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81. 发明申请

US20080237965A1 SHEET PROCESSING APPARATUS AND IMAGE FORMING SYSTEM 失效
标题翻译：表格处理设备和图像形成系统
公开(公告)号：US20080237965A1
公开(公告)日：2008-10-02
申请号：US12055026
申请日：2008-03-25
申请人： Tsuyoshi Moriyama , Hitoshi Kato , Yasuo Fukatsu , Naoki Ishikawa
发明人： Tsuyoshi Moriyama , Hitoshi Kato , Yasuo Fukatsu , Naoki Ishikawa
IPC分类号： B65H39/00
CPC分类号： B65H31/34 , B42C1/125 , B65H2301/3621 , B65H2301/4213 , B65H2511/20 , B65H2801/06 , B65H2220/01 , B65H2220/02 , B65H2220/11
摘要： An image forming system which is capable of preventing paper jam from occurring in a sheet processing apparatus to thereby maintain the stability of the system. An alignment plates of an alignment unit movable in a lateral direction each sheet are brought into abutment with opposite side edges of sheets stacked on the sheet stack unit to laterally align the sheets. A lateral registration sensor unit detects a lateral position of the sheet being conveyed. When the detected lateral position of the sheet is beyond a predetermined position, the CPU of the apparatus changes the standby positions of the alignment plates such that spacing therebetween in the lateral direction the sheet is widened by a predetermined amount, and extends the conveying interval of sheets in the image forming apparatus by a predetermined time period.
摘要翻译：一种图像形成系统，其能够防止在片材处理装置中发生卡纸，从而保持系统的稳定性。每个片材沿横向可移动的对准单元的对准板与堆叠在片材堆叠单元上的片材的相对侧边缘邻接，以横向对准片材。横向对位传感器单元检测被传送的片材的横向位置。当检测到的片材的横向位置超过预定位置时，设备的CPU改变对准板的待机位置，使得在片材的横向方向上的间隔被加宽了预定量，并且延长了传送间隔片材在图像形成装置中预定的时间段。

82. 发明申请

US20080054440A1 Wire bonding method, wire bonding apparatus and semiconductor device 审中-公开
标题翻译：引线接合方法，引线接合装置和半导体器件
公开(公告)号：US20080054440A1
公开(公告)日：2008-03-06
申请号：US11651515
申请日：2007-01-10
申请人： Takayoshi Matsumura , Hidehiko Kira , Naoki Ishikawa
发明人： Takayoshi Matsumura , Hidehiko Kira , Naoki Ishikawa
IPC分类号： H01L23/48
CPC分类号： H01L24/85 , H01L24/48 , H01L24/49 , H01L24/78 , H01L2224/05554 , H01L2224/32145 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/49171 , H01L2224/78301 , H01L2224/786 , H01L2224/78801 , H01L2224/851 , H01L2224/85181 , H01L2224/85205 , H01L2224/85206 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01033 , H01L2924/01074 , H01L2924/01082 , H01L2924/14 , H01L2924/00 , H01L2224/45099 , H01L2224/05599
摘要： The wire bonding method includes: a first connecting step of supplying an end of wire for electric wiring to a first electrode on an IC chip and applying vibration to the wire, thereby connecting the end of the wire to the first electrode; a wire stretching step of stretching the wire whose end is connected to the first electrode up to a second electrode on a different member from the IC chip; and a second connecting step of connecting the wire to the second electrode by applying vibration, in an extension direction of the wire stretched from the first electrode to the second electrode, to a portion of the wire overlapping the second electrode.
摘要翻译：引线接合方法包括：向IC芯片上的第一电极提供用于电布线的端部的第一连接步骤，并且对线施加振动，从而将线的端部连接到第一电极; 线材拉伸步骤，其将所述导线的端部与所述IC芯片连接到第一电极直到与所述IC芯片不同的构件上的第二电极; 以及第二连接步骤，通过在从第一电极延伸到第二电极的电线的延伸方向上施加振动，将电线连接到第二电极到与第二电极重叠的部分。

