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81. 发明申请

US20130027244A1 NEAR-FIELD MILLIMETER WAVE IMAGING 有权
公开(公告)号：US20130027244A1
公开(公告)日：2013-01-31
申请号：US13600930
申请日：2012-08-31
申请人： Aydin Babakhani , Duixian Liu , Scott K. Reynolds , Mihai A. Sanduleanu
发明人： Aydin Babakhani , Duixian Liu , Scott K. Reynolds , Mihai A. Sanduleanu
IPC分类号： G01S13/89
CPC分类号： G01S13/89 , H01Q1/2283 , H01Q7/00 , H01Q21/061
摘要： Systems and method for near-field millimeter wave imaging are provided, in particular, near-field millimeter wave imaging systems and methods that enable sub-wavelength resolution imaging by scanning objects with sub-wavelength probe elements and capturing and measuring phase and intensity of reflected energy to generate images.

82. 发明申请

US20130027243A1 NEAR-FIELD MILLIMETER WAVE IMAGING 有权
标题翻译：近场微波成像
公开(公告)号：US20130027243A1
公开(公告)日：2013-01-31
申请号：US13545437
申请日：2012-07-10
申请人： Aydin Babakhani , Duixian Liu , Scott K. Reynolds , Mihai A. Sanduleanu
发明人： Aydin Babakhani , Duixian Liu , Scott K. Reynolds , Mihai A. Sanduleanu
IPC分类号： G01S13/89
CPC分类号： G01S13/89 , H01Q1/2283 , H01Q7/00 , H01Q21/061
摘要： Systems and method for near-field millimeter wave imaging are provided, in particular, near-field millimeter wave imaging systems and methods that enable sub-wavelength resolution imaging by scanning objects with sub-wavelength probe elements and capturing and measuring phase and intensity of reflected energy to generate images.
摘要翻译：提供了用于近场毫米波成像的系统和方法，特别是近场毫米波成像系统和方法，其通过用亚波长探针元素扫描物体并且捕获和测量反射的相位和强度来实现亚波长分辨率成像生成图像的能量。

83. 发明申请

US20120146845A1 Narrow-Band Wide-Range Frequency Modulation Continuous Wave (FMCW) Radar System 有权
标题翻译：窄带宽频率调制连续波（FMCW）雷达系统
公开(公告)号：US20120146845A1
公开(公告)日：2012-06-14
申请号：US12963314
申请日：2010-12-08
申请人： Howard H. Chen , Kai D. Feng , Duixian Liu
发明人： Howard H. Chen , Kai D. Feng , Duixian Liu
IPC分类号： G01S13/34
CPC分类号： G01S13/34 , G01S13/584 , G01S13/931 , G01S2007/358
摘要： A frequency modulation continuous wave (FMCW) system includes a first memory receiving a clock signal and storing voltage digital values of I FMCW signals, a second memory receiving the clock signal and storing the voltage digital values of the Q FMCW signals, a first digital-to-analog converter (DAC) connected to the first memory and receiving the clock signal for converting the voltage digital values of the I FMCW signal to a first analog voltage, a second digital-to-analog converter (DAC) connected to the second memory and receiving the clock signal for converting the voltage digital values of the Q FMCW signal to a second analog voltage, an I low-pass filter connected to the first DAC smoothing the I FMCW signal and a Q low-pass filter connected to the second DAC smoothing the Q FMCW signal.
摘要翻译：频率调制连续波（FMCW）系统包括接收时钟信号并存储I FMCW信号的电压数字值的第一存储器，接收时钟信号并存储Q FMCW信号的电压数字值的第二存储器，第一数字 - 模拟转换器（DAC），连接到第一存储器并且接收用于将I FMCW信号的电压数字值转换为第一模拟电压的时钟信号;连接到第二存储器的第二数模转换器（DAC）并接收用于将Q FMCW信号的电压数字值转换为第二模拟电压的时钟信号，连接到第一DAC的I低通滤波器平滑I FMCW信号和连接到第二DAC的Q低通滤波器平滑Q FMCW信号。

