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    • 85. 发明授权
    • Optical fiber mechanical splice
    • 光纤机械接头
    • US5963699A
    • 1999-10-05
    • US862395
    • 1997-05-23
    • Toshiyuki TanakaYasuhiro TamakiHiroshi YokosukaShinji NagasawaMitsuru Kihara
    • Toshiyuki TanakaYasuhiro TamakiHiroshi YokosukaShinji NagasawaMitsuru Kihara
    • G02B6/24G02B6/38G02B6/40G02B6/255
    • G02B6/3806
    • Productivity of switching optical connections is improved significantly with the mechanical splice presented. A single fiber cable or a fiber tape, with the bare fiber exposed at the tip, is inserted from the terminal ends of an aligner element, and are clamped between a lid and a base member of the aligner element, A U-shaped spring clamp is coupled to the aligner element to secure the cables clamped in the aligner element. After the aligner element is closed and coupled into the spring clamp, wedge insertion openings provided in the front face of the aligner element enable to lift the lid member from the base member sufficiently to enable removal of one or both of the cables. The mechanical splice is constructed simply and ruggedly so that cables can be connected or disconnected manually by coupling the aligner element into or decoupling from the spring clamp. The external shape of the aligner is angular, and permits stable handling on workbench or with tools, thus leading to improved productivity in field installation as well as in assembly operations.
    • 使用机械接头提高了切换光连接的生产率。 一根光纤电缆或一条光纤带,裸露的光纤在尖端处被从定位器元件的末端插入,并被夹在盖子和定位器元件的底座部件之间。U型弹簧夹 联接到对准器元件以固定夹在对准元件中的电缆。 在对准器元件闭合并联接到弹簧夹中之后,设置在对准器元件的前表面中的楔形插入孔使得能够将盖构件从基座部件提升到能够移除一个或两个电缆。 机械接头简单而坚固地构造,使得可以通过将对准器元件连接到弹簧夹或从弹簧夹脱离来手动连接或断开电缆。 对准器的外部形状是有角度的,并且允许在工作台或工具上的稳定操作,从而在现场安装以及组装操作中提高生产率。
    • 86. 发明授权
    • Frequency mixer circuit receiving an unbalanced signal and outputting an
output voltage having a minimized offset voltage
    • 接收不平衡信号并输出​​具有最小化的失调电压的输出电压的混频器电路
    • US5875392A
    • 1999-02-23
    • US705828
    • 1996-08-30
    • Toshiyuki Tanaka
    • Toshiyuki Tanaka
    • H03D7/12H03D7/14H04B1/28
    • H03D7/1425H03D7/1433H03D7/1458H03D2200/0043H03D2200/0047H03D7/12
    • A frequency mixer circuit comprises a first differential circuit composed of first and second transistors having common-connected emitters, and a second differential circuit composed of third and fourth transistors having common-connected emitters. A collector of the first transistor is connected to a collector of the third transistor and also connected through a first resistor to Vcc. A collector of the second transistor is connected to a collector of the fourth transistor and also connected through a second resistor to Vcc. A base of the first transistor is connected to a base of the fourth transistor, and a base of the second transistor is connected to a base of the third transistor. An emitter-grounded, fifth transistor is connected at its collector to the common-connected emitters of the first and second transistors, so as to constitute a current source for driving the first differential circuit. An emitter-grounded, sixth transistor is connected at its collector to the common-connected emitters of the third and fourth transistors, so as to constitute a current source for driving the second differential circuit. The base of the first to fourth transistors are biased with a first bias voltage, and a first high frequency signal is applied in the form of an unbalanced signal to the base of the first and fourth transistors. The base of the fifth and sixth transistors are biased with a second bias voltage, and a second high frequency signal is applied in the form of an unbalanced signal to the base of the fifth transistor.
