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81. 发明申请

US20120228143A1 Method for Electrochemical Fabrication 有权
公开(公告)号：US20120228143A1
公开(公告)日：2012-09-13
申请号：US13441573
申请日：2012-04-06
申请人： Adam L. Cohen
发明人： Adam L. Cohen
IPC分类号： C25D5/02
CPC分类号： C25D5/10 , B33Y10/00 , B33Y70/00 , B81C1/00126 , B81C2201/0181 , B81C2201/0197 , B81C2201/032 , C25D1/00 , C25D1/003 , C25D5/022 , C25D5/12 , C25D5/22 , C25D17/06 , H01L21/2885 , H05K3/241 , Y10T428/12486 , Y10T428/239
摘要： An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the first substrate, is disclosed. Electroplating articles and electroplating apparatus are also disclosed.

82. 发明授权

US07981269B2 Method of electrochemical fabrication 有权
标题翻译：电化学加工方法
公开(公告)号：US07981269B2
公开(公告)日：2011-07-19
申请号：US11927369
申请日：2007-10-29
申请人： Adam L. Cohen
发明人： Adam L. Cohen
IPC分类号： C25D5/02
CPC分类号： C25D5/10 , B33Y10/00 , B33Y70/00 , B81C1/00126 , B81C2201/0181 , B81C2201/0197 , B81C2201/032 , C25D1/00 , C25D1/003 , C25D5/022 , C25D5/12 , C25D5/22 , C25D17/06 , H01L21/2885 , H05K3/241 , Y10T428/12486 , Y10T428/239
摘要： An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the first substrate, is disclosed. Electroplating articles and electroplating apparatus are also disclosed.
摘要翻译：一种电镀方法，包括：a）使第一衬底与第一制品接触，所述第一制品包括衬底和以衬底形式设置的贴合掩模; b）以第一图案将来自金属离子源的第一金属电镀到所述第一基板上，所述第一图案对应于所述适形掩模图案的所述补体; 和c）从第一基板上去除第一制品。还公开了电镀制品和电镀装置。

83. 发明申请

US20100314258A1 Electrochemical Fabrication Processes Incorporating Non-Platable Metals and/or Metals that are Difficult to Plate On 审中-公开
标题翻译：掺入难以镀上的不可镀金属和/或金属的电化学制造工艺
公开(公告)号：US20100314258A1
公开(公告)日：2010-12-16
申请号：US12816914
申请日：2010-06-16
申请人： Adam L. Cohen , Michael S. Lockard , Gang Zhang
发明人： Adam L. Cohen , Michael S. Lockard , Gang Zhang
IPC分类号： C25D5/00
CPC分类号： C25D5/00 , B33Y10/00 , B81C99/0095 , B81C2201/0181 , C23C4/02 , C23C18/1605 , C23C18/1651 , C23C26/00 , C23C28/021 , C23C28/023 , C23C28/028 , C25D1/003
摘要： Embodiments are directed to electrochemically fabricating multi-layer three dimensional structures where each layer comprises at least one structural and at least one sacrificial material and wherein at least some metals or alloys are electrodeposited during the formation of some layers and at least some metals are deposited during the formation of some layers that are either difficult to electrodeposit and/or are difficult to electrodeposit onto. In some embodiments, the hard to electrodeposit metals (e.g. Ti, NiTi, W, Ta, Mo, etc.) may be deposited via chemical or physical vacuum deposition techniques while other techniques are used in other embodiments. In some embodiments, prior to electrodepositing metals, the surface of the previously formed layer is made to undergo appropriate preparation for receiving an electrodeposited material. Various surface preparation techniques are possible, including, for example, anodic activation, cathodic activation, and vacuum deposition of a seed layer and possibly an adhesion layer.
摘要翻译：实施例涉及电化学制造多层三维结构，其中每层包括至少一种结构和至少一种牺牲材料，并且其中至少一些金属或合金在形成一些层期间被电沉积，并且至少一些金属在形成难以电沉积和/或难以电沉积的一些层。在一些实施方案中，可以通过化学或物理真空沉积技术沉积难以电沉积的金属（例如Ti，NiTi，W，Ta，Mo等），而在其它实施方案中使用其它技术。在一些实施方案中，在电沉积金属之前，使先前形成的层的表面经历适当的准备以接收电沉积材料。各种表面处理技术是可能的，包括例如阳极活化，阴极活化和种子层以及可能的粘附层的真空沉积。

