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81. 发明专利

JP2004176128A Method of producing protective layer-joined body and method of producing part obtained by using the protective layer-joined body 审中-公开
公开(公告)号：JP2004176128A
公开(公告)日：2004-06-24
申请号：JP2002343585
申请日：2002-11-27
申请人： Toyo Kohan Co Ltd , 東洋鋼鈑株式会社
发明人： SAIJO KINJI , YOSHIDA KAZUO , OSAWA SHINJI , NANBU KOJI
IPC分类号： B32B38/00 , B32B33/00 , C23F4/00 , B32B31/12
摘要： PROBLEM TO BE SOLVED: To provide a method of producing a protective layer-joined body obtained by stacking and joining a protective layer for protection from use environment or working environment and an unprotected layer, and to provide a method of producing parts obtained by using the protective layer-joined body. SOLUTION: The protective layer-joined body is obtained by stacking a protective layer 28 and an unprotected layer 22. In the method of producing the protective layer-joined body 10, each of the faces to be joined in the protective layer 28 and the unprotected layer 22 is subjected to activation treatment to remove unnecessary matter layers, thereafter, the faces to be joined are abutted and piled on each other so as to be confronted, and stack joining is performed to produce the protective layer-joined body 10. The protective layer-joined body 10 is stacked on a support 26 so as to be a stacked material 12, and the support 26 is subjected to etching working, so that an opening joined material 30 is produced, and it is made into a separation membrane part. Alternatively, it is stacked on a mesh plate 34 or a base 36, and is applied, e.g., to a hydrogen separation device as a separation membrane unit 32. COPYRIGHT: (C)2004,JPO

82. 发明专利

JP2004174904A Method for manufacturing substrate layer-including laminated material and method for manufacturing part using the same 审中-公开
公开(公告)号：JP2004174904A
公开(公告)日：2004-06-24
申请号：JP2002343695
申请日：2002-11-27
申请人： Toyo Kohan Co Ltd , 東洋鋼鈑株式会社
发明人： SAIJO KINJI , YOSHIDA KAZUO , OSAWA SHINJI , NANBU KOJI
IPC分类号： B32B7/02 , B32B37/00 , H05K3/00 , B32B31/22
摘要： PROBLEM TO BE SOLVED: To provide a method for manufacturing a substrate layer-including laminated material by laminating a substrate layer, an intermediate layer, an insulating layer and an electrically conductive layer, and a method for manufacturing a part using the same. SOLUTION: This substrate layer-including laminated material 30 is manufactured by successively laminating the substrate layer 26, the intermediate layer 25, the insulating layer 24 and the electrically conductive layer 23. At least one surface to be laminated of the substrate layer-including laminated material 30 is activated and, after the intermediate layer 25 is laminated on at least one surface to be laminated of the substrate layer 26 or the insulating layer 24, the intermediate layer 25 is brought into contact with the substrate layer 26 and the insulating layer 24 so as to be sandwiched between the substrate layer 26 and the insulating layer 24, and they are superposed one upon another and together laminated and bonded to manufacture the substrate layer-including laminated material 30. In addition, this substrate layer-including laminated material 30 is used to manufacture the part for use in a disk head or the like. COPYRIGHT: (C)2004,JPO

83. 发明专利

JP2004034619A Metal sheet laminate, laminated molded object using the same, and part using laminated molded object 审中-公开
公开(公告)号：JP2004034619A
公开(公告)日：2004-02-05
申请号：JP2002197865
申请日：2002-07-05
申请人： Toyo Kohan Co Ltd , 東洋鋼鈑株式会社
发明人： SAIJO KINJI , YOSHIDA KAZUO , OSAWA SHINJI , NANBU KOJI
IPC分类号： B23K20/04 , B23K20/24 , B32B15/01 , C23F4/00
摘要： PROBLEM TO BE SOLVED: To perform lamination without exerting adverse effect on the bonded part of a metal sheet laminate and to enhance processability at the time of processing into a required shape.
SOLUTION: A plurality of compounded metal sheets 26 and 28 capable of forming an intermetallic compound are laminated and, after the surfaces of the respective metal plates to be bonded are subjected to activation treatment, the metal plates are superposed one upon another in a contact state so that the activated treated surfaces are mutually opposed and lamination bonding is applied to both metal plates to manufacture a metal sheet laminate 20. Next, molding processing is applied to the metal sheet laminate to manufacture a laminated molded object 30 and this molded object is heat-treated to form the intermetallic compound in the vicinity of the bonded surface and, if necessary, the intermetallic compound is formed to the whole to produce a part 34.
COPYRIGHT: (C)2004,JPO

