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81. 发明申请

US20120087217A1 THERMALLY ASSISTED MAGNETIC HEAD, HEAD GIMBAL ASSEMBLY, AND HARD DISK DRIVE 有权
标题翻译：热辅助磁头，头盖组件和硬盘驱动
公开(公告)号：US20120087217A1
公开(公告)日：2012-04-12
申请号：US13279935
申请日：2011-10-24
申请人： Yoshitaka SASAKI , Hiroyuki ITO , Atsushi IIJIMA
发明人： Yoshitaka SASAKI , Hiroyuki ITO , Atsushi IIJIMA
IPC分类号： G11B13/04 , G11B5/60 , G11B5/48
CPC分类号： G11B5/3163 , B82Y20/00 , G02B6/1226 , G11B5/105 , G11B5/314 , G11B5/6088 , G11B2005/0021 , Y10T29/49021 , Y10T29/49041 , Y10T29/49043 , Y10T29/49044 , Y10T29/49046 , Y10T29/49052
摘要： A thermally assisted magnetic head is formed by performing a head forming process, a mounting part forming process and a light source mounting process in that order. In the head forming process, a planned area is secured on a light source placing surface of a slider substrate, then a magnetic head part is formed on a head area other than the planned area and a spacer for securing a mounting space for the laser diode is formed on the planned area. In the mounting part forming process, a light source mounting part is formed by removing the spacer. In the light source mounting process, a laser diode is mounted on the light source mounting part formed by the mounting part forming step.
摘要翻译：通过以该顺序执行头部成形工艺，安装部件形成工艺和光源安装工艺来形成热辅助磁头。在头部成形处理中，将规划区域固定在滑块基板的光源放置面上，然后将磁头部形成在除了规划区域以外的头部区域上，并且用于固定激光二极管的安装空间的间隔件在规划区域形成。在安装部形成工序中，通过移除间隔件形成光源安装部。在光源安装过程中，激光二极管安装在由安装部分形成步骤形成的光源安装部分上。

82. 发明申请

US20120080782A1 METHOD OF MANUFACTURING LAYERED CHIP PACKAGE 有权
标题翻译：制造分层芯片包装的方法
公开(公告)号：US20120080782A1
公开(公告)日：2012-04-05
申请号：US12896283
申请日：2010-10-01
申请人： Yoshitaka SASAKI , Hiroyuki ITO , Hiroshi IKEJIMA , Atsushi IIJIMA
发明人： Yoshitaka SASAKI , Hiroyuki ITO , Hiroshi IKEJIMA , Atsushi IIJIMA
IPC分类号： H01L25/11 , H01L21/98
CPC分类号： H01L25/50 , H01L22/22 , H01L23/5389 , H01L24/19 , H01L24/20 , H01L24/96 , H01L24/97 , H01L25/0657 , H01L25/105 , H01L2224/04105 , H01L2224/08145 , H01L2224/13025 , H01L2224/131 , H01L2224/32145 , H01L2224/73267 , H01L2224/97 , H01L2225/06524 , H01L2225/06527 , H01L2225/06558 , H01L2225/1035 , H01L2225/1064 , H01L2924/01029 , H01L2924/07802 , H01L2924/3511 , H01L2224/19 , H01L2224/83 , H01L2924/00 , H01L2924/014
摘要： A layered chip package includes a main body, and wiring that includes a plurality of wires disposed on a side surface of the main body. The main body includes: a main part including first and second layer portions; and a plurality of first and second terminals that are disposed on the top and bottom surfaces of the main part, respectively, and are electrically connected to the plurality of wires. The first and second terminals are formed by using electrodes of the first and second layer portions. The layered chip package is manufactured by fabricating a layered substructure by stacking two substructures each of which includes an array of a plurality of preliminary layer portions, and then cutting the layered substructure. The layered substructure includes a plurality of preliminary wires that are disposed between two adjacent pre-separation main bodies and are to become the plurality of wires.
摘要翻译：分层芯片封装包括主体和布线，其包括布置在主体的侧表面上的多根导线。主体包括：主要部分，包括第一和第二层部分; 以及多个第一和第二端子，其分别设置在主要部分的顶表面和底表面上，并且电连接到多个导线。第一和第二端子通过使用第一和第二层部分的电极形成。通过层叠两个子结构（其中包括多个预备层部分的阵列），然后切割层状子结构，通过制造层状子结构来制造分层芯片封装。分层子结构包括多个初级线，其布置在两个相邻的预分离主体之间并且将成为多根线。

