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81. 发明授权

US07294587B2 Component built-in module and method for producing the same 有权
标题翻译：组件内置模块及其制造方法
公开(公告)号：US07294587B2
公开(公告)日：2007-11-13
申请号：US11126029
申请日：2005-05-10
申请人： Toshiyuki Asahi , Yasuhiro Sugaya , Shingo Komatsu , Yoshiyuki Yamamoto , Seiichi Nakatani
发明人： Toshiyuki Asahi , Yasuhiro Sugaya , Shingo Komatsu , Yoshiyuki Yamamoto , Seiichi Nakatani
IPC分类号： H01L21/31 , H01L21/469
CPC分类号： H01L25/50 , H01L21/6835 , H01L23/5389 , H01L23/552 , H01L24/24 , H01L24/81 , H01L24/82 , H01L24/83 , H01L25/0652 , H01L25/16 , H01L2221/68345 , H01L2224/16225 , H01L2224/2402 , H01L2224/24226 , H01L2224/2929 , H01L2224/293 , H01L2224/32225 , H01L2224/73204 , H01L2224/8121 , H01L2224/81815 , H01L2224/82047 , H01L2224/83801 , H01L2224/83851 , H01L2924/00011 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01009 , H01L2924/01012 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01046 , H01L2924/01047 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/12042 , H01L2924/15787 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H01L2924/30105 , H01L2924/30107 , H01L2924/3025 , H05K1/186 , H05K3/20 , H05K3/4069 , H05K3/4602 , H05K3/4652 , H05K2201/10378 , H05K2201/10636 , H05K2203/061 , Y02P70/611 , H01L2924/00 , H01L2224/29075
摘要： A component built-in module includes an insulating layer, wirings integrated with both surfaces of the insulating layer, a via connecting the wirings, and one or more components selected from an electronic component and a semiconductor, which is embedded inside of the insulating layer. In this module, at least one of the wirings is formed on a surface of a wiring board, and the components embedded inside of the insulating layer are mounted on and integrated with the wiring board before embedding. This configuration allows the components such as a semiconductor to undergo a mounting inspection and a property inspection before embedding. As a result, the yields of the module can be improved. In addition, since the components are integrated with the wiring board and embedded, the strength thereof can be enhanced.
摘要翻译：组件内置模块包括绝缘层，与绝缘层的两个表面一体化的布线，连接布线的通孔以及嵌入在绝缘层内部的一个或多个选自电子部件和半导体的部件。在该模块中，布线板的表面上形成有布线中的至少一方，嵌入绝缘层内的部件安装在布线基板上并与嵌入板一体化。这种构造允许诸如半导体的部件在嵌入之前进行安装检查和性能检查。结果，可以提高模块的产量。此外，由于部件与布线板集成并嵌入，因此可以提高其强度。

82. 发明授权

US07157789B2 Semiconductor device and method for manufacturing the same 有权
标题翻译：半导体装置及其制造方法
公开(公告)号：US07157789B2
公开(公告)日：2007-01-02
申请号：US11136110
申请日：2005-05-24
申请人： Koichi Hirano , Yoshiyuki Yamamoto , Seiichi Nakatani , Toshiyuki Kojima , Shingo Komatsu
发明人： Koichi Hirano , Yoshiyuki Yamamoto , Seiichi Nakatani , Toshiyuki Kojima , Shingo Komatsu
IPC分类号： H01L23/552
CPC分类号： H01L25/0657 , H01L23/5389 , H01L24/24 , H01L24/45 , H01L24/48 , H01L24/50 , H01L24/82 , H01L24/86 , H01L2224/05568 , H01L2224/05573 , H01L2224/05624 , H01L2224/16225 , H01L2224/2402 , H01L2224/24051 , H01L2224/24145 , H01L2224/24226 , H01L2224/24227 , H01L2224/32145 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/73204 , H01L2224/73265 , H01L2224/92 , H01L2224/92244 , H01L2225/0651 , H01L2225/06517 , H01L2225/06524 , H01L2225/06551 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/01058 , H01L2924/01064 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/12041 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/15311 , H01L2924/1532 , H01L2924/19043 , H01L2924/3011 , H01L2924/3025 , H01L2224/83 , H01L2224/82 , H01L2924/00 , H01L2224/05599
摘要： An example of a semiconductor device of the present invention includes a first semiconductor element including a first element body portion and a first element electrode that is provided on a first face of the first element body portion; a wiring board including an insulating substrate and a first wiring layer that is formed on one principal face of the insulating substrate, the wiring board being disposed such that the one principal face of the wiring board is opposed to a second face of the first element body portion; a first film that covers at least a portion of a face of the first semiconductor element that includes the surface of the first element electrode and at least a portion of a face on the first semiconductor element side of the wiring board; and a second wiring layer that is formed on a face on the wiring board side of the first film and that includes a first conductor having first and second ends. The first end of the first conductor is bonded to the first element electrode, and the second end of the first conductor is bonded to a portion of the first wiring layer.
摘要翻译：本发明的半导体器件的一个例子包括：第一半导体元件，包括第一元件主体部分和设置在第一元件主体部分的第一面上的第一元件电极; 布线板，包括绝缘基板和形成在所述绝缘基板的一个主面上的第一布线层，所述布线板布置成使得所述布线板的所述一个主面与所述第一元件体的第二面相对一部分; 第一膜，其覆盖包括第一元件电极的表面和布线板的第一半导体元件侧的面的至少一部分的第一半导体元件的表面的至少一部分; 以及第二布线层，其形成在第一膜的布线板侧的面上，并且包括具有第一端和第二端的第一导体。第一导体的第一端接合到第一元件电极，第一导体的第二端接合到第一布线层的一部分。

