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    • 82. 发明授权
    • Thick film resistive paint and resistors made therefrom
    • 厚膜电阻涂料和电阻由其制成
    • US4639391A
    • 1987-01-27
    • US711983
    • 1985-03-14
    • Charles C. Y. Kuo
    • Charles C. Y. Kuo
    • C09D5/24C03C3/064C03C8/22C04B41/50C04B41/87C09D5/25H01C7/00H01C7/06H01C17/06H01C17/065H01C17/232H01B1/06
    • H01C7/06C03C3/064C03C8/22C04B41/5071C04B41/87H01C17/0656H01C17/0658H01C17/232Y10T29/49099Y10T428/24926
    • This invention relates to thick film base metal resistive paints for firing on a substrate to form a resistor having a temperature coefficient of resistance within .+-.100 ppm/.degree.C., while providing a means to selectively blend the resistive paint to provide a wide range of decade resistivities from less than 10 ohms/square to more than 1K ohms/square. The sheet resistance and TCR are controlled by mixing a glass frit from at least one of a first and second glass material; with TiSi.sub.2 ; and at least one of Ti.sub.5 Si.sub.3 and AL.sub.2 O.sub.3 ; and a screening agent, for subsequent screening onto a substrate and firing in an inert atmosphere at a peak temperature of about 900.degree. C. The first glass material comprises, by weight, 5 to 10% SiO.sub.2 ; 30 to 50% BaO; 40 to 60% B.sub.2 O.sub.3 and 1 to 5% CuO. The second glass material comprises, by weight, 50 to 70% B.sub.2 O.sub.3 ; 25 to 45% SrO; and 2 to 10% SiO.sub.2. The quantity of the glass material is increased to raise sheet resistance in ohms per square, and to lower the value of the TCR. The quantity of TiSi.sub.2 is increased to lower sheet resistance in ohms per square, and to raise the TCR. The quantity to TiSi.sub.2 is increased to lower sheet resistance in ohms per square, and to raise the TCR. The quantity of Ti.sub.5 Si.sub.3 is increased to lower the sheet resistance in ohms per square, and to lower the TCR. The quantity of Al.sub.2 O.sub.3 is increased to raise the sheet resistance in ohms per square, and to lower the TCR. The screening agent preferably has no carbon residue when pyrolytically decomposed during firing in an inert atmosphere.
    • 本发明涉及用于在基板上烧制以形成电阻温度系数在+/- 100ppm /℃之内的电阻器的厚膜母材电阻涂料,同时提供选择性地混合电阻涂料以提供宽 十倍电阻范围从小于10欧姆/平方至超过1K欧姆/平方。 通过混合来自第一和第二玻璃材料中的至少一种的玻璃料来控制薄层电阻和TCR; 与TiSi2; 和Ti 5 Si 3和Al 2 O 3中的至少一种; 和筛选剂,用于随后在基材上的筛选和在约900℃的峰值温度下在惰性气氛中焙烧。第一玻璃材料包含5至10重量%的SiO 2; 30〜50%BaO; 40〜60%的B2O3和1〜5%的CuO。 第二玻璃材料按重量计包含50至70%的B2O3; 25〜45%的SrO; 和2至10%的SiO 2。 增加玻璃材料的量以提高每平方厘米的薄层电阻,并降低TCR的值。 TiSi2的量增加到以每平方欧姆为单位的薄层电阻降低,并提高TCR。 TiSi2的量增加到以每平方欧姆为单位的薄层电阻降低,并提高TCR。 增加Ti5Si3的量以降低每平方厘米的薄层电阻,并降低TCR。 增加Al 2 O 3的量以提高每平方厘米的薄层电阻,并降低TCR。 筛选剂优选在惰性气氛中煅烧时热分解时不含碳残留物。
    • 84. 发明授权
    • Composition for metalizing ceramic
    • 用于金属化陶瓷的组合物
    • US3661595A
    • 1972-05-09
    • US3661595D
    • 1970-02-16
    • COORS PORCELAIN CO
    • BUCK ROBERT W
    • C04B41/51C09D5/38H01C17/065H05K1/09C09D5/24
    • H01C17/0656C04B41/5138C04B41/5183C09D5/38H05K1/092
    • The subject matter of this invention is a composition and method for metalizing ceramic wherein the composition is a mixture containing manganese, molybdenum and silicon, at least a portion of the latter being present as molybdenum disilicide or tungsten disilicide, molybdenum disilicide being much preferred. The mixture, in powdered form, is suspended in an organic vehicle to provide a slurry which is coated onto the ceramic after which the ceramic is fired in a wet reducing atmosphere to a temperature of about 1150* C to 1450* C, the organic vehicle vaporizing during the initial phase of the firing operation. By inclusion of the disilicide in the mixture an improved metalized surface on the ceramic can be accomplished using relatively a low firing temperature.
    • 本发明的主题是用于金属化陶瓷的组合物和方法,其中组合物是含有锰,钼和硅的混合物,其中至少一部分作为二硅化钼或二硅化钨存在,二硅化钼是非常优选的。 将粉末状混合物悬浮在有机载体中以提供涂覆在陶瓷上的浆料,然后将陶瓷在湿还原气氛中焙烧至约1150℃至1450℃的温度,有机载体 在点火操作的初始阶段期间汽化。 通过在混合物中包含二硅化物,可以使用相对低的烧制温度来实现陶瓷上改进的金属化表面。