    • 一种混频器电路包括由具有公共连接的发射极的第一和第二晶体管组成的第一差分电路和由具有共同连接的发射极的第三和第四晶体管组成的第二差分电路。 第一晶体管的集电极连接到第三晶体管的集电极,并且还通过第一电阻器连接到Vcc。 第二晶体管的集电极连接到第四晶体管的集电极,并且还通过第二电阻器连接到Vcc。 第一晶体管的基极连接到第四晶体管的基极,第二晶体管的基极连接到第三晶体管的基极。 发射极接地的第五晶体管在其集电极处连接到第一和第二晶体管的共同连接的发射极,以便构成用于驱动第一差分电路的电流源。 发射极接地的第六晶体管在其集电极处连接到第三和第四晶体管的共同连接的发射极,以构成用于驱动第二差分电路的电流源。 第一至第四晶体管的基极以第一偏置电压偏置,并且以不平衡信号的形式将第一高频信号施加到第一和第四晶体管的基极。 第五和第六晶体管的基极用第二偏置电压偏置,第二高频信号以不平衡信号的形式施加到第五晶体管的基极。
    • 87. 发明授权
    • Film image reproducing apparatus and a control method for controlling
reproduction of film image
    • 薄膜图像再现装置和用于控制胶片图像再现的控制方法
    • US5742334A
    • 1998-04-21
    • US739361
    • 1996-10-29
    • Hirokazu YaguraToshiyuki TanakaTakeshi OnoKatsuyuki Nanba
    • Hirokazu YaguraToshiyuki TanakaTakeshi OnoKatsuyuki Nanba
    • H04N5/253H04N1/387H04N7/18
    • H04N1/3875H04N1/3877
    • A film image reproducing apparatus for reproducing a film image of each frame of a film, includes: an image pick up device which picks up a film image; a reproducer which is operable to reproduce specified areas of the picked up film image; an information reader which reads information recorded on the film concerning the orientation of the film image; a reproducing direction designator which designates a reproducing direction of images in the areas; and a controller which controls the reproducer based on the read information and the designated reproducing direction so as to reproduce the image areas in the designated reproducing direction while keeping an image in each image area in a specified reference orientation irrespective of the direction of the film image on the film. This apparatus can constantly move an image in a designated direction regardless of the orientation of the film image.
    • 一种用于再现胶片每帧的胶片图像的胶片图像再现装置,包括:拾取胶片图像的图像拾取装置; 再现器,其可操作以再现拾取的胶片图像的指定区域; 一个信息阅读器,其读取记录在胶片上关于胶片图像取向的信息; 指定区域中的图像的再现方向的再现方向指示符; 以及控制器,其基于读取信息和指定的再现方向控制再现器,以便在指定的再现方向上再现图像区域,同时将每个图像区域中的图像保持在指定的参考取向,而不管胶片图像的方向如何 在电影上。 无论电影图像的方向如何,该装置可以不断地以指定的方向移动图像。
    • 89. 发明授权
    • Method and device for manufacturing a semiconductor chip
    • 用于制造半导体芯片的方法和装置
    • US5570293A
    • 1996-10-29
    • US268185
    • 1994-06-29
    • Toshiyuki TanakaMasaharu Nakamura
    • Toshiyuki TanakaMasaharu Nakamura
    • H01L21/68H01L23/544G06F17/00
    • H01L21/6836H01L23/544H01L2221/68327H01L2223/54406H01L2223/54413H01L2223/54433H01L2223/54453H01L2223/54473H01L2223/54493H01L2924/0002
    • Semiconductor chip manufacturing methods and devices are disclosed which store dicing data corresponding to the kinds of wafers, when data indicating the wafer kinds are input, read out the dicing data corresponding to the data input, and cut a wafer set at a given position to a desired shape in accordance with the dicing data to thereby manufacture a semiconductor chip. The manufacturing methods and devices include read means for inputting the data indicating the wafer kinds. According to the manufacturing method and device, a symbol indicating the kind of the wafer is recorded as an identification symbol readable by the read means and on a member moving together with the wafer in a chip manufacturing process that is not part of the product being manufactured, and preferably, is also not part of a recyclable carrier for the wafer to be diced. When the data indicating the kind of the wafer is input, the identification symbol recorded in the above-mentioned member is read out by the read means.
    • 公开了半导体芯片制造方法和装置,当输入指示晶片种类的数据时,存储对应于晶片种类的切割数据,读出对应于数据输入的切割数据,并将给定位置处的晶片组切割成 根据切割数据形成所需的形状,从而制造半导体芯片。 制造方法和装置包括用于输入指示晶片种类的数据的读取装置。 根据制造方法和装置,表示晶片的种类的符号被记录为读取装置可读的识别符号,以及在不是被制造的产品的一部分的芯片制造过程中与晶片一起移动的部件 并且优选地也不是要切割晶片的可回收载体的一部分。 当输入指示晶片的种类的数据时,由读取装置读出记录在上述构件中的识别符号。