84. 发明申请

US20090234425A1 METHOD FOR PRODUCING IMPLANT STRUCTURES FOR CONTACTING OR ELECTROSTIMULATION OF LIVING TISSUE CELLS OR NERVES 有权
标题翻译：生产用于生活组织细胞或神经细胞接触或电生理的植入物结构的方法
公开(公告)号：US20090234425A1
公开(公告)日：2009-09-17
申请号：US12296519
申请日：2007-01-26
申请人： Hans-Jurgen Tiedtke
发明人： Hans-Jurgen Tiedtke
IPC分类号： A61N1/05 , B05D3/00 , C23C14/34 , B32B15/00
CPC分类号： A61N1/05 , A61N1/0543 , A61N1/0551 , B81C99/008 , B81C2201/0107 , B81C2201/0181 , Y10T428/12493
摘要： The object, to create a method for producing multilayers or multilayer systems wherein the structures generated on a substrate can easily be jointly detached from the substrate and are preserved in a composite, is achieved by the present invention by means of a method for producing implant structures comprising generating a first metal layer on a substrate, generating a second metal layer above the first metal layer, producing a number of multilayered implant structures above the second metal layer, removing the first metal layer between the substrate and the second metal layer, and releasing the implant structures from the substrate in a coherent composite. With the method according to the invention, between the implant structures and the substrate a release layer is generated consisting of two or three metal layers which serve as sacrificial layer in the course of releasing the fully processed multilayers by means of an under-etching process. As a result, a uniform and reliable separation of the finished multilayers from the substrate in a composite is achieved, facilitating the subsequent technology for assembly and interconnection of the implant structures.
摘要翻译：本发明的目的是为了产生多层或多层体系的制造方法，其中在衬底上产生的结构可以容易地与衬底共同分离并且被保存在复合材料中，这通过本发明通过生产植入结构的方法来实现包括在衬底上产生第一金属层，在第一金属层上方产生第二金属层，在第二金属层之上产生多个多层植入结构，去除衬底和第二金属层之间的第一金属层，并释放在相干复合材料中来自基底的植入物结构。利用根据本发明的方法，在植入结构和衬底之间，产生剥离层，其由在蚀刻过程中释放完全处理的多层膜的过程中用作牺牲层的两个或三个金属层组成。结果，实现了在复合材料中完成的多层与基底的均匀可靠的分离，有助于随后的用于植入结构的组装和互连的技术。

85. 发明申请

US20080179279A1 Method for Electrochemical Fabrication 审中-公开
标题翻译：电化学加工方法
公开(公告)号：US20080179279A1
公开(公告)日：2008-07-31
申请号：US11927361
申请日：2007-10-29
申请人： Adam L. Cohen
发明人： Adam L. Cohen
IPC分类号： B32B38/00 , C25F3/16
CPC分类号： C25D5/10 , B33Y10/00 , B33Y70/00 , B81C1/00126 , B81C2201/0181 , B81C2201/0197 , B81C2201/032 , C25D1/00 , C25D1/003 , C25D5/022 , C25D5/12 , C25D5/22 , C25D17/06 , H01L21/2885 , H05K3/241 , Y10T428/12486 , Y10T428/239
摘要： An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the first substrate, is disclosed. Electroplating articles and electroplating apparatus are also disclosed.
摘要翻译：一种电镀方法，包括：a）使第一衬底与第一制品接触，所述第一制品包括衬底和以衬底形式设置的贴合掩模; b）以第一图案将来自金属离子源的第一金属电镀到所述第一基板上，所述第一图案对应于所述适形掩模图案的所述补体; 和c）从第一基板上去除第一制品。还公开了电镀制品和电镀装置。

86. 发明申请

US20080121618A1 Method of Electrochemical Fabrication 有权
公开(公告)号：US20080121618A1
公开(公告)日：2008-05-29
申请号：US11927369
申请日：2007-10-29
申请人： Adam L. Cohen
发明人： Adam L. Cohen
IPC分类号： C23F1/00 , B23H3/00
CPC分类号： C25D5/10 , B33Y10/00 , B33Y70/00 , B81C1/00126 , B81C2201/0181 , B81C2201/0197 , B81C2201/032 , C25D1/00 , C25D1/003 , C25D5/022 , C25D5/12 , C25D5/22 , C25D17/06 , H01L21/2885 , H05K3/241 , Y10T428/12486 , Y10T428/239
摘要： An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the first substrate, is disclosed. Electroplating articles and electroplating apparatus are also disclosed.