83. 发明申请

US20110180932A1 METHOD OF MANUFACTURING LAYERED CHIP PACKAGE 有权
标题翻译：制造分层芯片包装的方法
公开(公告)号：US20110180932A1
公开(公告)日：2011-07-28
申请号：US12869471
申请日：2010-08-26
申请人： Yoshitaka SASAKI , Hiroyuki Ito , Atsushi Iijima
发明人： Yoshitaka SASAKI , Hiroyuki Ito , Atsushi Iijima
IPC分类号： H01L23/48 , H01L21/768
CPC分类号： H01L21/76898 , H01L21/563 , H01L21/6835 , H01L23/544 , H01L24/02 , H01L24/24 , H01L24/25 , H01L24/29 , H01L24/32 , H01L24/74 , H01L24/82 , H01L24/83 , H01L24/92 , H01L24/94 , H01L24/95 , H01L24/96 , H01L24/97 , H01L25/0657 , H01L25/50 , H01L2221/68327 , H01L2223/54406 , H01L2223/54433 , H01L2223/54453 , H01L2224/02311 , H01L2224/02313 , H01L2224/02321 , H01L2224/02371 , H01L2224/02375 , H01L2224/02379 , H01L2224/02381 , H01L2224/0239 , H01L2224/24011 , H01L2224/24145 , H01L2224/24146 , H01L2224/245 , H01L2224/2919 , H01L2224/32148 , H01L2224/82005 , H01L2224/821 , H01L2224/82101 , H01L2224/82106 , H01L2224/83005 , H01L2224/8385 , H01L2224/9202 , H01L2224/92244 , H01L2224/94 , H01L2224/95001 , H01L2224/96 , H01L2224/97 , H01L2225/06551 , H01L2225/06565 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2224/82 , H01L2924/00 , H01L2221/68304
摘要： A layered chip package includes a main body, and wiring including a plurality of wires disposed on a side surface of the main body. The main body includes a plurality of semiconductor chips stacked, and a plurality of electrodes that electrically connect the semiconductor chips to the wires. A method of manufacturing the layered chip package includes the steps of: fabricating a substructure that includes an array of a plurality of pre-separation main bodies and a plurality of holes for accommodating a plurality of preliminary wires, the holes being formed between two adjacent pre-separation main bodies; forming the preliminary wires in the plurality of holes by plating; and cutting the substructure so that the plurality of pre-separation main bodies are separated from each other and the preliminary wires are split into two sets of wires of two separate main bodies, whereby a plurality of layered chip packages are formed.
摘要翻译：分层芯片封装包括主体和布置在主体的侧表面上的多根导线的布线。主体包括堆叠的多个半导体芯片和将半导体芯片电连接到导线的多个电极。制造层状芯片封装的方法包括以下步骤：制造包括多个预分离主体的阵列和用于容纳多条初级线的多个孔的子结构，所述孔形成在两个相邻的预制分离主体; 通过电镀在多个孔中形成预备的电线; 并且切割所述子结构，使得所述多个预分离主体彼此分离，并且所述预备线被分成两组分离的主体的两组线，由此形成多个分层的芯片封装。