83. 发明申请

US20080003713A1 RFID tag manufacturing methods and RFID tags 失效
标题翻译： RFID标签制造方法和RFID标签
公开(公告)号：US20080003713A1
公开(公告)日：2008-01-03
申请号：US11606328
申请日：2006-11-30
申请人： Hiroshi Kobayashi , Naoki Ishikawa , Takayoshi Matsumura
发明人： Hiroshi Kobayashi , Naoki Ishikawa , Takayoshi Matsumura
IPC分类号： H01L21/00 , G08B13/14
CPC分类号： G06K19/07749 , G06K19/07752 , H01L2224/16 , H01L2224/75251 , H01L2224/75252 , H01L2224/83192 , H01L2224/83855 , H01L2924/00011 , H01L2924/00014 , H01L2924/01079 , H01L2224/0401
摘要： A method includes a step of preparing a strap having a connecting metal pattern formed on a base, and mounted with the circuit chip, the pattern connecting a circuit chip to a metal antenna pattern. A substrate has a concave section which houses the circuit chip and is formed on a first face. The metal antenna pattern extends over a first face and a second face of the base so as to circle them except for the concave section and to have the both ends positioned across the concave section. The method includes a connection step of positioning and directing the strap and the substrate to house the circuit chip in the concave section and covering the strap and the substrate with a covering material so as to fix the strap and the substrate in a state where the connection metal pattern is connected to the metal antenna pattern.
摘要翻译：一种方法包括制备具有形成在基底上的连接金属图案并且安装有电路芯片的带的步骤，该图案将电路芯片连接到金属天线图案。基板具有容纳电路芯片并形成在第一面上的凹部。金属天线图案在基座的第一面和第二面之上延伸，以便除了凹部之外使其圆形，并且使两端位于凹部的两端。该方法包括一个连接步骤，用于定位和引导带子和基底，以将电路芯片容纳在凹形部分中，并用覆盖材料覆盖带子和基底，从而将带子和基底固定在连接金属图案连接到金属天线图案。

84. 发明申请

US20070261731A1 Photovoltaic Power Generation Module and Photovoltaic Power Generation System Employing Same 有权
标题翻译：光伏发电模块和使用相同的光伏发电系统
公开(公告)号：US20070261731A1
公开(公告)日：2007-11-15
申请号：US11660701
申请日：2005-07-15
申请人： Takao Abe , Naoki Ishikawa
发明人： Takao Abe , Naoki Ishikawa
IPC分类号： H01L31/042
CPC分类号： H01L31/042 , H01L31/035281 , H02S20/23 , Y02B10/12 , Y02E10/50
摘要： The object is to provide a photovoltaic power generation module that reduces the loss from a disk-shaped single crystal wafer and can make full use of arcuate cells, which have not until now been utilized effectively, and a photovoltaic power generation system employing same, to provide a photovoltaic power generation module having a high operating voltage per unit area (also called ‘area voltage’), and a photovoltaic power generation system employing same and, furthermore, to provide a photovoltaic power generation module that can increase the module coverage ratio relative to the effective area for installation on a house roof, and a photovoltaic power generation system employing same. The photovoltaic power generation module comprises arcuate cells divided from a disk-shaped single crystal silicon photovoltaic power generation cell, the arcuate cells having a circular arc with a central angle of 90°, the arcuate cells having a grid-perpendicular to the chord and at least one busbar perpendicular to the grid, and the arcuate cells being arrayed in a lattice pattern, wherein the arcuate cells have an area of 28 to 65 cm2 and 14 to 42 thereof are arrayed.
摘要翻译：本发明的目的是提供一种光盘发电模块，其减少了从圆盘形单晶晶片的损耗，并且可以充分利用直到现在被有效利用的弓形电池，以及使用其的光伏发电系统，提供具有每单位面积的高工作电压（也称为“面积电压”）的光伏发电模块，以及使用该光伏发电系统的光伏发电系统，此外，提供能够提高模块覆盖率相对值的光伏发电模块用于安装在屋顶上的有效区域，以及采用该屋顶的光伏发电系统。光伏发电模块包括从盘状单晶硅光伏发电电池分割的弓形电池，该弧形电池具有中心角为90°的圆弧，该弧形电池具有垂直于弦的栅格和至少一个母线垂直于所述格栅，并且所述弓形电池被排列成格子图案，其中所述弓形电池具有28至65cm 2的面积，并且其阵列为14至42。