84. 发明专利

JP2004017480A Metallic laminate and part using the metallic laminate 审中-公开
公开(公告)号：JP2004017480A
公开(公告)日：2004-01-22
申请号：JP2002175655
申请日：2002-06-17
申请人： Toyo Kohan Co Ltd , 東洋鋼鈑株式会社
发明人： SAIJO KINJI , YOSHIDA KAZUO , OSAWA SHINJI , NANBU KOJI
IPC分类号： B23K20/00 , B23K20/04 , B23K20/24 , B32B15/01
摘要： PROBLEM TO BE SOLVED: To provide a metallic laminate obtained by laminating a plurality of highly conductive metallic sheets and parts using the metallic laminate which are applicable to a finned heat sink.
SOLUTION: This metallic laminate 20 with a specified laminar thickness is obtained by first laminating a plurality of highly conductive metallic sheets, then activating the surface of each of the metallic sheets to be laminated and bringing the activated faces into contact oppositely with each other and bonding them together in a laminar fashion. Next, the metallic laminate 20 is subjected to machining such as cutting so that the fins are formed and thus a heat sink is manufactured.
COPYRIGHT: (C)2004,JPO

85. 发明专利

JP2003291241A Method for producing plate laminate, method for producing hollow laminate using plate laminate, and method for producing part using hollow laminate 有权
标题翻译：生产板状层压板的方法，使用板层压板生产中空层压板的方法及使用中空层压板生产部件的方法
公开(公告)号：JP2003291241A
公开(公告)日：2003-10-14
申请号：JP2002100409
申请日：2002-04-02
申请人： Toyo Kohan Co Ltd , 東洋鋼鈑株式会社
发明人： SAIJO KINJI , YOSHIDA KAZUO , OSAWA SHINJI
IPC分类号： F28D15/02 , B23K20/00 , B23K20/14 , B23K20/18 , B32B7/04
摘要： PROBLEM TO BE SOLVED: To provide a method for producing a plate laminate in which a plurality of plates are laminated and bonded, a junction controlling part is formed in a prescribed pattern between a pair of facing plates to form at least one junction controlling part in the laminate, and one or more spots of the junction controlling part are to be used as openings, a method for producing a hollow laminate using the plate laminate, and a method for producing a part using the hollow laminate. SOLUTION: The junction controlling part is formed in the prescribed pattern between the facing plates 12 to form the plate laminate 20. The junction controlling part of the plate laminate 20 is expanded to form the hollow laminate having a hollow part 11, and a part of the hollow part is used as an opening part to produce the part. COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：为了提供一种板状层压体的制造方法，其中多个板被层压和结合，结合控制部分以规定的图案形成在一对相对的板之间以形成至少一个接合部控制部分在层压板中，并且接合控制部分的一个或多个点用作开口，使用该板层压板制造中空层压体的方法，以及使用该中空层压体制造部件的方法。解决方案：接合控制部分在相对板12之间以规定的图案形成，以形成板状层压体20.板状层压体20的接合控制部分被膨胀以形成具有中空部分11的中空层压体，并且中空部分的一部分用作开口部分以制造该部件。版权所有（C）2004，JPO

86. 发明专利

JP2003291238A Method for producing base material layer laminate and method for producing part using the laminate 有权
标题翻译：用于生产基材层压板的方法和使用层压板生产部分的方法
公开(公告)号：JP2003291238A
公开(公告)日：2003-10-14
申请号：JP2002095914
申请日：2002-03-29
申请人： Toyo Kohan Co Ltd , 東洋鋼鈑株式会社
发明人： SAIJO KINJI , KAWAMURA TSUGIO , YOSHIDA KAZUO , OSAWA SHINJI
IPC分类号： B32B7/02
摘要： PROBLEM TO BE SOLVED: To provide a method for producing a base material laminate in which base material layers and conductive layers are laminated without using a high temperature process, and a method for producing a part using the laminate. SOLUTION: In the method for producing the base material layer laminate 30 in which the base material layers 24 and the conductive layers 22 are laminated alternately, by forming the conductive layer 22 by using a conductive layer forming means by electric plating, etc., in a clearance formed by the base material layers 24, each having thin conductive layer 22, the base material layers are bonded/fixed to obtain the base material layer laminate 30. The part such as a capacitor is produced by using the laminate 30. COPYRIGHT: (C)2004,JPO
摘要翻译：解决问题的方法：提供一种基板材料层叠体的制造方法，其中不使用高温处理层叠基材层和导电层，以及使用该层压体的部件的制造方法。＆lt; P＆gt;解决方案：在基材层24和导电层22交替层叠的基材层叠体30的制造方法中，通过使用导电层形成装置通过电镀等形成导电层22 在由具有薄导电层22的基材层24形成的间隙中，基材层被粘结/固定以获得基材层层叠体30.通过使用层压体30制造诸如电容器的部分版权所有（C）2004，JPO

