘离子注入区域中具有内部窗口的制造电子器件,所述器件包括半导体结构以及顶部和底部金属电极到该结构,包括在电极的顶表面上沉积足够厚度的光致抗蚀剂层 防止注入离子到达顶部电极下方的半导体材料,图案化光致抗蚀剂层,并将质子离子注入到半导体材料中,形成具有居中定位的窗口的绝缘区域。 其中光致抗蚀剂层通过用RIE进行角度蚀刻来图案化,以产生掩模图案侧壁,其倾斜预定角度,切割成与顶表面垂直并且彼此平行,并且离子的注入在 与光致抗蚀剂图案的侧壁平行的角度。
    • 90. 发明公开
    • Surface-emitting type semiconductor laser
    • OberflächenemittierenderHalbleiterlaser
    • EP1876679A1
    • 2008-01-09
    • EP07013248.5
    • 2007-07-06
    • Seiko Epson Corporation
    • Mochizuki, Masamitsu
    • H01S5/183
    • H01S5/18386H01S5/18311H01S5/18327H01S2301/166H01S2301/176
    • A surface-emitting type semiconductor laser includes: a lower mirror (10); an active layer (103) formed above the lower mirror (10); and an upper mirror (20) formed above the active layer (103), wherein the upper mirror (20) includes a first region (70) in which a plurality of holes (60) are formed and a second region (72) inside the first region (70) in which no hole is formed, the second region (72) is in a circular shape as viewed in a plan view, the circular shape has a radius with which an energy increasing rate in the active layer (103) becomes positive with a lower-order resonance mode component and becomes negative with a higher-order resonance mode component, and the holes (60) have a depth with which the energy increasing rate becomes positive with the lower-order resonance mode component, and becomes negative with the higher-order resonance mode component.
    • 表面发射型半导体激光器包括:下反射镜(10); 形成在所述下反射镜(10)上方的活性层(103); 以及形成在所述有源层(103)上方的上反射镜(20),其中所述上反射镜(20)包括其中形成有多个孔(60)的第一区域(70)和位于所述第一区域 没有形成孔的第一区域(70),第二区域(72)在平面图中呈圆形,圆形形状具有活性层(103)中的能量增加率成为的半径 具有较低阶共振模式分量的正值,并且随着高次谐振模式分量而变为负,并且空穴(60)具有随着低次谐振模式分量而增加能量变为正的深度,并且变为负 具有高次谐振模式分量。