85. 发明申请

US20070261233A1 Method and system for fabricating a semiconductor device 审中-公开
公开(公告)号：US20070261233A1
公开(公告)日：2007-11-15
申请号：US11822977
申请日：2007-07-11
申请人： Hidehiko Kira , Masanao Fujii , Naoki Ishikawa
发明人： Hidehiko Kira , Masanao Fujii , Naoki Ishikawa
IPC分类号： B23P19/00
CPC分类号： H01L21/6835 , H01L24/11 , H01L24/29 , H01L24/83 , H01L24/90 , H01L24/95 , H01L25/50 , H01L2224/1134 , H01L2224/11822 , H01L2224/13099 , H01L2224/13124 , H01L2224/13144 , H01L2224/13147 , H01L2224/16225 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/73204 , H01L2224/75251 , H01L2224/75252 , H01L2224/78302 , H01L2224/81907 , H01L2224/83191 , H01L2224/83192 , H01L2224/83194 , H01L2224/83855 , H01L2224/83856 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/07802 , H01L2924/0781 , Y10T29/53178 , Y10T29/53187 , Y10T29/53191 , H01L2924/00 , H01L2924/00012 , H01L2224/48
摘要： A fabrication method of a semiconductor device is disclosed. The method includes the following steps. First, a given number of projection electrodes are formed on each of a given number of semiconductor chips, and a thermosetting insulating adhesive is applied to areas of mounting parts where the semiconductor chips are to be mounted on a substrate. Second, the thermosetting insulating adhesive on the substrate is heated with a half-thermosetting temperature. Third, the semiconductor chips are aligned to the mounting parts of the substrate and a first fixing of the semiconductor chips is performed with a first pressure. Fourth, the substrate, on which the semiconductor chips are fixed, is heated with a thermosetting temperature of the thermosetting insulating adhesive, and a second fixing of the semiconductor chips is performed with a second pressure.

86. 发明申请

US20070193021A1 RFID tag manufacturing method and RFID tag 有权
标题翻译： RFID标签制造方法和RFID标签
公开(公告)号：US20070193021A1
公开(公告)日：2007-08-23
申请号：US11702168
申请日：2007-02-05
申请人： Hiroshi Kobayashi , Naoki Ishikawa , Takayoshi Matsumura , Shunji Baba
发明人： Hiroshi Kobayashi , Naoki Ishikawa , Takayoshi Matsumura , Shunji Baba
IPC分类号： H01Q17/00 , G08B13/14
CPC分类号： H01Q1/38 , G06K19/07752 , G06K19/07771 , H01L2224/75252 , H01L2224/83192 , H01L2924/01078 , H01L2924/01079 , H01Q1/2208 , H01Q7/00 , Y10T29/49002 , Y10T29/49016 , Y10T29/49018 , Y10T29/49155 , Y10T29/49165
摘要： In a manufacturing method of a thin and small RFID tag, an antenna metal pattern is formed on a substrate, going once around a dielectric plate, and a recess is formed on the substrate to house an IC chip. A strap on which the IC chip is mounted is connected and fastened to the substrate in the position and orientation in which the IC chip is housed in the recess.
摘要翻译：在薄型和小型RFID标签的制造方法中，在基板上形成天线金属图案，绕电介质板一次，并且在基板上形成凹部以容纳IC芯片。将IC芯片安装在其上的带子以将IC芯片容纳在凹槽中的位置和方向连接并紧固到基板。

