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81. 发明申请

US20080008181A1 Packet transferring node 有权
标题翻译：分组传送节点
公开(公告)号：US20080008181A1
公开(公告)日：2008-01-10
申请号：US11710396
申请日：2007-02-26
申请人： Masaki Yamada , Mitsuru Nagasaka , Takayuki Muranaka , Yoshihiro Nakao , Shinichi Akahane
发明人： Masaki Yamada , Mitsuru Nagasaka , Takayuki Muranaka , Yoshihiro Nakao , Shinichi Akahane
IPC分类号： H04L12/56
CPC分类号： H04L45/28 , H04L45/02 , H04L45/44
摘要： In the case of a “distributed” integrated network node (architecture), a specific judgment process cannot be executed in any routing and transferring unit. The routing and transferring unit has been required to share such judgment process related information with an enhanced processing unit or with other routing and transferring units. Thus the manufacturing cost has increased when using an enhanced processing unit and the processing speed has been lowered unavoidably when cooperation is required among routing and transferring units. Those have been conventional problems. Furthermore, if any flow is disposed during a transfer from a packet transferring unit provided in a routing and transferring unit to a processing unit, the packet is disposed regardless of the packet priority. This has also been another conventional problem. According to the present invention, however, it is ruled that a packet related to a specific judgment process is always transmitted to a specific routing and transferring unit from a line interface unit. And if a flow is inputted and it is over the transferring capacity between a line interface unit and a routing and transferring unit, the line interface unit analyzes the packet header and determines the type, transport priority, and disposal priority of the packet.
摘要翻译：在“分布式”集成网络节点（架构）的情况下，不能在任何路由和传送单元中执行特定的判断过程。路由和传送单元已经被要求与增强处理单元或其他路由和传送单元共享这样的判断过程相关信息。因此，当使用增强处理单元时，制造成本增加，并且在路由和传送单元之间需要协作时，不可避免地降低了处理速度。那些是常规问题。此外，如果在从设置在路由和传送单元中的分组传送单元传送到处理单元的传送期间设置任何流程，则分组被布置，而不管分组优先级如何。这也是另一个常规问题。然而，根据本发明，规定与特定判断处理相关的分组总是从线路接口单元发送到特定的路由和传送单元。并且如果输入流，并且在线路接口单元和路由和传送单元之间的传输容量之上，则线路接口单元分析分组报头并确定分组的类型，传输优先级和处置优先级。

82. 发明申请

US20070262674A1 Electric rotary machine 有权
标题翻译：电动旋转机
公开(公告)号：US20070262674A1
公开(公告)日：2007-11-15
申请号：US11797845
申请日：2007-05-08
申请人： Yuichi Shibukawa , Kenta Suzuki , Kenji Narita , Takashi Suzuki , Takushi Fujioka , Tomonori Kojima , Masanori Murakami , Yoichi Tanabe , Masaki Yamada
发明人： Yuichi Shibukawa , Kenta Suzuki , Kenji Narita , Takashi Suzuki , Takushi Fujioka , Tomonori Kojima , Masanori Murakami , Yoichi Tanabe , Masaki Yamada
IPC分类号： H02K9/20 , H02K3/24 , H02K11/00 , H02K21/12
CPC分类号： H02K21/24 , H02K3/524 , H02K5/04 , H02K5/20
摘要： In an electric rotary machine, a stator, a metallic supporting member configured to support the stator, and a rotor are provided, the rotor is relatively rotatably supported with respect to the stator, a magnetic path is formed via a gap portion between the stator and the rotor to give a torque to the rotor, and a space section is provided to interrupt the magnetic path at a position of the metallic supporting member near to a magnetic pole of the stator facing the gap portion.
摘要翻译：在电动旋转机中，设置有定子，配置为支撑定子的金属支撑构件和转子，转子相对于定子相对可旋转地支撑，通过定子与定子之间的间隙部分形成磁路，所述转子向所述转子施加扭矩，并且设置有空间部分，以在所述金属支撑构件靠近所述定子的面向所述间隙部分的磁极的位置处中断所述磁路。