84. 发明授权

US07999753B2 Apparatus and methods for constructing antennas using vias as radiating elements formed in a substrate 有权
标题翻译：使用通孔作为形成在基板中的辐射元件来构造天线的装置和方法
公开(公告)号：US07999753B2
公开(公告)日：2011-08-16
申请号：US12176975
申请日：2008-07-21
申请人： Brian Paul Gaucher , Duixian Liu , Ullrich Richard Rudolf Pfeiffer , Thomas Martin Zwick
发明人： Brian Paul Gaucher , Duixian Liu , Ullrich Richard Rudolf Pfeiffer , Thomas Martin Zwick
IPC分类号： H01Q1/38 , H01Q9/40
CPC分类号： H01Q9/0407 , H01L23/66 , H01L24/73 , H01L2223/6677 , H01L2224/48091 , H01L2224/73207 , H01L2924/12042 , H01L2924/14 , H01L2924/3011 , H01Q1/38 , H01Q1/48 , H01Q9/28 , H01Q9/40 , H01Q23/00 , Y10T29/49016 , Y10T29/49018 , H01L2924/00014 , H01L2924/00
摘要： Antennas are provided which are constructed using one or more conductive via stubs as radiating elements formed in a substrate. The antennas can be integrally packaged with IC chips (e.g., IC transceivers, receivers, transmitters, etc.) to build integrated wireless or RF (radio frequency) communications systems.
摘要翻译：提供天线，其使用一个或多个导电通路短截线作为形成在基板中的辐射元件构造。天线可以与IC芯片（例如，IC收发器，接收器，发射器等）整体封装，以构建集成的无线或RF（射频）通信系统。

85. 发明授权

US07692590B2 Radio frequency (RF) integrated circuit (IC) packages with integrated aperture-coupled patch antenna(s) 有权
标题翻译：具有集成孔径耦合贴片天线的射频（RF）集成电路（IC）封装
公开(公告)号：US07692590B2
公开(公告)日：2010-04-06
申请号：US12034023
申请日：2008-02-20
申请人： Brian Floyd , Duixian Liu
发明人： Brian Floyd , Duixian Liu
IPC分类号： H01Q1/38
CPC分类号： H01Q23/00 , H01L23/66 , H01L2223/6677 , H01L2224/16225 , H01L2924/09701 , H01Q1/2283 , H01Q1/38 , H01Q9/0457
摘要： A radio-frequency integrated circuit chip package with at least one integrated aperture-coupled patch antenna includes at least one generally planar patch and at least one generally planar ground plane spaced inwardly from the generally planar patch and substantially parallel thereto. The ground plane is formed with at least one coupling aperture slot therein. The slot is substantially opposed to the patch. Also included are at least one feed line spaced inwardly from the ground plane and substantially parallel thereto, at least one radio frequency chip spaced inwardly from the feed line and coupled to the feed line and the ground plane, and a first substrate layer spaced inwardly from the feed line. The first substrate layer is formed with a chip-receiving cavity. The chip is located in the chip-receiving cavity.
摘要翻译：具有至少一个集成孔径耦合贴片天线的射频集成电路芯片封装包括至少一个基本上平面的贴片和至少一个大体上平面的接地平面，该接地平面与大致平坦的贴片间隔开并且与其基本平行。接地平面在其中形成有至少一个耦合孔隙。狭槽基本上与贴片相对。还包括至少一个从接地平面向内隔开并且基本上与其平行的馈电线，至少一个射频芯片，与馈电线路向内间隔开并耦合到馈线和接地平面，以及第一衬底层，喂料线。第一基板层形成有芯片接收腔。芯片位于芯片接收腔中。