83. 发明申请

US20060231015A1 Single crystalline diamond and producing method thereof 有权
标题翻译：单晶金刚石及其制造方法
公开(公告)号：US20060231015A1
公开(公告)日：2006-10-19
申请号：US11402062
申请日：2006-04-12
申请人： Kiichi Meguro , Yoshiyuki Yamamoto , Takahiro Imai
发明人： Kiichi Meguro , Yoshiyuki Yamamoto , Takahiro Imai
IPC分类号： C30B23/00 , C30B25/00 , C30B28/12 , C30B28/14
CPC分类号： C30B29/04 , C30B25/20
摘要： The object of the present invention is to obtain a high quality single crystalline diamond that has less distortion and large area suitable for semiconductor device substrates or an optical component material. The present invention is a single crystalline diamond produced by chemical vapor deposition, wherein, when a linear polarized light which is composed of two linear polarized lights perpendicular to each other is introduced into one main face of the single crystalline diamond, a maximum value of a retardation between the two linear polarized lights perpendicular to each other which come out from an opposite main face is not more than 50 μm at maximum per a thickness of 100 μm across an entire of the single crystalline diamond, and also a method for producing the diamond.
摘要翻译：本发明的目的是获得具有较小变形和大面积的高半导体器件衬底或光学组件材料的高质量单晶金刚石。本发明是通过化学气相沉积法生产的单晶金刚石，其中当由彼此垂直的两个线性偏振光组成的线性偏振光被引入单晶金刚石的一个主面时，其最大值为在整个单晶金刚石上，相对于从相对的主面出来的彼此垂直的两个线偏振光之间的延迟最大值不超过每100μm厚度100mum的最大50μm，并且还有一种用于制造金刚石的方法。

84. 发明授权

US06641861B2 Heatsink and fabrication method thereof 失效
标题翻译：散热片及其制造方法
公开(公告)号：US06641861B2
公开(公告)日：2003-11-04
申请号：US09962578
申请日：2001-09-24
申请人： Hirohisa Saito , Yoshiyuki Yamamoto , Kiichi Meguro , Takahiro Imai
发明人： Hirohisa Saito , Yoshiyuki Yamamoto , Kiichi Meguro , Takahiro Imai
IPC分类号： B05D512
CPC分类号： H01L23/3736 , H01L21/4871 , H01L23/142 , H01L23/3732 , H01L23/49562 , H01L2924/0002 , H01L2924/1423 , Y10T428/24942 , Y10T428/24975 , Y10T428/249961 , Y10T428/249967 , Y10T428/249988 , Y10T428/24999 , Y10T428/26 , Y10T428/30 , Y10T428/31678 , H01L2924/00
摘要： A method of fabricating a heatsink including a substrate of a sintered compact containing Cu and W, and a thin diamond film layer formed on the surface of the substrate with good adherence, involves immersing the substrate in acid to reduce the Cu content of a surface region thereof and to roughen exposed W at that surface region, and then forming the thin diamond film layer on that surface region by vapor synthesis. Alternatively, a thin diamond film layer is formed on a surface of a porous body substrate, and then a hole in the porous body substrate is filled with Cu.
摘要翻译：一种制造包括含有Cu和W的烧结体的衬底的散热体的方法以及形成在衬底表面上的良好粘附性的薄金刚石膜层包括将衬底浸入酸中以降低表面区域的Cu含量并在该表面区域粗化暴露的W，然后通过气相合成在该表面区域上形成薄金刚石膜层。或者，在多孔体基板的表面上形成薄金刚石膜层，然后用Cu填充多孔体基板的孔。