83. 发明申请

US20070107689A1 Internal combustion engine and liner installation ring 失效
标题翻译：内燃机和内胆安装环
公开(公告)号：US20070107689A1
公开(公告)日：2007-05-17
申请号：US10575793
申请日：2004-10-15
申请人： Kazuhiko Oogake , Masaki Yamada , Kazuki Satou
发明人： Kazuhiko Oogake , Masaki Yamada , Kazuki Satou
IPC分类号： F02F1/00 , F02F11/00
CPC分类号： F02F1/004 , F02F1/16 , F02F1/166 , F02F2001/006
摘要： An internal combustion engine includes: a cylinder block having one or more cylinders, a cylinder liner in a tubular shape disposed inside the cylinder; a piston reciprocating inside the cylinder liner and having a top land portion formed of an outer periphery of the piston sandwiched between a piston head and an uppermost ring groove; and a liner installation ring forming, inside the cylinder, a circular step portion protruding toward the inner periphery of the cylinder liner. The liner installation ring is disposed in the cylinder block or the cylinder liner in such a manner that the bottom face of the liner installation ring face to the uppermost portion of the cylinder liner. The liner installation ring is disposed at a position in accordance with the upper end position of the top land portion when the piston reaches a top dead center. The liner installation ring is set to protrude from the inner periphery of the cylinder liner in an inward direction at a length of 0.05 mm or more to 0.5 mm less.
摘要翻译：内燃机包括：具有一个或多个气缸的气缸体，设置在气缸内的管状的气缸套; 活塞在气缸套内往复运动，并具有由夹在活塞头和最上环槽之间的活塞的外周形成的顶部陆部; 以及在所述气缸内部形成有朝向所述气缸套的内周面突出的圆形台阶部的衬套安装环。衬套安装环以使得衬套安装环的底面面对气缸套的最上部的方式设置在气缸体或气缸衬套中。当活塞到达上止点时，衬套安装环设置在与顶部陆部的上端位置相对应的位置。衬套安装环设置成从内筒的内周向内方向突出，长度为0.05mm以上至0.5mm以下。

84. 发明申请

US20070001540A1 Axial air-gap electronic motor 有权
标题翻译：轴向气隙电子马达
公开(公告)号：US20070001540A1
公开(公告)日：2007-01-04
申请号：US11475158
申请日：2006-06-27
申请人： Hirokazu Matsuzaki , Yoshiyasu Horiuchi , Tomonori Kojima , Masaki Yamada
发明人： Hirokazu Matsuzaki , Yoshiyasu Horiuchi , Tomonori Kojima , Masaki Yamada
IPC分类号： H02K1/00
CPC分类号： H02K3/524 , H02K11/33 , H02K21/24 , H02K2211/03 , Y10T29/49009
摘要： In an axial air-gap electronic motor in which a stator is formed by a plurality of core members, the manpower for assembling the core member is reduced, and the motor is assembled in a shorter period of time. A hook portion 320, which is a first connecting means, is projectingly provided at one end in the circumferential direction of a flange portion 310 of each of the core members 21a to 21i, and a columnar locking shaft 330 to which the hook portion 320 is locked is provided at the other end in the circumferential direction of the flange portion 310, by which the core members 21a to 21i are connected to each other.
摘要翻译：在定子由多个芯构件形成的轴向气隙电子马达中，用于组装芯构件的人力减少，并且马达在更短的时间内组装。作为第一连接装置的钩部320在每个芯构件21a至21i的凸缘部310的圆周方向的一端处突出设置，并且柱状锁定轴330，钩部 320被锁定在凸缘部310的圆周方向上的另一端处，芯构件21a〜21i通过该凸缘部310彼此连接。