87. 发明申请

US20070119045A1 Method of assembling a carriage assembly and assembling apparatus 失效
标题翻译：组装支架组件和组装装置的方法
公开(公告)号：US20070119045A1
公开(公告)日：2007-05-31
申请号：US11375210
申请日：2006-03-15
申请人： Takayoshi Matsumura , Naoki Ishikawa , Hiroshi Kobayashi , Yasuo Moriya , Hidehiko Kira
发明人： Takayoshi Matsumura , Naoki Ishikawa , Hiroshi Kobayashi , Yasuo Moriya , Hidehiko Kira
IPC分类号： G11B5/48 , G11B21/16 , G11B5/127 , B23P19/00 , G11C5/12
CPC分类号： G11B5/4813 , Y10T29/49025 , Y10T29/49027 , Y10T29/49915 , Y10T29/49934 , Y10T29/49938 , Y10T29/53165
摘要： A method of assembling a carriage assembly is capable of suppressing deformation of spacer portions when suspensions are attached to carriage arms. The method of assembling a carriage assembly aligns fitting holes provided in front end portions of carriage arms and spacer holes provided in spacer portions of suspensions and places the suspensions onto the carriage arms, and then presses a ball with a diameter equal to or greater than an inner diameter of the spacer holes with a pressure-applying member to pass the ball through the spacer holes, thereby crimping spacer hole edge portions of the spacer portions and attaching the suspensions to the front end portions of the carriage arms. By applying ultrasonic vibration from two axial directions to the pressure applying member, the pressure applying member is caused to vibrate on a two dimensional movement path on a predetermined plane and passes the ball through the spacer holes while causing the ball to rotate.
摘要翻译：一种组装滑架组件的方法能够在将悬架连接到滑架臂时抑制间隔部分的变形。组装滑架组件的方法将设置在滑架臂的前端部分的设置孔和设置在悬架的间隔部分中的间隔孔对准，并将悬架放置在滑架臂上，然后将直径等于或大于具有加压构件的间隔孔的内径使球通过间隔孔，由此压接间隔件部分的间隔孔边缘部分并将悬架附接到托架臂的前端部。通过将两个轴向的超声波振动施加到压力施加构件，使压力施加构件在预定平面上的二维运动路径上振动，并使球通过间隔孔，同时使球旋转。

88. 发明申请

US20060208094A1 RFID tag, module component, and RFID tag fabrication method 失效
标题翻译： RFID标签，模块组件和RFID标签制造方法
公开(公告)号：US20060208094A1
公开(公告)日：2006-09-21
申请号：US11188346
申请日：2005-07-25
申请人： Naoki Ishikawa , Shunji Baba , Hidehiko Kira , Hiroshi Kobayashi , Shunichi Kikuchi
发明人： Naoki Ishikawa , Shunji Baba , Hidehiko Kira , Hiroshi Kobayashi , Shunichi Kikuchi
IPC分类号： G06K19/06
CPC分类号： G06K19/0775 , G06K19/07749 , H01L24/11 , H01L2224/05001 , H01L2224/05023 , H01L2224/05568 , H01L2224/1134 , H01L2224/131 , H01L2224/16 , H01L2224/16225 , H01L2224/16227 , H01L2224/32225 , H01L2224/73204 , H01L2224/83192 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/14 , H01L2224/13099 , H01L2924/00 , H01L2224/05599
摘要： An RFID tag is provided which comprises: a first part which has a first base and a communication antenna formed on the first base by use of a paste of resin material mixed with metallic filler; and a second part disposed on the first part, which has a second base, a metallic patch disposed on the second base and electrically connected to the antenna on the first part, and a circuit chip connected onto the metallic patch via a bump, the circuit chip performing radio communication via the antenna.
摘要翻译：提供一种RFID标签，其包括：第一部分，其具有通过使用与金属填料混合的树脂材料的浆料形成在第一基部上的第一基座和通信天线; 以及设置在第一部分上的第二部分，其具有第二基底，设置在第二基底上并与第一部分上的天线电连接的金属贴片，以及通过凸块连接到金属贴片上的电路芯片，该电路芯片通过天线执行无线电通信。