86. 发明授权

US07646344B2 Wafer-scale phased array 有权
标题翻译：晶圆级相控阵
公开(公告)号：US07646344B2
公开(公告)日：2010-01-12
申请号：US12045377
申请日：2008-03-10
申请人： Duixian Liu
发明人： Duixian Liu
IPC分类号： H01Q1/38
CPC分类号： H01Q21/065 , H01Q9/0457 , H01Q21/0006 , Y10T29/49016
摘要： An antenna array includes at least a first and a second substrate; a plurality of radiators located proximate to a surface of the first substrate opposite the second substrate; at least a first ground plane located between the first and the second substrate, the ground plane having a plurality of slots located therein; and a plurality of feed lines located proximate to a surface of the second substrate opposite the first substrate.
摘要翻译：天线阵列至少包括第一和第二基板; 位于第一基板的与第二基板相对的表面附近的多个散热器; 位于所述第一和第二基板之间的至少第一接地平面，所述接地平面具有位于其中的多个槽; 以及位于第二基板的与第一基板相对的表面附近的多个馈送线。

87. 发明授权

US07518229B2 Versatile Si-based packaging with integrated passive components for mmWave applications 有权
标题翻译：多功能Si基封装，集成无源元件，适用于mmWave应用
公开(公告)号：US07518229B2
公开(公告)日：2009-04-14
申请号：US11498689
申请日：2006-08-03
申请人： John Michael Cotte , Brian Paul Gaucher , Janusz Grzyb , Nils Deneke Hoivik , Christopher Vincent Jahnes , John Ulrich Knickerbocker , Duixian Liu , John Harold Magerlein , Chirag Suryakant Patel , Ullrich R. Pfeiffer , Cornelia Kang-I Tsang
发明人： John Michael Cotte , Brian Paul Gaucher , Janusz Grzyb , Nils Deneke Hoivik , Christopher Vincent Jahnes , John Ulrich Knickerbocker , Duixian Liu , John Harold Magerlein , Chirag Suryakant Patel , Ullrich R. Pfeiffer , Cornelia Kang-I Tsang
IPC分类号： H01L23/04
CPC分类号： H01L25/165 , H01L23/66 , H01L24/24 , H01L24/82 , H01L25/162 , H01L2223/6677 , H01L2224/16225 , H01L2224/24137 , H01L2224/24227 , H01L2924/00011 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/09701 , H01L2924/10329 , H01L2924/14 , H01L2924/1461 , H01L2924/15153 , H01L2924/15165 , H01L2924/15311 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01Q1/2283 , H01L2924/00 , H01L2224/0401
摘要： An apparatus is described incorporating an interposer having a cavity for a portion of an antenna structure, having conductor through vias, a top Si part having interconnection wiring and having pads for electrically mounting an integrated circuit chip thereon, wherein the top Si part mates with the interposer electrically and mechanically. The interposer and top Si part may be scaled to provide an array of functional units. The invention overcomes the problem of combining a high efficient antenna with integrated circuit chips in a Si package with signal frequencies from 1 to 100 GHz and the problem of shielding components proximate to the antenna and reduces strain arising from mismatching of TCEs.
摘要翻译：描述了一种装置，其具有用于天线结构的一部分的空腔的插入件，具有导体穿过通孔，顶部Si部分具有互连布线并具有用于在其上电气安装集成电路芯片的焊盘，其中顶部Si部分与内插器电气和机械。插入器和顶部Si部分可以被缩放以提供功能单元的阵列。本发明克服了将高效天线与Si封装中的集成电路芯片组合在一起的信号频率为1至100GHz的问题，以及屏蔽靠近天线的组件的问题，并减少了由于TCE失配引起的应变。

