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81. 发明申请

US20060275949A1 Semiconductor components and methods of fabrication with circuit side contacts, conductive vias and backside conductors 有权
标题翻译：具有电路侧触点，导电通孔和背面导体的半导体元件和制造方法
公开(公告)号：US20060275949A1
公开(公告)日：2006-12-07
申请号：US11496180
申请日：2006-07-31
申请人： Warren Farnworth , Alan Wood , Trung Tri Doan
发明人： Warren Farnworth , Alan Wood , Trung Tri Doan
IPC分类号： H01L21/00
CPC分类号： H01L23/48 , B33Y70/00 , B33Y80/00 , H01L21/304 , H01L21/3043 , H01L21/56 , H01L21/561 , H01L21/565 , H01L21/568 , H01L21/6835 , H01L21/6836 , H01L21/76802 , H01L21/76898 , H01L21/78 , H01L23/24 , H01L23/3114 , H01L23/36 , H01L23/3672 , H01L23/481 , H01L23/49531 , H01L23/49575 , H01L24/05 , H01L24/11 , H01L24/12 , H01L24/16 , H01L24/27 , H01L24/94 , H01L24/96 , H01L25/105 , H01L25/50 , H01L29/0657 , H01L2221/68327 , H01L2221/68331 , H01L2221/68372 , H01L2224/0401 , H01L2224/05599 , H01L2224/11849 , H01L2224/11901 , H01L2224/12105 , H01L2224/13009 , H01L2224/13022 , H01L2224/13025 , H01L2224/13099 , H01L2224/16 , H01L2224/16235 , H01L2224/274 , H01L2224/73104 , H01L2224/73253 , H01L2224/94 , H01L2225/06541 , H01L2225/1035 , H01L2225/1058 , H01L2225/107 , H01L2225/1094 , H01L2924/00013 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01039 , H01L2924/01041 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/05042 , H01L2924/12042 , H01L2924/12044 , H01L2924/14 , H01L2924/1433 , H01L2924/19041 , H01L2924/19042 , H01L2924/3512 , H01L2924/00 , H01L2224/29099 , H01L2224/27
摘要： A semiconductor component includes a thinned semiconductor substrate having protective polymer layers on up to six surfaces. The component also includes contacts on a circuit side of the substrate, conductive vias in electrical contact with the contacts, aNd conductors on a backside of the substrate. A method for fabricating the component includes the steps of providing the semiconductor substrate with the contacts on the circuit side, forming conductive vias from the back side in electrical contact with the contacts, and forming conductors on the backside.
摘要翻译：半导体部件包括在多达六个表面上具有保护性聚合物层的变薄的半导体衬底。该部件还包括在基板的电路侧的触点，与触点电接触的导电通孔，在基板的背面上的一个导体。一种制造该部件的方法包括以下步骤：在电路侧提供半导体衬底上的触点，从背面形成与触点电接触的导电通孔，并在背面形成导体。

82. 发明申请

US20060192230A1 Image sensor packages and frame structure thereof 有权
标题翻译：图像传感器封装及其框架结构
公开(公告)号：US20060192230A1
公开(公告)日：2006-08-31
申请号：US11411265
申请日：2006-04-26
申请人： Alan Wood , Kyle Kirby , Warren Farnworth , Salman Akram
发明人： Alan Wood , Kyle Kirby , Warren Farnworth , Salman Akram
IPC分类号： H01L27/148 , H01L31/0203
CPC分类号： H01L27/14618 , B33Y80/00 , H01L27/14625 , H01L2224/48091 , H01L2924/00014
摘要： A semiconductor package such as an image sensor package. A frame structure includes an array of frames, each having an aperture therethrough, into which an image sensor die in combination with a cover glass, filter, lens or other components may be installed in precise mutual alignment. Singulated image sensor dice and other components may be picked and placed into each frame of the frame structure. Alternatively, the frame structure may be configured to be aligned with and joined to a wafer bearing a plurality of image sensor dice, wherein optional, downwardly protruding skirts along peripheries of the frames may be received into kerfs cut along streets between die locations on the wafer, followed by installation of other package components. In either instance, the frame structure in combination with singulated image sensor dice or a joined wafer is singulated into individual image sensor packages. Various external connection approaches may be used.
摘要翻译：诸如图像传感器封装的半导体封装。框架结构包括每个具有穿过其中的孔的框架阵列，图像传感器与盖玻片，过滤器，透镜或其它部件组合的模具可以精确相互对准地安装在该框架中。单片图像传感器骰子和其他组件可以被拾取并放置在框架结构的每个帧中。或者，框架结构可以被配置为与承载多个图像传感器骰子的晶片对准并且连接到其上，其中沿着框架的周边的任选的向下突出的裙边可以被接收到沿着晶片上的模具位置之间沿着街道切割的切口，然后安装其他包装组件。在任一情况下，将帧结构与单独的图像传感器芯片或连接的晶片组合成单独的图像传感器封装。可以使用各种外部连接方法。