85. 发明申请

US20060279150A1 Axial air gap type electric motor 有权
标题翻译：轴向气隙式电动机
公开(公告)号：US20060279150A1
公开(公告)日：2006-12-14
申请号：US11445209
申请日：2006-06-02
申请人： Tomonori Kojima , Atsushi Itagaki , Masanori Murakami , Yoichi Tanabe , Toshiaki Tanno , Hirokazu Matsuzaki , Masaki Yamada
发明人： Tomonori Kojima , Atsushi Itagaki , Masanori Murakami , Yoichi Tanabe , Toshiaki Tanno , Hirokazu Matsuzaki , Masaki Yamada
IPC分类号： H02K5/00 , H02K1/22
CPC分类号： H02K3/524 , F16C25/086 , H02K5/08 , H02K5/173 , H02K5/1735 , H02K7/08 , H02K11/33 , H02K29/08 , H02K2203/12 , H02K2211/03
摘要： A magnetic pre-pressurizing section for pre-pressurizing the inner ring of the bearing in the axial direction by a difference of magnetic forces of permanent magnets of the two rotors is arranged. The magnetic pre-pressurizing section is constructed by a difference of a magnetizing amount for forming permanent magnets 8b, 9b arranged in the respective rotors. The magnetic pre-pressurizing section is also constructed by a difference of distances of an air gap L1 of a stator 2 and a permanent magnet 8b1, and an air gap L2 of the stator 2 and a permanent magnet 9b1. The magnetic pre-pressurizing section is also constructed by a difference of thicknesses of the rotating axis direction of a permanent magnet 8b1 and a permanent magnet 9b2 arranged in the respective rotors.
摘要翻译：布置有用于通过两个转子的永磁体的磁力差沿轴向预加压轴承的内圈的磁预加压部。磁性预加压部分是通过设置在各个转子中的用于形成永久磁铁8b，9b的磁化量的差而构成的。磁预加压部也由定子2的气隙L 1与永久磁铁8b1的距离差和定子2的气隙L 2与永磁体9b 1构成。磁性预加压部也由永久磁铁8b 1的旋转轴方向和配置在各转子中的永久磁铁9 b 2的厚度差构成。

86. 发明申请

US20060214305A1 Semiconductor device having oxidized metal film and manufacture method of the same 有权
标题翻译：具有氧化金属膜的半导体器件及其制造方法
公开(公告)号：US20060214305A1
公开(公告)日：2006-09-28
申请号：US11335584
申请日：2006-01-20
申请人： Atsuko Sakata , Junichi Wada , Seiichi Omoto , Masaaki Hatano , Soichi Yamashita , Kazuyuki Higashi , Naofumi Nakamura , Masaki Yamada , Kazuya Kinoshita , Tomio Katata , Masahiko Hasunuma
发明人： Atsuko Sakata , Junichi Wada , Seiichi Omoto , Masaaki Hatano , Soichi Yamashita , Kazuyuki Higashi , Naofumi Nakamura , Masaki Yamada , Kazuya Kinoshita , Tomio Katata , Masahiko Hasunuma
IPC分类号： H01L23/48 , H01L21/4763
CPC分类号： H01L21/31616 , C23C16/045 , C23C16/45536 , C23C16/482 , H01L21/02178 , H01L21/02186 , H01L21/02244 , H01L21/02255 , H01L21/28556 , H01L21/28562 , H01L21/67109 , H01L21/67748 , H01L21/6831 , H01L21/68742 , H01L21/68764 , H01L21/68771 , H01L21/76807 , H01L21/76814 , H01L21/76828 , H01L21/76831 , H01L21/76835 , H01L21/76843 , H01L21/76846 , H01L21/76855 , H01L21/76858 , H01L21/76864 , H01L21/76873 , H01L21/76874 , H01L23/5222 , H01L23/53238 , H01L23/53295 , H01L2924/0002 , H01L2924/00
摘要： A method for manufacturing a semiconductor device includes heating a substrate having an insulation film thereon to a first substrate temperature so that oxidizing species are emitted from the insulating film, the insulating film having a recessed portion formed in a surface thereof, forming a metal film on the insulating film at a second substrate temperature lower than the first substrate temperature, and oxidizing at least part of the metal film with oxidizing species remaining in the insulating film.
摘要翻译：一种制造半导体器件的方法包括将其上具有绝缘膜的衬底加热到第一衬底温度，使得氧化物质从绝缘膜发射，绝缘膜具有形成在其表面上的凹陷部分，在所述绝缘膜的第二衬底温度低于所述第一衬底温度，并且氧化至少部分所述金属膜的氧化物质残留在所述绝缘膜中。