84. 发明申请

US20100118438A1 THIN-FILM MAGNETIC HEAD, METHOD OF MANUFACTURING THE SAME, HEAD GIMBAL ASSEMBLY AND HARD DISK DRIVE 有权
标题翻译：薄膜磁头，其制造方法，头部组装和硬盘驱动
公开(公告)号：US20100118438A1
公开(公告)日：2010-05-13
申请号：US12690381
申请日：2010-01-20
申请人： Yoshitaka SASAKI , Hiroyuki ITO , Takehiro HORINAKA , Takehiro KAMIGAMA , Tatsushi SHIMIZU
发明人： Yoshitaka SASAKI , Hiroyuki ITO , Takehiro HORINAKA , Takehiro KAMIGAMA , Tatsushi SHIMIZU
IPC分类号： G11B5/187
CPC分类号： G11B5/1278 , G11B5/3116 , G11B5/3123 , G11B5/3163 , Y10T29/49032 , Y10T29/49043 , Y10T29/49046 , Y10T29/49048 , Y10T29/49052
摘要： A thin-film magnetic head is manufactured as follows. First, a base insulating layer having a magnetic pole forming depression sunken into a form corresponding to the main magnetic pole layer is formed, a stop film for CMP is formed such as to fill the magnetic pole forming depression, and then a magnetic layer is formed on the stop film. Next, the magnetic layer is separated by forming a separation groove substantially surrounding the magnetic pole forming depression on the outside thereof, and thus separated magnetic layer is formed with a cover insulating film adapted to cover the whole upper face. The surface is polished by CMP until the stop film is exposed, so that the part of magnetic layer remaining on the inside of the magnetic pole forming depression is used as the main magnetic pole layer. Further, a recording gap layer, a write shield layer, and a thin-film coil are formed.
摘要翻译：如下制造薄膜磁头。首先，形成具有凹陷形成为与主磁极层对应的形状的磁极形成凹部的基底绝缘层，形成用于填充磁极形成凹部的用于CMP的停止膜，然后形成磁性层在停止电影。接下来，通过在其外侧形成基本上围绕磁极形成凹部的分离槽来分离磁性层，由此分离的磁性层形成有覆盖整个上表面的覆盖绝缘膜。通过CMP抛光表面，直到停止膜露出，使得残留在磁极形成凹部内侧的磁性层的一部分被用作主磁极层。此外，形成记录间隙层，写入屏蔽层和薄膜线圈。

85. 发明申请

US20070214635A1 THIN FILM MAGNETIC HEAD AND MANUFACTURING METHOD THEREOF 失效
标题翻译：薄膜磁头及其制造方法
公开(公告)号：US20070214635A1
公开(公告)日：2007-09-20
申请号：US11748919
申请日：2007-05-15
申请人： Yoshitaka SASAKI , Takehiro KAMIGAMA
发明人： Yoshitaka SASAKI , Takehiro KAMIGAMA
IPC分类号： G11B5/127 , H04R31/00
CPC分类号： G11B5/3116 , Y10T29/49043 , Y10T29/49044 , Y10T29/49046 , Y10T29/4906
摘要： A method for manufacturing a thin film magnetic head with a write element, the write element having a first yoke portion and a second yoke portion connected to each other by a back gap portion, a first pole portion and a second pole portion disposed in the medium-facing surface side of the first yoke portion and the second yoke portion respectively, a gap film disposed between the first pole portion and the second pole portion, and a coil surrounding in a spiral form the back gap portion, and the manufacturing method including the steps of forming the coil above the first yoke portion, forming a part which the first pole portion is composed of so that the part extends to cover the upper surface of the coil, forming the gap film on the first pole portion, forming the second yoke portion, which includes the second pole portion, above the gap film, and trimming the first pole portion so as to have a width fitting the second pole portion.
摘要翻译：一种用于制造具有写入元件的薄膜磁头的方法，所述写入元件具有第一磁轭部分和通过后部间隙部分彼此连接的第二磁轭部分，所述第一磁极部分和第二磁极部分设置在所述介质中第一磁轭部分和第二磁轭部分的表面侧分别设置在第一磁极部分和第二磁极部分之间的间隙膜和围绕螺旋形的线圈形成后间隙部分，并且包括在第一磁轭部分上方形成线圈的步骤，形成第一极部分构成的部分，使得部分延伸以覆盖线圈的上表面，在第一极部分上形成间隙膜，形成第二磁轭部分，其包括第二极部，在间隙膜上方，并且修整第一极部，以便具有适配第二极部的宽度。