87. 发明授权

US07351321B2 Method for electrochemical fabrication 有权
标题翻译：电化学制造方法
公开(公告)号：US07351321B2
公开(公告)日：2008-04-01
申请号：US10677548
申请日：2003-10-01
申请人： Adam L. Cohen
发明人： Adam L. Cohen
IPC分类号： C25D5/02 , C25D5/48 , C25D5/52
CPC分类号： C25D5/10 , B33Y10/00 , B33Y70/00 , B81C1/00126 , B81C2201/0181 , B81C2201/0197 , B81C2201/032 , C25D1/00 , C25D1/003 , C25D5/022 , C25D5/12 , C25D5/22 , C25D17/06 , H01L21/2885 , H05K3/241 , Y10T428/12486 , Y10T428/239
摘要： An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the first substrate, is disclosed. Electroplating articles and electroplating apparatus are also disclosed.
摘要翻译：一种电镀方法，包括：a）使第一衬底与第一制品接触，所述第一制品包括衬底和以衬底形式设置的贴合掩模; b）以第一图案将来自金属离子源的第一金属电镀到所述第一基板上，所述第一图案对应于所述适形掩模图案的所述补体; 和c）从第一基板上去除第一制品。还公开了电镀制品和电镀装置。

88. 发明申请

US20040084319A1 Method for electrochemical fabrication 有权
公开(公告)号：US20040084319A1
公开(公告)日：2004-05-06
申请号：US10677548
申请日：2003-10-01
申请人： University of Southern California
发明人： Adam L. Cohen
IPC分类号： C25D005/02 , C25D005/10
CPC分类号： C25D5/10 , B33Y10/00 , B33Y70/00 , B81C1/00126 , B81C2201/0181 , B81C2201/0197 , B81C2201/032 , C25D1/00 , C25D1/003 , C25D5/022 , C25D5/12 , C25D5/22 , C25D17/06 , H01L21/2885 , H05K3/241 , Y10T428/12486 , Y10T428/239
摘要： An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the first substrate, is disclosed. Electroplating articles and electroplating apparatus are also disclosed.

89. 发明申请

US20030104648A1 Micromechanical component and method of manufacturing a micromechanical component 审中-公开
标题翻译：微机械部件及其制造方法
公开(公告)号：US20030104648A1
公开(公告)日：2003-06-05
申请号：US10175982
申请日：2002-06-19
发明人： Joachim Rudhard , Stefan Pinter , Frank Fischer , Franz Laermer , Arnold Rump
IPC分类号： H01L021/302
CPC分类号： B81B3/0008 , B81B3/0005 , B81B2201/0235 , B81B2201/025 , B81C1/00579 , B81C1/0096 , B81C2201/0109 , B81C2201/0181 , B81C2201/112 , G01C19/5783 , G01P15/0802 , G01P15/125 , G01P2015/0814
摘要： A micromechanical component is described, in particular an acceleration sensor or a rotational speed sensor having functional components which are movably suspended over a substrate, opposite surfaces of the functional components being movable toward one another. The opposite surfaces of the functional components are at least partially coated with a conductive film.
摘要翻译：具体描述了一种微机械部件，其特征在于具有可移动地悬挂在基板上的功能部件的加速度传感器或转速传感器，功能部件的相对表面可相对移动。功能部件的相对表面至少部分地涂覆有导电膜。

90. 发明授权

US06475369B1 Method for electrochemical fabrication 有权
标题翻译：电化学制造方法
公开(公告)号：US06475369B1
公开(公告)日：2002-11-05
申请号：US09487408
申请日：2000-01-18
申请人： Adam L. Cohen
发明人： Adam L. Cohen
IPC分类号： C25D502
CPC分类号： C25D5/10 , B33Y10/00 , B33Y70/00 , B81C1/00126 , B81C2201/0181 , B81C2201/0197 , B81C2201/032 , C25D1/00 , C25D1/003 , C25D5/022 , C25D5/12 , C25D5/22 , C25D17/06 , H01L21/2885 , H05K3/241 , Y10T428/12486 , Y10T428/239
摘要： An electroplating method includes forming a layer, the forming of the layer includes: a) contacting a substrate with a first article, the first article includes a support and a conformable mask disposed in a pattern on the support; b) electroplating a first metal from a source of metal ions onto the substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the substrate. The method may further involve one or more of (1) selectively depositing or non-selectively depositing one or more additional materials to complete formation of the layer, (2) planarizing deposited material after each deposition or after all depositions for a layer, and/or (3) forming layers adjacent previously formed layers to build up a structure from a plurality of adhered layers. Electroplating articles and electroplating apparatus are also disclosed.
摘要翻译：一种电镀方法包括形成层，所述层的形成包括：a）使基底与第一制品接触，所述第一制品包括以支持物的形式设置的支撑体和适形掩模; b）以第一图案将来自金属离子源的第一金属电镀到所述衬底上，所述第一图案对应于所述适形掩模图案的所述补体; 以及c）从所述基底中去除所述第一制品。该方法还可以包括以下一个或多个：（1）选择性地沉积或非选择性地沉积一种或多种附加材料以完成层的形成，（2）在每次沉积之后或在所有沉积之后平坦化沉积的材料，以及/ 或（3）形成与先前形成的层相邻的层，以从多个附着层建立结构。还公开了电镀制品和电镀装置。

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