87. 发明申请

US20060202336A1 Semiconductor device and method of fabricating a semiconductor device 审中-公开
标题翻译：半导体装置及其制造方法
公开(公告)号：US20060202336A1
公开(公告)日：2006-09-14
申请号：US11360659
申请日：2006-02-24
申请人： Akihiro Kajita , Masaki Yamada
发明人： Akihiro Kajita , Masaki Yamada
IPC分类号： H01L23/52
CPC分类号： H01L23/5226 , H01L23/53238 , H01L2924/0002 , H01L2924/00
摘要： A semiconductor device includes a semiconductor substrate, a first interconnection layer formed above the semiconductor substrate via a first interlayer insulating film, the first interconnection layer having Cu as a main material, a second interconnection layer formed above the first interlayer insulating film and the first interconnection layer via a second interlayer insulating film, and a via plug formed through the second interlayer insulating film, the via plug electrically connecting between the first interconnection layer and the second interconnection layer, wherein a first material being different from Cu is selectively included at a grain boundary beneath the via plug among a plurality of grain boundaries of the first interconnection layer.
摘要翻译：半导体器件包括半导体衬底，经由第一层间绝缘膜形成在半导体衬底之上的第一互连层，具有Cu作为主要材料的第一互连层，形成在第一层间绝缘膜上的第二互连层和第一互连层以及通过所述第二层间绝缘膜形成的通孔塞，所述通孔插塞电连接在所述第一互连层和所述第二互连层之间，其中与Cu不同的第一材料选择性地包括在颗粒中在第一互连层的多个晶界之间的通孔插塞下方。

88. 发明申请

US20060163964A1 Axial air-gap electronic motor and method for manufacturing the same 有权
标题翻译：轴向气隙电子马达及其制造方法
公开(公告)号：US20060163964A1
公开(公告)日：2006-07-27
申请号：US11336978
申请日：2006-01-23
申请人： Tomonori Kojima , Toshiaki Tanno , Yoshikazu Tanaka , Yoichi Tanabe , Hirokazu Matsuzaki , Masaki Yamada , Masanori Murakami
发明人： Tomonori Kojima , Toshiaki Tanno , Yoshikazu Tanaka , Yoichi Tanabe , Hirokazu Matsuzaki , Masaki Yamada , Masanori Murakami
IPC分类号： H02K21/12 , H02K1/22
CPC分类号： H02K1/182 , H02K1/148 , H02K15/095 , H02K21/24 , H02K29/03 , Y10T29/49009 , Y10T29/49012 , Y10T29/49071
摘要： In an axial air-gap electronic motor in which a teeth surface of a stator and a magnet surface of a rotor are arranged opposedly along the axis line direction of an output shaft of the rotor with a predetermined gap being provided therebetween, the stator has a plurality of core members connected in a ring form with the axis line being a center, and each of the core members is provided with a connecting means for connecting the teeth surfaces to each other in an opposed state. The present invention provides an assembling technique for an axial air-gap electronic motor capable of shortening the wire winding time and reducing the assembling manpower for the core members. A stator 2 is formed by connecting a plurality of core members 21a to 21i in a ring form with the axis line being a center, and locking ribs 54 and 55 are provided as connecting means for connecting the core members 21a to 21i to each other in a rod form along the axis line direction.
摘要翻译：在轴向气隙电动马达中，定子的齿面和转子的磁铁表面沿着转子的输出轴的轴线方向相对地设置有规定的间隙，定子具有多个芯构件以环形连接，轴线为中心，并且每个芯构件设置有用于以相反的状态将齿表面彼此连接的连接装置。本发明提供一种用于轴向气隙电子马达的组装技术，其能够缩短绕线时间并减少芯构件的组装人力。定子2通过以环形形式连接多个芯构件21a至21i而以轴线为中心形成，并且锁定肋54和55被设置为用于连接芯构件21a至21i的连接装置彼此沿着轴线方向以棒状形式。

