会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 84. 发明申请
    • Optical scanning device and image formation apparatus
    • 光学扫描装置及图像形成装置
    • US20080042049A1
    • 2008-02-21
    • US11785334
    • 2007-04-17
    • Yoshiyuki Suzuki
    • Yoshiyuki Suzuki
    • H01J3/14
    • G02B26/125G03G15/0409G03G15/0435G03G15/326H04N1/1135H04N1/506
    • An optical scanning device includes: a light source; a first optical element that converts light emitted from the light source to parallel light; a deflection element that deflects the light in a fast scanning direction to scan a surface of an object to be scanned with the light at a constant speed; a second optical element that guides the light to the deflection element; and a third optical element that focuses the light deflected by the deflection element onto the surface of the object to be scanned, at least one surface among surfaces of the third optical element that intersect the light including a surface form which affects only one of fast scanning direction characteristics or slow scanning direction characteristics at an image plane.
    • 光学扫描装置包括:光源; 将从光源发射的光转换为平行光的第一光学元件; 偏转元件,其以快速扫描方向偏转光,以恒定速度用光扫描要扫描的物体的表面; 第二光学元件,其将光引导到偏转元件; 以及第三光学元件,其将由所述偏转元件偏转的光聚焦到待扫描对象的表面上,所述第三光学元件的与所述光相交的表面中的至少一个表面包括仅影响快速扫描中的一个的表面形式 方向特性或扫描方向特性较慢。
    • 87. 发明申请
    • Semiconductor device and method for fabricating the same
    • 半导体装置及其制造方法
    • US20050258498A1
    • 2005-11-24
    • US10950618
    • 2004-09-28
    • Yoshiyuki Suzuki
    • Yoshiyuki Suzuki
    • H01L21/768H01L21/82H01L21/8238H01L21/8244H01L23/485H01L23/522H01L27/11H01L29/76
    • H01L21/76838H01L21/76808H01L21/823871H01L23/485H01L23/5226H01L2924/0002H01L2924/00
    • The semiconductor device comprises a conductor plug 20 and an interconnection 22 having one end connected directly to an upper part of the conductor plug 20. The conductor plug 20 has a projection 20a formed at the upper part of the conductor plug 20 integral with the conductor plug 20 and having a projection 20a projected in the direction from one end of the interconnection 22 toward the inside thereof. The interconnection 22 is connected to at least the projection 20a of the conductor plug 20. Because of the projection 20a of the conductor plug 20 is formed, even when the pattern of the interconnection 22 is largely set back, the connection between the interconnection 22 and the conductor plug 20 can be ensured at least at the projection 20a. Thus, even when the pattern of the interconnection 22 is largely set back due to the micronization and high density of the interconnection 22, the interconnection 22 and the conductor plug 20 can be connected to each other without failure. Accordingly, the present invention can provide a semiconductor device which can realize micronization and high integration while ensuring reliability.
    • 半导体器件包括导体插头20和互连线22,其一端直接连接到导体插头20的上部。 导体插头20具有形成在导体插塞20的上部的突起20a,导体插塞20与导体插塞20成一体,并且具有从互连22的一端向其内侧突出的突出部20a。 互连线22至少连接到导体插头20的突出部分20a上。 由于形成了导体插塞20的突起部20a,所以即使当互连线22的图案被大大地退回时,至少在突起部20a处可以确保互连线22与导体插头20之间的连接。 因此,即使由于互连22的微细化和高密度而导致互连线22的图案大幅度地退回,互连线22和导体插头20也可以相互连接而没有故障。 因此,本发明可以提供一种在确保可靠性的同时实现微粉化和高集成度的半导体装置。
    • 88. 发明申请
    • Composite for building material, and method of manufacturing building material using the same
    • 建筑材料用复合材料及其制造方法
    • US20050241533A1
    • 2005-11-03
    • US11149382
    • 2005-06-09
    • Hiroshi MurakamiYoshiyuki SuzukiMasami Gotou
    • Hiroshi MurakamiYoshiyuki SuzukiMasami Gotou
    • C04B28/00B28C5/00C04B14/08C04B18/26C04B28/02C04B111/00E04B2/00
    • C04B28/02Y02W30/97C04B14/08C04B18/24C04B18/26
    • To provide a composite for a building material capable of manufacturing a building material that is harmless to living environment and global environment and can be recycled. The composite for a building material contains diatomaceous earth, waste lumber, and inorganic hardener, or further contains field earth, and, as necessary, contains used paper and/or crushed pieces of used tatami mat and used tile, and crushed earth. The composite for a building material is prepared by homogeneously mixing the components, and then the building material is manufactured by molding and curing the composite. The manufactured building material has a high humidity conditioning property as in the case of the conventional mud wall made of coarse clay, and is easily recycled by being crushed. Moreover, this building material does not cause hypersensitiveness to chemical substances because it produces no chemical substances, and has a feel of earth so that earthen walls and flower beds made by using this building material integrate well with an appearance of ancient city and are in harmony with beautiful appearance of houses properly.
    • 提供能够制造对生活环境和全球环境无害的建筑材料的建筑材料的复合材料,并且可以回收利用。 用于建筑材料的复合材料包含硅藻土,废木材和无机硬化剂,或进一步包含场土,并且根据需要含有二手榻榻米和二手瓷砖和粉碎土的二手纸和/或碎片。 通过均匀混合组分制备建筑材料的复合材料,然后通过模塑和固化复合材料制造建筑材料。 所制造的建筑材料具有如在由粗粘土制成的常规泥浆壁的情况下的高湿度调节性能,并且通过被粉碎容易地再循环。 此外,这种建筑材料不会对化学物质造成超敏感,因为它不产生化学物质,并且具有地球感,使得通过使用这种建筑材料制成的土墙和花坛与古城的外观融合并且和谐相处 正确的房子美丽的外观。