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81. 发明公开

EP3235353A1 MODULAR DEFORMABLE PLATFORM 有权转让
标题翻译：模块化可变形平台
公开(公告)号：EP3235353A1
公开(公告)日：2017-10-25
申请号：EP15870808.1
申请日：2015-12-14
申请人： Robert Bosch GmbH
发明人： YEE, Seow, Yuen , YAMA, Gary , KIM, Bongsang , SAMARAO, Ashwin
IPC分类号： H05K1/02 , H05K1/03 , H01L23/48
CPC分类号： H05K1/028 , A61B5/0022 , A61B5/01 , A61B5/11 , A61B5/4519 , A61B5/4528 , A61B5/4542 , A61B5/6833 , A61B2560/0242 , A61B2560/0412 , A61B2562/0204 , A61B2562/0247 , A61B2562/0271 , A61B2562/028 , A61B2562/029 , A61B2562/066 , A61B2562/12 , A61B2562/164 , H01L2924/0002 , H05K1/0278 , H05K1/0281 , H05K1/0393 , H05K1/118 , H05K1/148 , H05K1/189 , H05K3/005 , H05K3/0052 , H05K3/0058 , H05K3/0097 , H05K3/1216 , H05K3/281 , H05K3/285 , H05K3/30 , H05K2201/053 , H05K2201/09063 , H05K2201/10037 , H05K2201/10121 , H05K2201/10151 , H05K2203/1453 , H05K2203/1545 , H01L2924/0001
摘要： A modular deformable electronics platform is attachable to a deformable surface, such as skin. The platform is tolerant to surface deformation and motion, can flex in and out of a plane of the platform without hindering operability of electrical components included on the platform, and is formed via arrangement of discrete flexible tiles, with corners of adjacent tiles connected by a flexible connection material so that individual tiles can translate and rotate relative to each other. Interconnects disposed on bases of separate tiles electrically connect adjacent tiles via their connected corners, and electrically connect components disposed on different tiles. Each pair of adjacent corner connections defines an axis about which at least a portion of the platform can flex without deformation and without hindering connections between tiles. The flexible material and/or bases of the tiles can include Parylene.
摘要翻译：模块化的可变形电子平台可连接到可变形表面，如皮肤。该平台能够容忍表面变形和运动，能够在平台的平面内弯曲进出，而不会妨碍平台上包括的电气部件的可操作性，并且是通过布置分立的柔性瓦片形成的，其中相邻瓦片的角部通过灵活的连接材料，以便单个瓷砖可以相对于彼此平移和旋转。设置在独立瓦片的基部上的互连通过其相连的角部电连接相邻的瓦片，并电连接设置在不同瓦片上的部件。每对相邻的角连接件限定轴线，平台的至少一部分可以弯曲而不变形并且不妨碍瓦片之间的连接。瓷砖的柔性材料和/或基底可以包括派瑞林。

82. 发明公开

EP3077804A1 SEMICONDUCTOR SENSOR HAVING A SUSPENDED STRUCTURE AND ITS MANUFACTURING METHOD 审中-公开
标题翻译： HALBLEITERSENSOR MITAUFGEHÀ“NGTER STRUKTUR UND DESSEN HERSTELLUNGSVERFAHREN
公开(公告)号：EP3077804A1
公开(公告)日：2016-10-12
申请号：EP14806252.4
申请日：2014-12-02
申请人： Robert Bosch GmbH
发明人： SAMARAO, Ashwin , FEYH, Ando , OBRIEN, Gary , YAMA, Gary , PURKL, Fabian
IPC分类号： G01N27/12
CPC分类号： G01N27/028 , G01N27/12 , G01N33/0062
摘要： A semiconductor gas sensor device includes a substrate, a conductive layer supported by the substrate, a non-suitable seed layer, and a porous gas sensing layer portion. The non-suitable seed layer is formed from a first material and includes a first support portion supported by the conductive layer, a second support portion supported by the conductive layer, and a suspended seed portion extending from the first support portion to the second support portion and suspended above the conductive layer. The porous gas sensing layer portion is formed from a second material and is supported directly by the non-suitable seed layer in electrical communication with the conductive layer. The first material and the second material form a non-suitable pair of materials.
摘要翻译：半导体气体传感器装置包括衬底，由衬底支撑的导电层，非合适的晶种层和多孔气体感测层部分。非合适种子层由第一材料形成，并且包括由导电层支撑的第一支撑部分，由导电层支撑的第二支撑部分和从第一支撑部分延伸到第二支撑部分的悬挂种子部分并悬浮在导电层上方。所述多孔气体感测层部分由第二材料形成，并且由与所述导电层电连通的所述非合适晶种层直接支撑。第一材料和第二材料形成非合适的材料对。

83. 发明公开

EP3063791A1 METAL OXIDE SEMICONDUCTOR SENSOR AND METHOD OF FORMING A METAL OXIDE SEMICONDUCTOR SENSOR USING ATOMIC LAYER DEPOSITION 有权
标题翻译：金属氧化物半导体传感器以及使用原子层沉积形成金属氧化物半导体传感器的方法
公开(公告)号：EP3063791A1
公开(公告)日：2016-09-07
申请号：EP14856905.6
申请日：2014-10-30
申请人： Robert Bosch GmbH
发明人： SAMARAO, Ashwin, K. , O'BRIEN, Gary , FEYH, Ando , PURKL, Fabian , YAMA, Gary
IPC分类号： H01L27/14 , H01L29/94 , H01L21/205
CPC分类号： G01N27/227 , G01N27/125 , G01N27/16
摘要： A semiconductor sensor device includes a substrate, a non-suitable seed layer located above the substrate, at least one electrode located above the non-suitable seed layer, and a porous sensing layer supported directly by the non-suitable seed layer and in electrical communication with the at least one electrode, the porous sensing layer defining a plurality of grain boundaries formed by spaced-apart nucleation on the non-suitable seed layer using atomic layer deposition.
摘要翻译：一种半导体传感器装置包括衬底，位于衬底上方的不合适种子层，位于不合适种子层上方的至少一个电极以及直接由非合适种子层支撑并且电连通的多孔传感层利用所述至少一个电极，所述多孔传感层使用原子层沉积在所述不合适的种子层上限定通过间隔成核形成的多个晶界。