83. 发明申请

US20060134827A1 Microlenses including a plurality of mutually adhered layers of optically transmissive material and systems including the same 有权
标题翻译：微透镜包括多个相互粘附的光学透射材料层和包括该多个透光材料的系统
公开(公告)号：US20060134827A1
公开(公告)日：2006-06-22
申请号：US11336567
申请日：2006-01-20
申请人： Alan Wood , Warren Farnworth , Charles Watkins , Peter Benson
发明人： Alan Wood , Warren Farnworth , Charles Watkins , Peter Benson
IPC分类号： H01L21/50
CPC分类号： H01L27/14685 , B33Y10/00 , B33Y80/00 , H01L21/56 , H01L23/3128 , H01L27/14618 , H01L27/14627 , H01L2224/04105 , H01L2224/20 , H01L2924/01005 , H01L2924/01027 , H01L2924/01046 , H01L2924/12041
摘要： Microlenses for directing radiation toward a sensor of an imaging device include a plurality of mutually adhered layers of cured optically transmissive material. Systems include at least one microprocessor, a substrate including an array of microlenses formed thereon in electrical communication with the at least one microprocessor. At least one microlens in the array includes a plurality of mutually adhered layers of cured optically transmissive material.
摘要翻译：用于将辐射引导到成像装置的传感器的微透镜包括固化的光学透射材料的多个相互附着的层。系统包括至少一个微处理器，包括形成在其上的与该至少一个微处理器电连通的微透镜阵列的衬底。阵列中的至少一个微透镜包括固化的光学透射材料的多个相互附着的层。

84. 发明授权

US06983536B2 Method and apparatus for manufacturing known good semiconductor die 失效
标题翻译：用于制造已知的良好半导体管芯的方法和装置
公开(公告)号：US06983536B2
公开(公告)日：2006-01-10
申请号：US10847969
申请日：2004-05-18
申请人： Warren Farnworth , Alan Wood
发明人： Warren Farnworth , Alan Wood
IPC分类号： H05K3/30
CPC分类号： H01L23/49838 , G01R1/0433 , G01R1/0466 , G01R1/0483 , G01R1/06711 , G01R1/0735 , G01R3/00 , G01R31/2863 , G01R31/287 , G01R31/2889 , G01R31/2893 , H01L21/6835 , H01L22/20 , H01L23/13 , H01L23/49816 , H01L24/80 , H01L2224/05571 , H01L2224/05573 , H01L2224/16145 , H01L2225/06562 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01074 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/15151 , H01L2924/15174 , H05K3/0058 , H05K3/0067 , H05K3/4007 , H05K3/423 , H05K2201/0133 , H05K2201/0347 , H05K2201/0367 , H05K2201/0394 , H05K2201/09481 , H05K2201/09563 , H05K2203/0307 , H05K2203/0723 , Y10T29/49117 , Y10T29/49121 , Y10T29/49126 , Y10T29/4913 , Y10T29/49131 , H01L2924/00 , H01L2224/05599
摘要： A method and apparatus for fabricating known good semiconductor dice are provided. The method includes the steps of: testing the gross functionality of dice contained on a semiconductor wafer; sawing the wafer to singulate a die; and then testing the die by assembly in a carrier having an interconnect adapted to establish electrical communication between the bond pads on the die and external test circuitry. The interconnect for the carrier can be formed using different contact technologies including: thick film contact members on a rigid substrate; self-limiting contact members on a silicon substrate; or microbump contact members with a textured surface. During assembly of the carrier, the die and interconnect are optically aligned and placed into contact with a predetermined contact force. This establishes an electrical connection between the contact members on the interconnect and the bond pads of the die. In the assembled carrier the die and interconnect are biased together by a force distribution mechanism that includes a bridge clamp, a pressure plate and a spring clip. Following testing of the die, the carrier is disassembled and the tested die is removed.
摘要翻译：提供了一种用于制造已知的良好半导体晶片的方法和装置。该方法包括以下步骤：测试包含在半导体晶片上的骰子的总功能; 锯切晶片以切割模具; 然后通过组装在具有适于建立管芯上的接合焊盘与外部测试电路之间的电连通的互连的载体中来测试管芯。用于载体的互连可以使用不同的接触技术形成，包括：刚性基板上的厚膜接触构件; 硅衬底上的自限制接触构件; 或具有纹理表面的微型块接触构件。在载体的组装期间，芯片和互连件被光学对准并且被放置成与预定的接触力接触。这就建立了互连上的接触构件和管芯的接合垫之间的电连接。在组装的载体中，管芯和互连件通过包括桥夹，压板和弹簧夹的力分配机构偏压在一起。在对模具进行测试之后，拆下载体并且移除被测试的模具。

