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81. 发明授权

US4626478A Electronic circuit device components having integral spacers providing uniform thickness bonding film 失效
标题翻译：电子电路器件组件具有一体化间隔物，提供均匀的厚度接合膜
公开(公告)号：US4626478A
公开(公告)日：1986-12-02
申请号：US592220
申请日：1984-03-22
申请人： Herman F. van Dyk Soerewyn
发明人： Herman F. van Dyk Soerewyn
IPC分类号： H01L21/48 , H01L21/60 , H01L23/495 , H05K3/34 , H01L23/48
CPC分类号： H01L24/80 , H01L21/4853 , H01L21/4878 , H01L23/49548 , H05K3/3405 , H05K3/3426 , H01L2924/01005 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H05K2201/1034 , H05K2201/10772 , H05K2201/1084 , H05K2201/10924 , H05K3/3421 , Y02P70/613 , Y10S428/929 , Y10T428/12361 , Y10T428/1241 , Y10T428/12493
摘要： Spacing elements are integrally formed on the constituent surfaces of conductive interfaces of electronic circuit device components for providing uniform thickness solder or other bonding film between the surfaces. The interfaces may be electrically conductive interfaces such as those defined between leads and substrate contact pads as well as thermally conductive interfaces such as those defined between heat sinks and substrates. Any suitable spacers which maintain the constitutent surfaces a selected distance apart when the components are pressed together may be employed such as edge and corner flanges, convex dimples, annular protrusions, tangs, among others. A tool is disclosed for forming the annular protrusions that is advantageously employed with comparatively thick electronic circuit device components and with laminated electronic circuit device components having a comparatively hard layer.
摘要翻译：间隔元件整体形成在电子电路器件部件的导电界面的组成表面上，用于在表面之间提供均匀的厚度的焊料或其它接合膜。界面可以是诸如在引线和衬底接触焊盘之间限定的那些的导电接口，以及诸如在散热器和衬底之间限定的那些导热接口。当组件被压在一起时，任何合适的间隔件可以使组件表面保持选定的距离，例如边缘和角部凸缘，凸起凹坑，环形突起，柄脚等等。公开了一种用于形成环形突起的工具，其有利地用于比较厚的电子电路器件部件和具有相对较硬层的层压电子电路器件部件。

82. 发明授权

US4613767A Low forward-voltage drop SCR 失效
标题翻译：低正向压降SCR
公开(公告)号：US4613767A
公开(公告)日：1986-09-23
申请号：US546983
申请日：1983-10-31
申请人： Varnum S. Holland
发明人： Varnum S. Holland
IPC分类号： H03K17/73 , H03K17/72 , H03K3/26
CPC分类号： H03K17/73
摘要： An SCR having a reduced forward-voltage drop comprising an independently powered latch circuit driving an output transistor in combination with an additional turn-off transistor. The SCR provides saturated operation of the output transistor and self-commutation which allows for the SCR to turn-off. The present invention is particularly suitable for use in integrated circuit structures having additional circuit functions thereon.
摘要翻译：具有减小的正向压降的SCR包括独立供电的锁存电路，驱动与附加关断晶体管组合的输出晶体管。 SCR提供输出晶体管的饱和操作和允许SCR关断的自换向。本发明特别适用于其上具有附加电路功能的集成电路结构。

83. 发明授权

US4551353A Method for reducing leakage currents in semiconductor devices 失效
标题翻译：减少半导体器件漏电流的方法
公开(公告)号：US4551353A
公开(公告)日：1985-11-05
申请号：US633675
申请日：1984-07-24
申请人： Philip L. Hower , Eric K. Li
发明人： Philip L. Hower , Eric K. Li
IPC分类号： H01L21/3105 , H01L21/56 , H01L21/326
CPC分类号： H01L21/3105 , H01L21/56 , H01L23/3178 , H01L2224/16225 , H01L2924/13033 , H01L2924/13034 , Y10S438/91 , Y10S438/958
摘要： A method for reducing leakage currents in passivated semiconductor devices includes subjecting the passivation layer to a corona discharge for reducing or eliminating the inversion layer produced by the characteristic passivation layer charge.
摘要翻译：一种用于减少钝化半导体器件中漏电流的方法包括使钝化层进行电晕放电以减少或消除由特征钝化层电荷产生的反型层。

84. 发明授权

US4514587A High power semiconductor package 失效
标题翻译：大功率半导体封装
公开(公告)号：US4514587A
公开(公告)日：1985-04-30
申请号：US333732
申请日：1981-12-23
申请人： Herman F. Van Dyk Soerewyn
发明人： Herman F. Van Dyk Soerewyn
IPC分类号： H01L23/049 , H01L25/07 , H05K5/04
CPC分类号： H01L24/01 , H01L23/049 , H01L25/072 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01082 , H01L2924/13033
摘要： A high power semiconductor package which includes a substantially continuous mounting surface for efficient thermal mounting to a heat sink and which can be electrically isolated or non-isolated. The package includes a metal header having a cylindrical section and a peripheral mounting flange. The cylindrical section has an annular portion adjacent to the mounting flange into which is press fitted a thermally conductive disk having an outer surface which is substantially coplanar with the mounting surface of the flange. One or more semiconductor devices are mounted within the cylindrical section in thermal communication with the conductive disk, and are electrically connected to leads which outwardly extend from the top of the header. An encapsulant can be provided within the header to enclose the semiconductor devices, and an electrically insulating cap can be secured to the cylindrical section and through which the leads extend.
摘要翻译：一种高功率半导体封装，其包括基本上连续的安装表面，用于有效地热安装到散热器并且可以电隔离或非隔离。该包装包括具有圆柱形部分和外围安装凸缘的金属集管。圆柱形部分具有邻近安装凸缘的环形部分，压入其中的导热盘具有与凸缘的安装表面基本上共面的外表面。一个或多个半导体器件安装在圆柱形部分内，与导电盘热连通，并且电连接到从头部顶部向外延伸的引线。可以在集管内设置密封剂以封闭半导体器件，并且电绝缘盖可以固定到圆柱形部分并且引线延伸穿过该封装。

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