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    • 84. 发明申请
    • SEMICONDUCTOR INSPECTION SYSTEM
    • 半导体检测系统
    • US20140219545A1
    • 2014-08-07
    • US14234977
    • 2012-07-20
    • Akiyuki SugiyamaYuichi Abe
    • Akiyuki SugiyamaYuichi Abe
    • G06T7/00
    • G06T7/001G01B15/08H01L22/12H01L2924/0002H01L2924/00
    • When the lengths of FEM wafers are automatically measured, not only the sizes of targets, the lengths of which are to be measured, are often varied from those in registration, but also the patterns of the targets are often deformed. Therefore, it is difficult to automatically determine whether the length measurement is possible or not. Therefore, the following are executed with a semiconductor inspection system: (1) a process of identifying the position of the contour line of an inspected image using a distance image calculated from a reference image, (2) a process of calculating a defect size image based on the position of the contour line with respect to the identified distance image, and detecting a defect candidate from the defect size image, and (3-1) a process of, upon detection of the defect candidate, calculating the size of the detected defect candidate, or (3-2) a process of detecting a portion different between the first and second contour lines as the defect candidate.
    • 当自动测量有限元晶片的长度时,不仅要测量其长度的目标的尺寸通常与注册的尺寸不同,而且目标的图案也经常变形。 因此,难以自动确定长度测量是否可行。 因此,使用半导体检查系统执行以下操作:(1)使用从参考图像计算的距离图像来识别被检查图像的轮廓线的位置的处理,(2)计算缺陷尺寸图像的处理 基于所述轮廓线相对于所识别的距离图像的位置,以及从所述缺陷尺寸图像检测缺陷候选,以及(3-1)在检测到所述缺陷候选时,计算所检测到的所述缺陷候选的大小的处理 缺陷候选者,或(3-2)检测第一和第二轮廓线之间的部分的缺陷候选的处理。
    • 85. 发明申请
    • PROJECTION DETECTING APPARATUS AND PROJECTION DETECTING METHOD
    • 投影检测装置和投影检测方法
    • US20110241924A1
    • 2011-10-06
    • US13126061
    • 2010-09-15
    • Masahiro YamamotoMitsutoshi KenmochiToshihiro Sasaki
    • Masahiro YamamotoMitsutoshi KenmochiToshihiro Sasaki
    • G01B15/08G01N22/02
    • G01B15/08G01S13/04
    • A projection detecting apparatus according to the present invention is that for detecting a projection on a surface of a running metal object, and includes a transmission antenna for radiating electromagnetic waves; a reception antenna for receiving reflected electromagnetic waves; and a transmission and reception signal processing section for processing a transmission signal and a reception signal. The transmission antenna and the reception antenna have unidirectionality and the transmission antenna and the reception antenna are installed in such a way that the reception antenna does not catch electromagnetic waves which have been radiated by the transmission antenna and reflected on the surface of the metal object and the reception antenna catches electromagnetic waves alone which have been radiated by the transmission antenna and reflected on the projection.
    • 根据本发明的投影检测装置是用于检测行进的金属物体的表面上的突起,并且包括用于辐射电磁波的发射天线; 用于接收反射电磁波的接收天线; 以及发送和接收信号处理部分,用于处理发送信号和接收信号。 发送天线和接收天线具有单方向性,发送天线和接收天线的安装方式使得接收天线不会捕获被发送天线辐射并在金属物体的表面上反射的电磁波, 接收天线捕获由发射天线辐射并在投影上反射的单独的电磁波。
    • 87. 发明申请
    • Method of determining the irregularities of a hole
    • 确定孔的不规则性的方法
    • US20050090999A1
    • 2005-04-28
    • US10954254
    • 2004-09-29
    • Hyo-Cheon Kang
    • Hyo-Cheon Kang
    • H01L21/66G01B15/08G01B7/00
    • G01B15/08
    • In a method of calculating irregularities of a hole, a center coordinate of an actual hole is set. Inner wall coordinates of the actual hole are obtained from the center coordinate of the actual hole. An area of the actual hole is determined based on the inner wall coordinates of the actual hole. A radius of a virtual hole is determined based on the area of the actual hole. A center coordinate of the virtual hole is determined based on the inner wall coordinates of the actual hole to obtain a circumference line of the virtual hole. A standard deviation of the inner wall coordinates of the actual hole relative to the circumference line of the virtual hole is calculated, thereby obtaining the irregularities of the actual hole.
    • 在计算孔的凹凸的方法中,设定实际孔的中心坐标。 实际孔的内壁坐标是从实际孔的中心坐标得到的。 基于实际孔的内壁坐标确定实际孔的面积。 基于实际孔的面积确定虚拟孔的半径。 基于实际孔的内壁坐标来确定虚拟孔的中心坐标,以获得虚拟孔的圆周线。 计算出实际孔相对于虚拟孔的圆周线的内壁坐标的标准偏差,从而获得实际孔的凹凸。
    • 88. 发明申请
    • Pattern inspection method
    • 图案检验方法
    • US20040195507A1
    • 2004-10-07
    • US10752527
    • 2004-01-08
    • Atsuko YamaguchiHiroshi FukudaRyuta TsuchiyaHiroki KawadaShozo Yoneda
    • G01N023/00
    • G01B15/04G01B15/08
    • The present invention may include a pattern inspection method of extracting a pattern edge shape from an image obtained by a scanning microscope and inspecting the pattern. A control section and a computer of the scanning microscope process the intensity distribution of reflected electrons or secondary electrons, find the distribution of gate lengths in a single gate from data about edge positions, estimate the transistor performance by assuming a finally fabricated transistor to be a parallel connection of a plurality of transistors having various gate lengths, and determine the pattern quality and grade based on an estimated result. In this manner, it is possible to highly, accurately and quickly estimate an effect of edge roughness on the device performance and highly accurately and efficiently inspect patterns in accordance with device specifications.
    • 本发明可以包括从由扫描显微镜获得的图像中提取图案边缘形状并检查图案的图案检查方法。 扫描显微镜的控制部分和计算机处理反射电子或二次电子的强度分布,从关于边缘位置的数据中找到单个栅极中栅极长度的分布,通过假设最终制造的晶体管为 具有各种栅极长度的多个晶体管的并联连接,并且基于估计结果确定图案质量和等级。 以这种方式,可以高度,准确和快速地估计边缘粗糙度对器件性能的影响,并且根据器件规格高精度和有效地检查图案。