85. 发明申请

US20050230825A1 Apparatus and methods of testing and assembling bumped devices using an anisotropically conductive layer 失效
公开(公告)号：US20050230825A1
公开(公告)日：2005-10-20
申请号：US11083057
申请日：2005-03-16
申请人： Salman Akram , Alan Wood , Warren Farnworth
发明人： Salman Akram , Alan Wood , Warren Farnworth
IPC分类号： G01R1/04 , H01L21/60 , H01L23/13 , H01L23/48 , H01L23/498 , H05K3/32
CPC分类号： H01L23/13 , G01R1/0466 , G01R1/0483 , H01L23/49827 , H01L2224/05571 , H01L2224/05573 , H01L2224/131 , H01L2224/16237 , H01L2224/8114 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0781 , H01L2924/15174 , H05K3/325 , H05K3/326 , H01L2224/05599
摘要： The present invention is directed toward apparatus and methods of testing and assembling bumped die and bumped devices using an anisotropically conductive layer. In one embodiment, a semiconductor device comprises a bumped device having a plurality of conductive bumps formed thereon, a substrate having a plurality of contact pads distributed thereon and approximately aligned with the plurality of conductive bumps, and an anisotropically conductive layer disposed between and mechanically coupled to the bumped device and to the substrate. The anisotropically conductive layer electrically couples each of the conductive bumps with a corresponding one of the contact pads. In another embodiment, an apparatus for testing a bumped device having a plurality of conductive bumps includes a substrate having a plurality of contact pads distributed thereon and substantially alignable with the plurality of conductive bumps, and an anisotropically conductive layer disposed on the first surface and engageable with the plurality of conductive bumps to electrically couple each of the conductive bumps with a corresponding one of the contact pads. Alternately, the test apparatus may also include an alignment device or a bumped device handler. In another embodiment, a method of testing a bumped device includes engaging a plurality of contact pads with an anisotropically conductive layer, engaging the plurality of conductive bumps with the anisotropically conductive layer substantially opposite from and in approximate alignment with the plurality of contact pads, forming a plurality of conductive paths through the anisotropically conductive layer so that each of the conductive bumps is electrically coupled to one of the contact pads, and applying test signals through at least some of the contact pads and the conductive paths to at least some of the conductive bumps.

86. 发明申请

US20050064679A1 Consolidatable composite materials, articles of manufacture formed therefrom, and fabrication methods 审中-公开
标题翻译：可固化复合材料，由其制成的制品及其制造方法
公开(公告)号：US20050064679A1
公开(公告)日：2005-03-24
申请号：US10928381
申请日：2004-08-27
申请人： Warren Farnworth , Alan Wood
发明人： Warren Farnworth , Alan Wood
IPC分类号： E21B43/02 , G03F7/00 , G03F7/004 , H01L21/30 , H01L21/46
CPC分类号： G03F7/0037 , G03F7/0047
摘要： A composite material includes an unconsolidated, consolidatable component and a physical modifier component. The consolidatable component is configured to be selectively consolidated to form an article, while the physical modifier component provides desired physical properties. The physical modifier component may be an unconsolidated material dispersed throughout the consolidatable component or a preformed matrix including interstices within which the consolidatable component may be introduced. The consolidatable component of the composite material may be selectively consolidated to fix the at least one physical component therein. Alternatively, the consolidatable component may be nonselectively consolidated, then regions thereof selectively removed. Methods for fabricating articles from such composite materials are also disclosed, as are systems that are configured for use in fabricating articles from such composite materials.
摘要翻译：复合材料包括未固结的，可固结的组分和物理改性剂组分。可整合组件被配置为选择性地合并以形成物品，而物理修饰剂组分提供期望的物理性质。物理改性剂组分可以是分散在整个可整合组分中的未固结的材料或预先形成的基质，其中可以引入可固结组分的间隙。可以选择性地将复合材料的可固结部件固结以固定其中的至少一种物理组分。或者，可固化组分可以非选择性地固结，然后其区域被选择性地去除。还公开了从这种复合材料制造制品的方法，以及被配置用于从这种复合材料制造制品的系统。