87. 发明专利

JP2003291237A Base material layer laminate and part using the laminate 有权
标题翻译：基层材料层和层压板的一部分
公开(公告)号：JP2003291237A
公开(公告)日：2003-10-14
申请号：JP2002095855
申请日：2002-03-29
申请人： Toyo Kohan Co Ltd , 東洋鋼鈑株式会社
发明人： SAIJO KINJI , KAWAMURA TSUGIO , YOSHIDA KAZUO , OSAWA SHINJI
IPC分类号： B32B7/02
摘要： PROBLEM TO BE SOLVED: To provide a base material layer laminate in which base material layers and conductive layers are laminated without using a high temperature process, and a part using the laminate. SOLUTION: In the base material layer laminate 30, the base material layers 24 and the conductive layers 22 are laminated alternately. The conductive layer is formed by using a conductive layer forming means by electric plating, etc., in a clearance formed by the base material layers 24, each having the thin conductive layer 22 on at least one side, so that the base material layers are bonded and fixed to obtain the laminate 30. The laminate 30 is used in the part such as a capacitor. COPYRIGHT: (C)2004,JPO
摘要翻译：解决的问题：为了提供在不使用高温处理的情况下层压基材层和导电层的基材层层叠体和使用该层压体的部分。解决方案：在基材层叠体30中，交替层叠基材层24和导电层22。通过在由基材层24形成的间隙中通过电镀等使用导电层形成装置形成导电层，每个基材层在至少一侧具有薄导电层22，使得基材层粘合并固定以获得层压体30.层压体30用于诸如电容器的部分中。版权所有（C）2004，JPO

88. 发明专利

JP2003237010A METHOD FOR MANUFACTURING RESISTANCE PLATE LAMINATED MATERIAL AND METHOD FOR MANUFACTURING COMPONENT USING RESISTANCE PLATE LAMINATED MATERIAL 审中-公开
公开(公告)号：JP2003237010A
公开(公告)日：2003-08-26
申请号：JP2002039630
申请日：2002-02-18
申请人： TOYO KOHAN CO LTD
发明人： SAIJO KINJI , YOSHIDA KAZUO , OSAWA SHINJI
IPC分类号： H05K1/09 , B32B38/00 , H05K1/16 , B32B31/12
摘要： PROBLEM TO BE SOLVED: To provide a method for manufacturing a resistance plate laminated material capable of forming a resistor having a required resistance value in a wiring pattern formed by etching and to provide a method for manufacturing a component using the resistance plate laminated material. SOLUTION: The method for manufacturing the resistance plate laminated material comprises the steps of stacking a conductive plate 24 having excellent conductivity and a plurality of resistance plates 28 each having a predetermined specific resistance, activating the surfaces to be connected, then bringing the activated surfaces into contact with each other to be opposed, lap laminate connecting the surfaces to manufacture the resistance plate laminated material 20 capable of forming a resistor having a required resistance in a wiring pattern. The component to be applied to a printed circuit board, an IC package or the like is manufactured by using the resistance plate laminated material 20. COPYRIGHT: (C)2003,JPO

89. 发明专利

JP2003181238A GAS PERMEABLE LAYER JOINED BODY AND COMPONENT USING GAS PERMEABLE LAYER JOINED BODY 审中-公开
公开(公告)号：JP2003181238A
公开(公告)日：2003-07-02
申请号：JP2001386627
申请日：2001-12-19
申请人： TOYO KOHAN CO LTD
发明人： SAIJO KINJI , YOSHIDA KAZUO , OSAWA SHINJI
IPC分类号： B01D53/22 , B01D67/00 , B01D69/12 , B01D71/02 , B01J19/08 , B32B37/00 , C01B3/56 , H01M8/06
摘要： PROBLEM TO BE SOLVED: To provide a gas permeable layer joined body having no handling problem even when an extremely thin gas permeable layer is used, and to provide a component using the gas permeable layer joined body. SOLUTION: In the gas permeable layer joined body 12 that is formed by a laminated body 10 formed by laminating a gas permeable layer 28 on a base body 22 and a supporting body 11 formed by laminating an intermediate layer 24 on a supporting layer 26, the surface of the gas permeable layer 28 and the surface of the intermediate layer 24 which are to be joined to each other are activated and the brought into contact with each other to face the activated surfaces and laid over the other to form the gas permeable layer joined body 12. A gas separation membrane component is obtained by removing the base body 22 from the gas permeable layer joined body 12 and etching the supporting body 11 to form an opening joining material 30, or a gas separation membrane unit is obtained by laminating a mesh plate 34 or a base 36 to be applied for a hydrogen separation apparatus or the like. COPYRIGHT: (C)2003,JPO

90. 发明专利

JP2003136665A METHOD FOR PRODUCING CONDUCTIVE LAYER LAMINATED MATERIAL AND METHOD FOR PRODUCING PART USING THE LAMINATED MATERIAL 审中-公开
公开(公告)号：JP2003136665A
公开(公告)日：2003-05-14
申请号：JP2001338219
申请日：2001-11-02
申请人： TOYO KOHAN CO LTD
发明人： SAIJO KINJI , YOSHIDA KAZUO , OSAWA SHINJI
IPC分类号： B32B38/00 , B32B7/02 , B32B31/12
摘要： PROBLEM TO BE SOLVED: To provide a method for producing a conductive layer laminated material which can reduce or exclude the formation of a fragile alloy layer on a junction interface associated with a high temperature process and an undesirable influence such as large residual stress associated with high rolling rate junction and a method for producing a part using the laminated material. SOLUTION: The surfaces to be joined of the laminated material in which an insulating layer is laminated on the first conductive layer and the second conductive layer are subjected to activation treatment. The activated surfaces are arranged to face each other and laminated and joined together to produce the conductive layer laminated material. The part applicable to a printed wiring board, an IC package, etc., is produced by using the conductive layer laminated material.

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