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81. 发明授权

US07435623B2 Integrated micro channels and manifold/plenum using separate silicon or low-cost polycrystalline silicon 有权
标题翻译：集成微通道和歧管/增压室使用单独的硅或低成本多晶硅
公开(公告)号：US07435623B2
公开(公告)日：2008-10-14
申请号：US11284538
申请日：2005-11-22
申请人： Gregory M. Chrysler , Ravi Prasher
发明人： Gregory M. Chrysler , Ravi Prasher
IPC分类号： H01L21/00
CPC分类号： H01L23/473 , H01L2924/0002 , H01L2924/3011 , H01L2924/00
摘要： A method and apparatus for cooling an electronics chip with a cooling plate having integrated micro channels and manifold/plenum made in separate single-crystal silicon or low-cost polycrystalline silicon. Forming the microchannels in the cooling plate is more economical than forming the microchannels directly into the back of the chip being cooled. In some embodiments, the microchannels are high-aspect-ratio grooves formed (e.g., by etching) into a polycrystalline silicon cooling base, which is then attached to a cover (to contain the cooling fluid in the grooves) and to the back of the chip.
摘要翻译：一种用具有集成微通道的冷却板和在单独的单晶硅或低成本多晶硅中制成的歧管/增压室来冷却电子芯片的方法和装置。在冷却板中形成微通道比将微通道直接形成到被冷却的芯片的背面更经济。在一些实施例中，微通道是形成（例如，通过蚀刻）到多晶硅冷却基底中的高纵横比凹槽，然后将多孔硅冷却基底附接到盖（以容纳凹槽中的冷却流体）和背面芯片。

82. 发明申请

US20080006389A1 Preventing burst-related hazards in microelectronic cooling systems 审中-公开
标题翻译：防止微电子冷却系统中爆炸相关危害
公开(公告)号：US20080006389A1
公开(公告)日：2008-01-10
申请号：US11477095
申请日：2006-06-27
申请人： Ioan Sauciuc , Gregory M. Chrysler , Je-Young Chang , Ravi Prasher
发明人： Ioan Sauciuc , Gregory M. Chrysler , Je-Young Chang , Ravi Prasher
IPC分类号： A23C3/02 , H01L23/34
CPC分类号： F28D15/00 , F28F2250/06 , F28F2265/12 , H05K7/20272
摘要： Devices and associated methods to prevent burst-related hazards by providing pressure relief in a microelectronic cooling system are generally described. In this regard, according to one example embodiment, a pump outlet line includes at least one pressure relief indentation to rupture along the indentation at a selected pressure to prevent burst-related hazards in a microelectronic cooling system.
摘要翻译：通常描述了通过在微电子冷却系统中提供压力释放来防止爆发相关危害的装置和相关方法。在这方面，根据一个示例性实施例，泵出口管线包括至少一个压力释放压痕，以在选定的压力下沿着压痕破裂，以防止微电子冷却系统中的突发相关危险。

83. 发明授权

US07279796B2 Microelectronic die having a thermoelectric module 有权
标题翻译：具有热电模块的微电子管芯
公开(公告)号：US07279796B2
公开(公告)日：2007-10-09
申请号：US10638038
申请日：2003-08-08
申请人： Chuan Hu , Gregory M. Chrysler , Ravi V. Mahajan
发明人： Chuan Hu , Gregory M. Chrysler , Ravi V. Mahajan
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L23/38 , H01L2224/73253 , H01L2924/16195
摘要： A microelectronic die is provided having an integrated thermoelectric module. The microelectronic die has a die substrate, a microelectronic circuit formed on a front side of the die substrate, and the thermoelectric module on a backside of the die substrate. Vias in the substrate interconnect the thermoelectric module with power and ground planes on the front side of the die substrate.
摘要翻译：提供具有集成热电模块的微电子管芯。微电子管芯具有管芯基板，形成在管芯基板的前侧的微电子电路，以及位于管芯基板背面的热电模块。衬底中的通孔将热电模块与模具衬底的前侧上的电源和接地平面互连。