87. 发明申请

US20070045808A1 Test carrier for semiconductor components having conductors defined by grooves 有权
标题翻译：具有由槽限定的导体的半导体部件的测试载体
公开(公告)号：US20070045808A1
公开(公告)日：2007-03-01
申请号：US11591744
申请日：2006-11-02
申请人： Warren Farnworth , Alan Wood
发明人： Warren Farnworth , Alan Wood
IPC分类号： H01L21/44 , H01L23/48 , H01L23/52
CPC分类号： H01L23/3128 , G01R1/0483 , G01R3/00 , G01R31/2867 , H01L21/4846 , H01L23/32 , H01L23/49816 , H01L23/49838 , H01L24/48 , H01L24/49 , H01L24/72 , H01L2224/05554 , H01L2224/05599 , H01L2224/48227 , H01L2224/49175 , H01L2224/85399 , H01L2924/00014 , H01L2924/01046 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/09701 , H01L2924/10161 , H01L2924/12042 , H01L2924/3011 , H01L2924/30111 , H05K1/0218 , H05K1/113 , H05K3/027 , H05K2201/09363 , H01L2924/00 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要： A test carrier for a semiconductor component includes a base for retaining the component, and an interconnect on the base having contacts configured to electrically engage component contacts on the component. The base includes conductors in electrical communication with the contacts on the interconnect, which are defined by grooves in a conductive layer. In addition, the conductors include first portions of the conductive layer configured for electrical transmission, which are separated from one another by second portions of the conductive layer configured for no electrical transmission. The test carrier is configured for mounting to a burn in board in electrical communication with a test circuitry configured to apply test signals through the contacts on the interconnect to the component.
摘要翻译：用于半导体部件的测试载体包括用于保持部件的基座和在基部上的互连件，其具有被构造成电接合部件上的部件触点的触点。基座包括与互连上的触点电连通的导体，其由导电层中的沟槽限定。此外，导体包括被配置用于电传输的导电层的第一部分，它们被配置为不进行电传输的导电层的第二部分彼此分离。测试载体被配置为安装到板上的燃烧，与测试电路电连通，该测试电路经配置以通过互连件上的触点施加测试信号到组件。

88. 发明申请

US20060118953A1 Semiconductor component having thinned die with conductive vias 有权
标题翻译：半导体元件具有导电通孔的薄模
公开(公告)号：US20060118953A1
公开(公告)日：2006-06-08
申请号：US11339177
申请日：2006-01-20
申请人： Warren Farnworth , Alan Wood , Trung Doan
发明人： Warren Farnworth , Alan Wood , Trung Doan
IPC分类号： H01L23/52 , H01L23/48 , H01L29/40
CPC分类号： H01L23/48 , B33Y70/00 , B33Y80/00 , H01L21/304 , H01L21/3043 , H01L21/56 , H01L21/561 , H01L21/565 , H01L21/568 , H01L21/6835 , H01L21/6836 , H01L21/76802 , H01L21/76898 , H01L21/78 , H01L23/24 , H01L23/3114 , H01L23/36 , H01L23/3672 , H01L23/481 , H01L23/49531 , H01L23/49575 , H01L24/05 , H01L24/11 , H01L24/12 , H01L24/16 , H01L24/27 , H01L24/94 , H01L24/96 , H01L25/105 , H01L25/50 , H01L29/0657 , H01L2221/68327 , H01L2221/68331 , H01L2221/68372 , H01L2224/0401 , H01L2224/05599 , H01L2224/11849 , H01L2224/11901 , H01L2224/12105 , H01L2224/13009 , H01L2224/13022 , H01L2224/13025 , H01L2224/13099 , H01L2224/16 , H01L2224/16235 , H01L2224/274 , H01L2224/73104 , H01L2224/73253 , H01L2224/94 , H01L2225/06541 , H01L2225/1035 , H01L2225/1058 , H01L2225/107 , H01L2225/1094 , H01L2924/00013 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01039 , H01L2924/01041 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/05042 , H01L2924/12042 , H01L2924/12044 , H01L2924/14 , H01L2924/1433 , H01L2924/19041 , H01L2924/19042 , H01L2924/3512 , H01L2924/00 , H01L2224/29099 , H01L2224/27
摘要： A semiconductor component includes a thinned semiconductor die having protective polymer layers on up to six surfaces. The component also includes contact bumps on the die embedded in a circuit side polymer layer, and terminal contacts on the contact bumps in a dense area array. A method for fabricating the component includes the steps of providing a substrate containing multiple dice, forming trenches on the substrate proximate to peripheral edges of the dice, and depositing a polymer material into the trenches. In addition, the method includes the steps of planarizing the back side of the substrate to contact the polymer filled trenches, and cutting through the polymer trenches to singulate the components from the substrate. Prior to the singulating step the components can be tested and burned-in while they remain on the substrate.
摘要翻译：半导体部件包括在六个表面上具有保护性聚合物层的变薄的半导体管芯。该组件还包括嵌入在电路侧聚合物层中的裸片上的接触凸块，并且密集区域阵列中接触凸块上的端子接触。一种用于制造该部件的方法包括以下步骤：提供包含多个骰子的基底，在基底上邻近骰子的周边边缘形成沟槽，以及将聚合物材料沉积到沟槽中。此外，该方法包括以下步骤：平坦化衬底的背面以接触聚合物填充的沟槽，并切割穿过聚合物沟槽以从衬底中分离组分。在分离步骤之前，组分可以在它们保留在基材上时被测试和燃烧。

