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    • 82. 发明授权
    • Cryogenic cooling system
    • 低温冷却系统
    • US5417073A
    • 1995-05-23
    • US092976
    • 1993-07-16
    • Timothy W. JamesWallace Y. Kunimoto
    • Timothy W. JamesWallace Y. Kunimoto
    • F17C3/08F17C9/00F17C13/00F25B19/00
    • F17C3/08F17C9/00F17C2201/0109F17C2201/058F17C2203/0391F17C2203/0629F17C2203/0646F17C2203/0687F17C2205/0161F17C2221/014F17C2223/0161F17C2270/0509Y10S505/779Y10S505/892
    • A Cryogenic Cooling System generally comprises a portable Dewar and a charging station for the Dewar. In the preferred embodiment, a HTSC device, such as a MRI coil, is contained in the Dewar which uses liquid nitrogen as a cryogenic coolant. The Dewar includes a reservoir for holding cryogenic fluid, an optional wicking material, a transfer tube between the reservoir and the HTSC device (or wick), and a vacuum space. Preferably a vent channel is adjacent the reservoir and provides an escape path for evaporating gas from the wick and/or HTSC device. The vent channel preferably provides a feed-back system: as more cryogenic coolant is transferred via the transfer tube, more cool gas is vented through the channel which cools the reservoir and thereby reduces the transfer. A charging system may also be provided as a source of cryogenic coolant. In the preferred embodiment, the charging system comprises a relatively large reservoir for liquid nitrogen.
    • 低温冷却系统通常包括便携式杜瓦瓶和杜瓦瓶的充电站。 在优选实施例中,诸如MRI线圈的HTSC装置被包含在使用液氮作为低温冷却剂的杜瓦中。 杜瓦包括用于保存低温流体的储存器,可选的芯吸材料,储存器和HTSC装置(或芯)之间的转移管,以及真空空间。 优选地,排气通道邻近储存器并且提供用于从油绳和/或HTSC装置蒸发气体的排出路径。 排气通道优选地提供反馈系统:随着越来越多的低温冷却剂经由输送管转移,更冷的气体通过冷却储存器的通道排出,从而减少转移。 还可以提供充电系统作为低温冷却剂源。 在优选实施例中,充电系统包括用于液氮的相对较大的储存器。
    • 85. 发明申请
    • DEVICE AND METHOD FOR FABRICATING THIN FILMS BY REACTIVE EVAPORATION
    • 通过反应蒸发来制造薄膜的装置和方法
    • US20110303153A1
    • 2011-12-15
    • US13219380
    • 2011-08-26
    • Brian H. MoecklyWard S. Ruby
    • Brian H. MoecklyWard S. Ruby
    • C23C16/448H01L39/24H01L41/22C23C16/458H01L21/00
    • H01L39/2487C23C14/067C23C14/24C23C14/568H01L39/2451Y10T29/49014
    • A device for fabricating thin films on a substrate includes a vacuum chamber, a rotatable platen configured to hold one or more substrates within the vacuum chamber, and a housing disposed within the vacuum chamber. The housing contains a heating element and is configured to enclose an upper surface of the platen and a lower portion configured to partially enclose an underside surface of the platen which forms a reaction zone. A heated evaporation cell is operatively coupled to the lower portion of the housing and configured to deliver a pressurized metallic reactant to the reaction zone. The device includes a deposition zone disposed in the vacuum chamber and isolated from the reaction zone and is configured to deposit a deposition species to the exposed underside of the substrates when the substrates are not contained in the reaction zone.
    • 用于在衬底上制造薄膜的器件包括真空室,被配置为保持真空室内的一个或多个衬底的可旋转压板以及设置在真空室内的壳体。 壳体包含加热元件,并且被构造成封闭压板的上表面,并且下部构造成部分地封闭形成反应区的压板的下表面。 加热的蒸发池可操作地联接到壳体的下部并且被配置成将加压的金属反应物输送到反应区。 该装置包括设置在真空室中并与反应区隔离的沉积区,并且构造成当基底不包含在反应区中时,将沉积物质沉积到基底的暴露下侧。
    • 89. 发明申请
    • SYSTEMS AND METHODS FOR SIMPLE EFFICIENT ASSEMBLY AND PACKAGING OF ELECTRONIC DEVICES
    • 用于简单高效组装和电子设备包装的系统和方法
    • US20100053907A1
    • 2010-03-04
    • US11459336
    • 2006-07-21
    • Edward R. SoaresStacey M. BilskiJames R. CostaKen S. Ono
    • Edward R. SoaresStacey M. BilskiJames R. CostaKen S. Ono
    • H05K7/00H05K9/00
    • H05K9/0022
    • Systems and methods for simple, efficient and/or cost effective manufacturing and assembly of electronic devices are provided. The various systems and methods of the invention may include various ways of coupling, attaching, and/or connecting the various components of the system to one another, for improved cost and ease of assembly. A number of clips may be used to attach together various parts of an electronic system and housing including circuit devices, enclosure lid and housing, and/or cabling. These clips may be screw-less, may be made of a resilient or spring material, designed so that they quickly snap into place so as to provide good mechanical strength and electrical connection. Various circuit elements may include planar circuits, and may include filters made of a high temperature superconductor material. A planar cable may be used for electrical connecting of components. These systems and devices may be used in, for example, wireless communication systems.
    • 提供了用于简单,有效和/或成本有效地制造和组装电子设备的系统和方法。 本发明的各种系统和方法可以包括将系统的各种部件彼此联接,附接和/或连接的各种方式,以提高成本和易于组装。 可以使用多个夹子来将电子系统和壳体的各个部分连接在一起,包括电路装置,封闭盖和壳体,和/或布线。 这些夹子可以是无螺纹的,可以由弹性或弹簧材料制成,设计成使得它们快速卡入到位,以便提供良好的机械强度和电连接。 各种电路元件可以包括平面电路,并且可以包括由高温超导体材料制成的滤波器。 平面电缆可用于组件的电连接。 这些系统和设备可以用于例如无线通信系统中。