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    • 81. 发明申请
    • Electrode forming method
    • 电极成型方法
    • US20060225994A1
    • 2006-10-12
    • US10525202
    • 2003-08-25
    • Kazuo OnishiShingo Sewa
    • Kazuo OnishiShingo Sewa
    • H01H57/00B05D5/12
    • C23C18/1648C23C18/1658C23C18/166C23C18/31C23C26/02Y10T156/10
    • The present invention provides an electrode forming method in which an electrode layer is formed on a solid electrolyte, capable of obtaining an electrode layer having a large electrode surface area, decreasing the number of steps required in formation of the electrode layer and reducing a human labor and time. The electrode forming method of the invention is an electrode forming method, in which a metal salt solution and a reducing agent solution are disposed on respective both sides of a solid electrolyte form and the metal salt solution is caused to pass through the solid electrolyte form by osmosis to thereby deposit a metal near the interface on the reducing agent solution side of the solid electrolyte form to thereby form the electrode on the solid electrolyte form.
    • 本发明提供一种电极形成方法,其中电极层形成在固体电解质上,能够获得具有大的电极表面积的电极层,减少形成电极层所需的步骤数量并减少人力 和时间。 本发明的电极形成方法是电极形成方法,其中金属盐溶液和还原剂溶液设置在固体电解质形式的两侧,并且使金属盐溶液通过固体电解质形式通过 从而在固体电解质形式的还原剂溶液侧的界面附近沉积金属,从而在固体电解质形式上形成电极。
    • 87. 发明申请
    • METHOD OF METAL DEPOSITION
    • 金属沉积方法
    • WO2012042203A3
    • 2012-12-27
    • PCT/GB2011001402
    • 2011-09-28
    • UNIV LANCASTERBOXALL COLINBROMLEY MICHAEL
    • BOXALL COLINBROMLEY MICHAEL
    • C23C18/18C23C18/16C23C18/31C23C18/44
    • H01L21/02697C23C18/14C23C18/1601C23C18/1603C23C18/1605C23C18/1642C23C18/1648C23C18/1667C23C18/1851C23C18/1879C23C18/31C23C18/44
    • A method of forming a metal layer on an electrically insulating substrate comprises depositing a photocatalyst layer onto the substrate and depositing a mask layer comprising voids on the substrate, such as a layer of latex microparticles with voids between them, to give an open pore structure to the mask. An electroless plating solution is then provided on the photocatalyst layer, and the photocatalyst layer and electroless plating solution are illuminated with actinic radiation whereby deposition of metal from the electroless plating solution to form a metal layer on the photocatalyst layer is initiated whereby the metal deposits in the voids of the mask layer. The mask layer is subsequently removed to leave a porous metal layer on the substrate. The method allows for deposition of porous metal films with controlled thickness and excellent adhesion onto electrically insulating substrates. The method is suitable for providing metal layers with controlled, regular porosity.
    • 在电绝缘基板上形成金属层的方法包括将光催化剂层沉积到基板上,并在基板上沉积包括空隙的掩模层,例如在它们之间具有空隙的胶乳微粒层,以得到开孔结构以 面具。 然后在光催化剂层上提供无电镀溶液,用光化辐射照射光催化剂层和无电镀溶液,由此开始从无电镀溶液中沉积金属以在光催化剂层上形成金属层,由此金属沉积在 掩模层的空隙。 随后移除掩模层以在衬底上留下多孔金属层。 该方法允许沉积具有可控厚度的多孔金属膜并且在电绝缘基底上具有优异的粘附性。 该方法适用于提供具有可控,规则孔隙度的金属层。