88. 发明授权

US07518221B2 Apparatus and methods for packaging integrated circuit chips with antennas formed from package lead wires 有权
标题翻译：用封装引线形成的天线封装集成电路芯片的装置和方法
公开(公告)号：US07518221B2
公开(公告)日：2009-04-14
申请号：US11340934
申请日：2006-01-26
申请人： Brian P. Gaucher , Duixian Liu , Ullrich R. Pfeiffer , Thomas M. Zwick
发明人： Brian P. Gaucher , Duixian Liu , Ullrich R. Pfeiffer , Thomas M. Zwick
IPC分类号： H01L23/495
CPC分类号： H01Q9/16 , H01L23/49555 , H01L23/66 , H01L24/48 , H01L24/49 , H01L2223/6677 , H01L2224/05554 , H01L2224/451 , H01L2224/45147 , H01L2224/48247 , H01L2224/49171 , H01L2924/00014 , H01L2924/01079 , H01L2924/10162 , H01L2924/14 , H01L2924/3011 , H01Q23/00 , Y10T29/49018 , H01L2924/00 , H01L2924/00015 , H01L2224/05599 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Apparatus and methods are provided for integrally packaging semiconductor IC (integrated circuit) chips with antennas having one or more radiating elements and tuning elements that are formed from package lead wires that are appropriated shaped and arranged to form antenna structures for millimeter wave applications.
摘要翻译：提供了用于将半导体IC（集成电路）芯片与具有一个或多个辐射元件和调谐元件整体封装的装置和方法，所述辐射元件和调谐元件由适于成形并布置成形成毫米波应用的天线结构的封装引线形成。

89. 发明申请

US20090015483A1 Wafer-Scale Phased Array 有权
标题翻译：晶圆相控阵
公开(公告)号：US20090015483A1
公开(公告)日：2009-01-15
申请号：US12045377
申请日：2008-03-10
申请人： Duixian Liu
发明人： Duixian Liu
IPC分类号： H01Q1/38
CPC分类号： H01Q21/065 , H01Q9/0457 , H01Q21/0006 , Y10T29/49016
摘要： An antenna array includes at least a first and a second substrate; a plurality of radiators located proximate to a surface of the first substrate opposite the second substrate; at least a first ground plane located between the first and the second substrate, the ground plane having a plurality of slots located therein; and a plurality of feed lines located proximate to a surface of the second substrate opposite the first substrate.
摘要翻译：天线阵列至少包括第一和第二基板; 位于第一基板的与第二基板相对的表面附近的多个散热器; 位于所述第一和第二基板之间的至少第一接地平面，所述接地平面具有位于其中的多个槽; 以及位于第二基板的与第一基板相对的表面附近的多个馈送线。

90. 发明授权

US07444734B2 Apparatus and methods for constructing antennas using vias as radiating elements formed in a substrate 有权
标题翻译：使用通孔作为形成在基板中的辐射元件来构造天线的装置和方法
公开(公告)号：US07444734B2
公开(公告)日：2008-11-04
申请号：US10731520
申请日：2003-12-09
申请人： Brian Paul Gaucher , Duixian Liu , Ullrich Richard Rudolf Pfeiffer , Thomas Martin Zwick
发明人： Brian Paul Gaucher , Duixian Liu , Ullrich Richard Rudolf Pfeiffer , Thomas Martin Zwick
IPC分类号： H01P11/00
CPC分类号： H01Q9/0407 , H01L23/66 , H01L24/73 , H01L2223/6677 , H01L2224/48091 , H01L2224/73207 , H01L2924/12042 , H01L2924/14 , H01L2924/3011 , H01Q1/38 , H01Q1/48 , H01Q9/28 , H01Q9/40 , H01Q23/00 , Y10T29/49016 , Y10T29/49018 , H01L2924/00014 , H01L2924/00
摘要： Antennas are provided which are constructed using one or more conductive via stubs as radiating elements formed in a substrate. The antennas can be integrally packaged with IC chips (e.g., IC transceivers, receivers, transmitters, etc.) to build integrated wireless or RF (radio frequency) communications systems.
摘要翻译：提供天线，其使用一个或多个导电通路短截线作为形成在基板中的辐射元件构造。天线可以与IC芯片（例如，IC收发器，接收器，发射器等）整体封装，以构建集成的无线或RF（射频）通信系统。

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