84. 发明授权

US07170098B2 Electronic assembly including a die having an integrated circuit and a layer of diamond to transfer heat 有权
标题翻译：电子组件包括具有集成电路的模具和用于传热的金刚石层
公开(公告)号：US07170098B2
公开(公告)日：2007-01-30
申请号：US11050902
申请日：2005-02-03
申请人： Gregory M. Chrysler , Abhay A. Watwe , Sairam Agraharam , Kramadhati V. Ravi , Michael C. Garner
发明人： Gregory M. Chrysler , Abhay A. Watwe , Sairam Agraharam , Kramadhati V. Ravi , Michael C. Garner
IPC分类号： H01L31/0312
CPC分类号： H01L21/6835 , H01L21/2007 , H01L21/76254 , H01L23/3732 , H01L24/27 , H01L24/81 , H01L2221/68354 , H01L2221/68359 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/274 , H01L2224/73253 , H01L2224/81001 , H01L2224/8121 , H01L2224/81815 , H01L2924/00014 , H01L2924/01006 , H01L2924/01033 , H01L2924/01057 , H01L2924/01074 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/19041 , H01L2924/00 , H01L2224/05599
摘要： Processes are described whereby a wafer is manufactured, a die from the wafer, and an electronic assembly including the die. The die has a diamond layer which primarily serves to spread heat from hot spots of an integrated circuit in the die.
摘要翻译：描述制造晶片的工艺，来自晶片的模具和包括模具的电子组件。模具具有金刚石层，其主要用于从模具中的集成电路的热点传播热量。

85. 发明授权

US06967840B2 Clearing of vapor lock in a microchannel cooling subsystem 失效
标题翻译：清除微通道冷却子系统中的气密锁
公开(公告)号：US06967840B2
公开(公告)日：2005-11-22
申请号：US10814051
申请日：2004-03-31
申请人： Gregory M. Chrysler , Ioan Sauciuc
发明人： Gregory M. Chrysler , Ioan Sauciuc
IPC分类号： H01L23/473 , H05K7/20
CPC分类号： H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： Apparatus and methods in accordance with the present invention provide a system to create turbulence inside microchannels of a microchannel cooling subsystem to disrupt vapor locks therein.
摘要翻译：根据本发明的装置和方法提供了一种在微通道冷却子系统的微通道内部产生紊流以破坏其中的蒸气锁的系统。

86. 发明授权

US06706562B2 Electronic assembly with high capacity thermal spreader and methods of manufacture 有权
标题翻译：具有高容量散热器的电子组件及其制造方法
公开(公告)号：US06706562B2
公开(公告)日：2004-03-16
申请号：US10036846
申请日：2001-12-21
申请人： Ravi V. Mahajan , Gregory M. Chrysler
发明人： Ravi V. Mahajan , Gregory M. Chrysler
IPC分类号： H01L2310
CPC分类号： H01L23/36 , H01L23/3732 , H01L2224/0401 , H01L2224/04026 , H01L2224/16225 , H01L2224/16227 , H01L2224/32245 , H01L2224/73253 , H01L2924/01046 , H01L2924/01055 , H01L2924/01078 , H01L2924/01079 , H01L2924/10253 , H01L2924/15311 , H01L2924/16195 , H01L2924/00
摘要： To accommodate high power densities associated with high performance integrated circuits, an integrated circuit package includes a heat-dissipating structure in which heat is dissipated from a surface of one or more dice to an integrated heat spreader (IHS) through a high capacity thermal spreader formed of diamond, a diamond composite, or graphite. In one embodiment, a diamond layer is grown on the IHS. In another embodiment, a diamond layer is separately formed and affixed to the IHS and/or to the die through soldering or through a room temperature surface activated bonding (SAB) process. Methods of fabrication, as well as application of the package to an electronic assembly and to an electronic system, are also described.
摘要翻译：为了适应与高性能集成电路相关联的高功率密度，集成电路封装包括散热结构，其中热量通过形成的高容量散热器从一个或多个管芯的表面散发到集成散热器（IHS）金刚石，金刚石复合材料或石墨。在一个实施方案中，在IHS上生长金刚石层。在另一个实施方案中，金刚石层被单独形成并通过焊接或通过室温表面活化粘合（SAB）工艺固定到IHS和/或模具。还描述了制造方法以及将包装应用于电子组件和电子系统。