85. 发明授权

US06361857B1 Heatsink and fabrication method thereof 失效
标题翻译：散热片及其制造方法
公开(公告)号：US06361857B1
公开(公告)日：2002-03-26
申请号：US09232011
申请日：1999-01-14
申请人： Hirohisa Saito , Yoshiyuki Yamamoto , Kiichi Meguro , Takahiro Imai
发明人： Hirohisa Saito , Yoshiyuki Yamamoto , Kiichi Meguro , Takahiro Imai
IPC分类号： B32B900
CPC分类号： H01L23/3736 , H01L21/4871 , H01L23/142 , H01L23/3732 , H01L23/49562 , H01L2924/0002 , H01L2924/1423 , Y10T428/24942 , Y10T428/24975 , Y10T428/249961 , Y10T428/249967 , Y10T428/249988 , Y10T428/24999 , Y10T428/26 , Y10T428/30 , Y10T428/31678 , H01L2924/00
摘要： A thin diamond film layer is formed on a substrate with good adherence. A heatsink includes a substrate of a sintered compact including Cu and W, and a thin diamond film layer formed on the surface of the substrate. The Cu content in the substrate is at least 5% by weight. In an X-ray diffraction chart obtained by irradiating the thin diamond film layer with an X-ray, the diffraction peak intensity of the (110) plane of W is at least 100 times the diffraction peak intensity of the (200) plane of Cu.
摘要翻译：在具有良好粘附性的基材上形成薄金刚石膜层。散热器包括包含Cu和W的烧结体的基板，以及形成在基板的表面上的薄金刚石膜层。基材中的Cu含量为至少5重量％。在通过用X射线照射薄金刚石膜层而获得的X射线衍射图中，W的（110）面的衍射峰强度为Cu的（200）面的衍射峰强度的至少100倍。

86. 发明授权

US5152256A Air-liquid cooled engine 失效
标题翻译：空气冷却发动机
公开(公告)号：US5152256A
公开(公告)日：1992-10-06
申请号：US458983
申请日：1989-12-29
申请人： Yoshinori Yamauchi , Yoshiyuki Yamamoto , Tomoo Taira
发明人： Yoshinori Yamauchi , Yoshiyuki Yamamoto , Tomoo Taira
IPC分类号： B62M7/02 , B62J99/00 , F01P3/02 , F01P5/06 , F01P5/12 , F01P9/04 , F02B61/02 , F02B75/02 , F02B75/16
CPC分类号： F01P9/04 , F01P5/06 , F01P5/12 , F02B61/02 , F02B75/16 , B62K2202/00 , F02B2075/025
摘要： Several embodiments of air-liquid cooled internal combustion engines for powering vehicles such as motor scooters. In each embodiment, the engine is provided with a finned cylinder for air cooling and a cylinder head having a liquid cooling jacket for water cooling. A radiator is provided for exchanging heat from the cylinder head cooling jacket and the atmosphere and a single fan circulates cooling air across both the radiator and the cylinder. In all embodiments, the flow across the fan, radiator and cylinder is in a series flow fashion. In many of the embodiments, the components are axially aligned. The fan is driven by the crankshaft either directly, through a gear train or through a flexible transmitter and in one case this flexible transmitter also drives the camshaft. A water pump is driven off of the camshaft for the liquid cooling system.

87. 发明授权

US5138697A Graphic data conversion method 失效
标题翻译：图形数据转换方法
公开(公告)号：US5138697A
公开(公告)日：1992-08-11
申请号：US760820
申请日：1991-09-17
申请人： Yoshiyuki Yamamoto , Yoshimitsu Murahashi
发明人： Yoshiyuki Yamamoto , Yoshimitsu Murahashi
IPC分类号： G06F17/50 , G06T17/00
CPC分类号： G06F17/50 , G06T17/00 , G06F2217/74
摘要： A graphic data conversion method converts the original data of a first format of a drawing or a product into basic element records comprising basic graphic elements, dimension line elements and text elements, organizes an intermediate data file by properly inserting edit partition records and edit records, and then converts the data stored in the intermediate data file into the data of a second format of the drawing or the product. Translators can be easily organized and the degree of freedom and efficiency of data conversion are enhanced, since the data is stored perspicuously in the intermediate data file in elements and structures.