86. 发明申请

US20100195262A1 CERAMIC CAPACITOR AND METHOD OF MANUFACTURING SAME 有权
标题翻译：陶瓷电容器及其制造方法
公开(公告)号：US20100195262A1
公开(公告)日：2010-08-05
申请号：US12362830
申请日：2009-01-30
申请人： Yoshitaka SASAKI , Atsushi IIJIMA , Hiroshi IKEJIMA
发明人： Yoshitaka SASAKI , Atsushi IIJIMA , Hiroshi IKEJIMA
IPC分类号： H01G4/06 , H01M4/29
CPC分类号： H01G4/30 , H01G4/008 , H01G4/012 , H01G4/12 , H01G4/232
摘要： In a ceramic capacitor according to the present invention, the electrode strips of an internal electrode and the dielectric strips of a ceramic dielectric member are arranged perpendicularly to the surface of a substrate, and as such, the plurality of electrode strips and the plurality of dielectric strips are arranged alternately along a parallel direction relative to the substrate surface. That is, the electrode strips and the dielectric strips are multi-layered along a parallel direction relative to the substrate surface, thereby facilitating the realization of multi-layering in the ceramic capacitor by a known patterning technology.
摘要翻译：在根据本发明的陶瓷电容器中，内部电极的电极条和陶瓷电介质部件的介质带垂直于衬底的表面设置，因此，多个电极条和多个电介质条带相对于基板表面沿平行方向交替布置。也就是说，电极条和介质条沿着相对于基板表面的平行方向是多层的，从而通过已知的图案化技术有助于在陶瓷电容器中实现多层。

87. 发明申请

US20090045162A1 THIN FILM MAGNETIC HEAD AND MANUFACTURING METHOD THEREOF 有权
标题翻译：薄膜磁头及其制造方法
公开(公告)号：US20090045162A1
公开(公告)日：2009-02-19
申请号：US12252411
申请日：2008-10-16
申请人： Yoshitaka SASAKI , Hiroyuki Itoh , Takehiro Kamigama , Tatsushi Shimizu
发明人： Yoshitaka SASAKI , Hiroyuki Itoh , Takehiro Kamigama , Tatsushi Shimizu
IPC分类号： G11B5/33 , B05D5/12
CPC分类号： G11B5/3116 , G11B5/1278
摘要： A thin film magnetic head has a configuration in which a main magnetic pole film having a magnetic pole end portion on a medium opposing surface (ABS) side facing a magnetic disk, a write shield film facing the magnetic pole end portion so as to form a recording gap film on the medium opposing surface side, and a thin film coil wound around at least a part of the write shield film are laminated. Further, the thin film magnetic head has an upper yoke magnetic pole film whose size is larger than that of the main magnetic pole film at a part more distant from the ABS than the recording gap film, and this upper yoke magnetic pole film is bonded to the side of the main magnetic pole film close to the thin film coil. In the upper yoke magnetic pole film, an end portion on the ABS side is retracted in a direction apart from the ABS in accordance with an increase in film thickness which is measured from the surface of the main magnetic pole film.
摘要翻译：薄膜磁头具有这样的结构，其中在与磁盘相对的介质相对表面（ABS）侧上具有磁极端部的主磁极膜，面对磁极端部的写入屏蔽膜以形成记录间隙膜在介质相对表面侧上，并且缠绕在写保护膜的至少一部分上的薄膜线圈。此外，薄膜磁头具有比记录间隙膜更远离ABS的部分的尺寸大于主磁极膜的上磁轭磁极膜，并且该上磁轭磁极膜粘合到主磁极膜的一侧靠近薄膜线圈。在上磁轭磁极膜中，根据从主磁极膜的表面测量的膜厚度的增加，ABS侧的端部沿与ABS隔离的方向缩回。

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