89. 发明申请

US20060115926A1 Methods of forming conductive elements using organometallic layers and flowable, curable conductive materials 有权
标题翻译：使用有机金属层和可流动的可固化导电材料形成导电元件的方法
公开(公告)号：US20060115926A1
公开(公告)日：2006-06-01
申请号：US11336540
申请日：2006-01-20
申请人： Alan Wood , Warren Farnworth , Charles Watkins , Peter Benson
发明人： Alan Wood , Warren Farnworth , Charles Watkins , Peter Benson
IPC分类号： H01L21/50
CPC分类号： H01L27/14685 , B33Y10/00 , B33Y80/00 , H01L21/56 , H01L23/3128 , H01L27/14618 , H01L27/14627 , H01L2224/04105 , H01L2224/20 , H01L2924/01005 , H01L2924/01027 , H01L2924/01046 , H01L2924/12041
摘要： A conductive element is formed on a substrate by forming an organometallic layer on at least a portion of a surface of the substrate, heating a portion of the organometallic layer, and removing an unheated portion of the organometallic layer. In other methods, a flowable, uncured conductive material may be deposited on a surface of the substrate, the flowable, uncured conductive material may be selectively cured over at least a portion of the surface of the substrate, and a portion of the cured conductive material may be removed. A conductive via is formed by forming a hole at least partially through a thickness of a substrate, depositing an organometallic material within at least a portion of the hole, and selectively heating at least a portion of the organometallic material.
摘要翻译：通过在基板表面的至少一部分上形成有机金属层，加热部分有机金属层，去除有机金属层的未加热部分，在基板上形成导电元件。在其他方法中，可流动的未固化的导电材料可以沉积在基底的表面上，可流动的未固化的导电材料可以选择性地固化在基底表面的至少一部分上，并且一部分固化的导电材料可能被删除。通过至少部分地穿过衬底的厚度形成孔，在孔的至少一部分内沉积有机金属材料并选择性地加热至少一部分有机金属材料来形成导电通孔。

90. 发明申请

US20060115925A1 Methods of fabricating a microlens including selectively curing flowable, uncured optically trasmissive material 有权
标题翻译：制造微透镜的方法包括选择性固化可流动的未固化光学透射材料
公开(公告)号：US20060115925A1
公开(公告)日：2006-06-01
申请号：US11336228
申请日：2006-01-20
申请人： Alan Wood , Warren Farnworth , Charles Watkins , Peter Benson
发明人： Alan Wood , Warren Farnworth , Charles Watkins , Peter Benson
IPC分类号： H01L21/50
CPC分类号： H01L27/14685 , B33Y10/00 , B33Y80/00 , H01L21/56 , H01L23/3128 , H01L27/14618 , H01L27/14627 , H01L2224/04105 , H01L2224/20 , H01L2924/01005 , H01L2924/01027 , H01L2924/01046 , H01L2924/12041
摘要： A microlens for use in an imaging device may be fabricated by disposing a flowable, uncured optically transmissive material in at least one layer onto a surface of a substrate, selectively curing at least a portion of the flowable, uncured optically transmissive material, and removing the flowable, uncured optically transmissive material from the surface of the substrate.
摘要翻译：用于成像装置的微透镜可以通过将至少一层中的可流动的未固化的光学透射材料设置在基板的表面上来选择性地固化可流动的未固化的光学透射材料的至少一部分，可流动的，未固化的光学透射材料。

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