87. 发明授权

US06646874B2 Mobile computer system with detachable thermoelectric module for enhanced cooling capability in a docking station 有权
标题翻译：具有可拆卸热电模块的移动计算机系统，用于在对接站中提高冷却能力
公开(公告)号：US06646874B2
公开(公告)日：2003-11-11
申请号：US09880509
申请日：2001-06-12
申请人： Himanshu Pokharna , Gregory M. Chrysler
发明人： Himanshu Pokharna , Gregory M. Chrysler
IPC分类号： G06F116
CPC分类号： G06F1/1632 , G06F1/203
摘要： A computer system is described having additional cooling capabilities in a docking station for a mobile computer. The docking station includes P- and N-doped semiconductor thermoelectric components. The thermoelectric components are connected in series when the mobile computer engages with the docking station. A current flowing through a doped semiconductor causes heat to be transferred either in a direction of a current through the semiconductor component or in a direction opposite to a current in the thermoelectric components, depending on their doping. The thermoelectric components alternate from being P-doped to N-doped and the direction in which current flows alternates accordingly so that heat is transferred in one direction only. A heat pumping effect is created by the thermoelectric components which does not require high-pressure contact upon engagement of the mobile computer with the docking station.
摘要翻译：描述了在用于移动计算机的坞站中具有额外的冷却功能的计算机系统。对接站包括P-掺杂半导体热电组件和N掺杂半导体热电组件。当移动计算机与对接站接合时，热电部件串联连接。取决于其掺杂，流过掺杂半导体的电流使热量在电流通过半导体元件的方向或与热电元件中的电流相反的方向上传输。热电元件从P掺杂变为N掺杂，并且电流流动的方向相应地交替，使得热仅在一个方向上传递。通过热电部件产生热泵效应，热电部件在移动式计算机与对接站接合时不需要高压接触。

88. 发明授权

US06639799B2 Integrated vapor chamber heat sink and spreader and an embedded direct heat pipe attachment 失效
公开(公告)号：US06639799B2
公开(公告)日：2003-10-28
申请号：US09746554
申请日：2000-12-22
申请人： Ravi Prasher , Abhay A. Watwe , Gregory M. Chrysler , Kristopher Frutschy , Leo Ofman , Ajit V. Sathe
发明人： Ravi Prasher , Abhay A. Watwe , Gregory M. Chrysler , Kristopher Frutschy , Leo Ofman , Ajit V. Sathe
IPC分类号： H05K720
CPC分类号： H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： Two types of thermal management devices for efficiently dissipating heat generated by high performance electronic devices, such as microprocessors for desktop and server computers producing a power of near 200 Watts and high power electronic devices that are small and thin, such as those used in telephones, radios, laptop computers, and handheld devices. An integrated heat sink and spreader for cooling an item has a vapor chamber heat sink with a thinner first wall and a thicker second wall. The thicker second wall is engageable with the item in efficient heat transferring relationship. A plurality of heat-radiating fins are attached to the thinner first wall. An embedded direct heat pipe attachment includes a heat pipe embedded in a spreader plate that is in direct heat transferring contact with an item through a thin, uniform layer of thermal interface material.

89. 发明授权

US06636423B2 Composite fins for heat sinks 失效
公开(公告)号：US06636423B2
公开(公告)日：2003-10-21
申请号：US10046469
申请日：2001-10-29
申请人： Agostino C. Rinella , Gregory M. Chrysler
发明人： Agostino C. Rinella , Gregory M. Chrysler
IPC分类号： H05K720
CPC分类号： H01L23/3672 , F28F3/02 , H01L2924/0002 , Y10T29/4935 , H01L2924/00
摘要： A heat sink that dissipates heat from an electronic device. The heat sink comprises a base and one or more fins. The base is copper and is thermally coupled to an integrated circuit that includes a high-powered processor. The fins each include a copper portion and an aluminum portion. The copper portion of the fin is thermally coupled to the base to conduct thermal energy away from the base. The remainder of the fin is formed from aluminum.

90. 发明授权

US06223810B1 Extended air cooling with heat loop for dense or compact configurations of electronic components 失效
标题翻译：具有热回路的扩展空气冷却，用于密集或紧凑的电子部件配置
公开(公告)号：US06223810B1
公开(公告)日：2001-05-01
申请号：US09052320
申请日：1998-03-31
申请人： Richard C. Chu , Gregory M. Chrysler
发明人： Richard C. Chu , Gregory M. Chrysler
IPC分类号： F28D1500
CPC分类号： H05K7/20681 , F28D15/0266 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A thermosyphon system is employed in conjunction with compact and/or dense configurations of electrical and/or electronic components to provide cooling. The thermosyphon cooling system is particularly advantageous in those systems in which the compact arrangement of circuit modules precludes the use of direct air cooling. The thermosyphon cooling system repositions the air cooling aspect of its cooling function to an exterior cabinet location distant from the circuit modules which can therefore be placed more closely together to shorten signal paths.
摘要翻译：热虹吸系统与电气和/或电子部件的紧凑和/或密集配置结合使用以提供冷却。热虹吸管冷却系统在其中电路模块的紧凑布置阻止使用直接空气冷却的那些系统中是特别有利的。热虹吸管冷却系统将其冷却功能的空气冷却方面重新定位在远离电路模块的外部柜体位置，因此可以将其更靠近地放置在一起以缩短信号路径。

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