89. 发明申请

US20060124349A1 Diamond-coated silicon and electrode 审中-公开
标题翻译：金刚石涂层的硅和电极
公开(公告)号：US20060124349A1
公开(公告)日：2006-06-15
申请号：US10540464
申请日：2003-12-24
申请人： Hiroyuki Fujimura , Roberto Serikawa , Naoki Ishikawa , Takahiro Mishima
发明人： Hiroyuki Fujimura , Roberto Serikawa , Naoki Ishikawa , Takahiro Mishima
IPC分类号： H05K1/09
CPC分类号： C30B25/18 , C23C16/27 , C23C16/545 , C30B25/02 , C30B29/04 , Y10T428/30
摘要： The present invention intends to provide an industrially applicable diamond electrode and a diamond-coated silicon used in the electrode. A silicon substrate having a thickness of 500 μm or less, at least partially coated with electrically conductive diamond is used as a diamond-coated silicon. In addition, an electrically conductive support substrate and the diamond-coated silicon is used as an electrode. The diamond-coated silicon is flexible and it can be adhered to the electrically conductive support substrate, and thereby a large area electrode and a three-dimensional electrode structure can be easily obtained.
摘要翻译：本发明旨在提供一种工业上应用的金刚石电极和在电极中使用的金刚石涂层的硅。使用至少部分涂覆有导电金刚石的厚度为500μm或更小的硅衬底作为金刚石涂覆的硅。此外，使用导电支撑基板和金刚石涂覆的硅作为电极。金刚石涂覆的硅是柔性的并且可以粘附到导电支撑衬底上，从而可以容易地获得大面积电极和三维电极结构。

90. 发明申请

US20060097877A1 RFID tag 失效
标题翻译： RFID标签
公开(公告)号：US20060097877A1
公开(公告)日：2006-05-11
申请号：US11062483
申请日：2005-02-23
申请人： Shunji Baba , Naoki Ishikawa , Hidehiko Kira , Hiroshi Kobayashi , Shigeru Hashimoto , Yoshiyasu Sugimura
发明人： Shunji Baba , Naoki Ishikawa , Hidehiko Kira , Hiroshi Kobayashi , Shigeru Hashimoto , Yoshiyasu Sugimura
IPC分类号： G08B13/14
CPC分类号： H01L23/573 , G06K19/073 , G06K19/0739 , H01L23/49855 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/00011 , H01L2924/00014 , H01L2924/00 , H01L2224/0401
摘要： The present invention provides an RFID tag that is very effective in preventing fraudulent uses. The RFID tag includes a base, an antenna pattern provided on the base, a breakdown pattern provided on the base, a circuit chip connected to both the antenna pattern and the breakdown pattern, and a cover that is bonded to the base in a strippable condition so as to cover the antenna pattern, the breakdown pattern and the circuit chip and is caused to come off together with all or a part of the breakdown pattern during stripping from the base. The breakdown pattern is transparent, or the cover conceals a remaining part of the breakdown pattern, or the breakdown pattern has a specific part that produces predetermined electrical properties and the cover conceals the specific part.
摘要翻译：本发明提供一种非常有效防止欺诈用途的RFID标签。 RFID标签包括基座，设置在基座上的天线图案，设置在基座上的击穿图案，连接到天线图案和击穿图案的电路芯片，以及以可剥离状态接合到基座的盖子以覆盖天线图案，击穿图案和电路芯片，并且在从基座剥离时与所有或部分击穿图案一起脱落。击穿图案是透明的，或者盖子隐藏击穿图案的剩余部分，或者击穿图案具有产生预定电气特性的特定部件，并且盖子隐藏特定部件。

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