89. 发明申请

US20060118963A1 Semiconductor device and fabrication method for the same 失效
标题翻译：半导体器件及其制造方法相同
公开(公告)号：US20060118963A1
公开(公告)日：2006-06-08
申请号：US11274477
申请日：2005-11-16
申请人： Masaki Yamada
发明人： Masaki Yamada
IPC分类号： H01L23/48 , H01L23/52
CPC分类号： H01L24/02 , H01L23/5258 , H01L23/53238 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/04941 , H01L2924/04953
摘要： A semiconductor device includes a first interlayer insulating film formed on a semiconductor substrate; a second interlayer insulating film formed on the first interlayer film and including a plurality of grooves; a first barrier metal formed on inner surfaces of the grooves; a first interconnect part and a first bonding electrode part including a copper film formed on the first barrier metal; a second barrier metal formed on the first interconnect part and the first bonding electrode part; a second interconnect part including a metal film formed on the first interconnect part via the second barrier metal; a second bonding electrode part including a metal film formed on the first bonding electrode part via the second barrier metal; and a third interlayer insulating film formed on the second interlayer insulating film, the second interconnect part, and the second bonding electrode part, and including an opening that allows exposure of the surface of the second bonding electrode part.
摘要翻译：半导体器件包括形成在半导体衬底上的第一层间绝缘膜; 形成在所述第一层间膜上并且包括多个槽的第二层间绝缘膜; 形成在所述槽的内表面上的第一阻挡金属; 第一互连部分和包括形成在第一阻挡金属上的铜膜的第一接合电极部分; 形成在所述第一互连部分和所述第一接合电极部分上的第二阻挡金属; 第二互连部件，包括经由所述第二阻挡金属形成在所述第一互连部件上的金属膜; 第二接合电极部分，包括通过第二阻挡金属形成在第一接合电极部分上的金属膜; 以及形成在所述第二层间绝缘膜，所述第二互连部和所述第二接合电极部上的第三层间绝缘膜，并且包括允许所述第二接合电极部的表面露出的开口。

90. 发明授权

US06972491B2 Semiconductor device including multi-layered interconnection and method of manufacturing the device 失效
公开(公告)号：US06972491B2
公开(公告)日：2005-12-06
申请号：US10778180
申请日：2004-02-17
申请人： Masaki Yamada , Hideki Shibata
发明人： Masaki Yamada , Hideki Shibata
IPC分类号： H01L21/768 , H01L21/3205 , H01L21/822 , H01L23/48 , H01L23/52 , H01L23/532 , H01L27/04
CPC分类号： H01L23/53238 , H01L21/76838 , H01L23/53295 , H01L2924/0002 , H01L2924/00
摘要： The semiconductor device includes a semiconductor substrate and a multi-layer wiring portion including insulating layers and wiring layers alternately stacked one on another on a main surface of the semiconductor substrate. The resistance value of a wiring layer located on an upper side of an adjacent pair of wiring layers is lower than or equal to that of a wiring layer located on a lower side of the adjacent pair, and the resistance value of the lowermost layer is higher than that of the uppermost layer. The specific inductive capacity of an insulating layer located on an upper side of an adjacent pair of insulating layers is higher than or equal to that of an insulating layer located on a lower side of the adjacent pair, and the specific inductive capacity of the lowermost layer is lower than that of the uppermost layer.

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