88. 发明授权

US4622263A Water absorbing webs 失效
标题翻译：吸水网
公开(公告)号：US4622263A
公开(公告)日：1986-11-11
申请号：US733949
申请日：1985-05-14
申请人： Katsutoshi Ando , Eiichi Nishiura , Yoshiyuki Yamamoto
发明人： Katsutoshi Ando , Eiichi Nishiura , Yoshiyuki Yamamoto
IPC分类号： A61L15/26 , D01F6/86 , D04H1/435 , D04H1/56 , D04H1/58
CPC分类号： D04H3/16 , A61L15/26 , D01F6/86 , D04H1/56 , D04H3/011 , D04H3/016 , Y10S428/913 , Y10T442/68 , Y10T442/697
摘要： This invention relates to a melt-blow water-absorbing fiber webs whose main component is block-copolyetheresters having polyester and polyether segments in the molecules, wherein the amount the polyether component is 5 to 80 wt % base on the block-copolyetheresters.The water-absorbing web of this invention shows high chlorine fastness and consequently shows excellent water absorption performances after repeated washing. They are available as good batting (urine absorber) for diapers, as well as bed pads, towel materials and sports underpants, and applicable to a wide range of disposal products which require high water absorption performances and durability.
摘要翻译：本发明涉及一种熔融吸水纤维网，其主要成分是在分子中具有聚酯和聚醚链段的嵌段共聚醚酯，其中聚醚组分的量为5-80重量％，基于嵌段共聚醚酯。本发明的吸水纤维网显示出高耐氯性，因此在反复洗涤后显示出优异的吸水性能。它们可用作尿布的良好的捶击（尿液吸收剂），以及床垫，毛巾材料和运动内裤，并且适用于需要高吸水性能和耐久性的各种处理产品。

89. 发明授权

US4587309A Process for producing polyetheresteramides 失效
标题翻译：生产聚醚酯酰胺的方法
公开(公告)号：US4587309A
公开(公告)日：1986-05-06
申请号：US724611
申请日：1985-04-18
申请人： Chiaki Tanaka , Makoto Kondou , Yoshiyuki Yamamoto
发明人： Chiaki Tanaka , Makoto Kondou , Yoshiyuki Yamamoto
IPC分类号： C08G69/00 , C08G69/44 , C08F283/00 , C08G63/76 , C08G69/48 , C08L67/00
CPC分类号： C08G69/44
摘要： The high polymerization degree polyetheresteramides without any gelated materials and with superior color tones are obtained in a short time through the polycondensing interaction carried out between (A) one or more than two polyamide forming components selected from lactams and aminocarboxylic acids as well as the salts of substantially-equal quantities of diamines and dicarboxylic acid and (B) the polyetherester forming components consisting of the substantially-equal quantities of dicarboxylic acids and poly(alkylene oxide) glycols in the presence of 0.001 to 0.5 percent by weight of the mixtures composed of antimony oxides/organic tin compounds at the ratios of 80/20 to 30/70 by weight and more preferably in the co-presence of 0.0005 to 0.5 percent by weight of phosphoric compounds.
摘要翻译：通过在（A）一种或多于两种选自内酰胺和氨基羧酸的聚酰胺形成组分中进行的缩聚相互作用，在短时间内获得没有任何胶凝材料和优异色调的高聚合度聚醚酯酰胺以及基本上相等量的二胺和二羧酸和（B）在由锑组成的混合物的0.001至0.5重量％的存在下由基本上相等量的二羧酸和聚（环氧烷）二醇组成的聚醚酯形成组分氧化物/有机锡化合物，其比例为80/20〜30/70，更优选为0.0005〜0.5重量％的磷酸化合物共存。

90. 发明授权

US09184228B2 Composite base including sintered base and base surface flattening layer, and composite substrate including that composite base and semiconductor crystalline layer 有权
标题翻译：复合基底包括烧结基体和基底表面平整层，以及复合基片，包括复合基底和半导体结晶层
公开(公告)号：US09184228B2
公开(公告)日：2015-11-10
申请号：US13107241
申请日：2011-05-13
申请人： Yuki Seki , Issei Satoh , Koji Uematsu , Yoshiyuki Yamamoto
发明人： Yuki Seki , Issei Satoh , Koji Uematsu , Yoshiyuki Yamamoto
IPC分类号： H01L29/04 , H01L29/02 , H01L21/762 , H01L27/12
CPC分类号： H01L29/02 , B32B2264/102 , B32B2307/704 , B32B2457/14 , H01L21/76254 , H01L27/1214 , H01L27/1266 , Y10T428/24355
摘要： A composite base of the present invention includes a sintered base and a base surface flattening layer disposed on the sintered base, and the base surface flattening layer has a surface RMS roughness of not more than 1.0 nm. A composite substrate of the present invention includes the composite base and a semiconductor crystal layer disposed on a side of the composite base where the base surface flattening layer is located, and a difference between a thermal expansion coefficient of the sintered base and a thermal expansion coefficient of the semiconductor crystal layer is not more than 4.5×10−6K−1. Thereby, a composite substrate in which a semiconductor crystal layer is attached to a sintered base, and a composite base suitably used for that composite substrate are provided.
摘要翻译：本发明的复合基材包括烧结基体和设置在烧结基体上的基面平坦化层，基面平坦化层的表面RMS粗糙度不大于1.0nm。本发明的复合基板包括复合基材和设置在复合基材的位于基面平坦化层的一侧的半导体晶体层，烧结基体的热膨胀系数与热膨胀系数之差的半导体晶体层不超过4.5×10-6K-1。由此，提供将半导体结晶层附着在烧结基体上的复合基板和适合用于该复合基板的复合基材。

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