84. 发明公开

EP2981816A1 METHOD OF MANUFACTURING A SENSOR DEVICE HAVING A POROUS THIN-FILM METAL ELECTRODE 有权
标题翻译：方法用于制造传感器设备与多孔薄膜金属铅
公开(公告)号：EP2981816A1
公开(公告)日：2016-02-10
申请号：EP13821336.8
申请日：2013-12-20
申请人： Robert Bosch GmbH
发明人： FEYH, Ando , O'BRIEN, Gary , PURKL, Fabian , YAMA, Gary , SAMARAO, Ashwin
IPC分类号： G01N27/414
CPC分类号： H01L21/28008 , G01N27/4146 , H01L29/4238
摘要： A method of fabricating a semiconductor sensor device includes providing a substrate, supporting a source region and a drain region with the substrate, forming an insulator layer above the source region and the drain region, and forming a porous metallic gate region above the insulator layer using plasma enhanced atomic layer deposition (PEALD).

85. 发明公开

EP2697157A1 WAFER WITH SPACER INCLUDING HORIZONTAL MEMBER 有权转让
标题翻译： WAFER MIT ABSTANDSHALTER MIT HORIZONTALEM ELEMENT
公开(公告)号：EP2697157A1
公开(公告)日：2014-02-19
申请号：EP12716957.1
申请日：2012-04-13
申请人： Robert Bosch GmbH
发明人： GRAHAM, Andrew, B. , YAMA, Gary , O'BRIEN, Gary
IPC分类号： B81C1/00 , H01L21/762
CPC分类号： H01L29/0649 , H01L21/76232 , H01L21/76283 , H01L21/7682 , H01L23/4821 , H01L2924/0002 , H01L2924/00
摘要： In one embodiment, a method of forming an insulating spacer includes providing a base layer, providing an intermediate layer above an upper surface of the base layer, etching a first trench in the intermediate layer, depositing a first insulating material portion within the first trench, depositing a second insulating material portion above an upper surface of the intermediate layer, forming an upper layer above an upper surface of the second insulating material portion, etching a second trench in the upper layer, and depositing a third insulating material portion within the second trench and on the upper surface of the second insulating material portion.
摘要翻译：在一个实施例中，形成绝缘间隔物的方法包括提供基底层，在基底层的上表面上方提供中间层，蚀刻中间层中的第一沟槽，在第一沟槽内沉积第一绝缘材料部分，在所述中间层的上表面上方沉积第二绝缘材料部分，在所述第二绝缘材料部分的上表面上方形成上层，蚀刻所述上层中的第二沟槽，以及在所述第二沟槽内沉积第三绝缘材料部分并且在第二绝缘材料部分的上表面上。

86. 发明公开

EP2697154A1 METHOD OF FORMING MEMBRANES WITH MODIFIED STRESS CHARACTERISTICS 审中-公开
标题翻译： VERFAHREN ZUR HERSTELLUNG冯膜蛋白VERÄNDERTENBELASTUNGSEIGENSCHAFTEN
公开(公告)号：EP2697154A1
公开(公告)日：2014-02-19
申请号：EP12718799.5
申请日：2012-04-13
申请人： Robert Bosch GmbH
发明人： GRAHAM, Andrew, B. , YAMA, Gary , O'BRIEN, Gary
IPC分类号： B81B3/00 , B81C1/00 , G01L9/00
CPC分类号： B81B3/0072 , B81B2201/0264 , B81C1/00666 , G01L9/0042
摘要： A method of modifying stress characteristics of a membrane in one embodiment includes providing a membrane layer, determining a desired stress modification, and forming at least one trough in the membrane layer based upon the determined desired stress modification.
摘要翻译：在一个实施方案中，改变膜的应力特性的方法包括提供膜层，确定所需的应力变化，以及基于确定的所需应力改变在膜层中形成至少一个槽。

87. 发明授权

EP2432727B1 SUBSTRATE WITH MULTIPLE ENCAPSULATED PRESSURES 有权
标题翻译：具有多个封装基底PRESS
公开(公告)号：EP2432727B1
公开(公告)日：2013-05-29
申请号：EP10714711.8
申请日：2010-03-09
申请人： Robert Bosch GmbH
发明人： CANDLER, Robert, N. , YAMA, Gary
IPC分类号： B81C1/00 , B81B7/02
CPC分类号： H01L23/3171 , B81B7/02 , B81B2201/0235 , B81B2201/0242 , B81C1/00293 , B81C2203/0136 , H01L2924/0002 , H01L2924/00

88. 发明公开

EP2432727A2 SUBSTRATE WITH MULTIPLE ENCAPSULATED PRESSURES 有权
标题翻译：具有多个封装基底PRESS
公开(公告)号：EP2432727A2
公开(公告)日：2012-03-28
申请号：EP10714711.8
申请日：2010-03-09
申请人： Robert Bosch GmbH
发明人： CANDLER, Robert, N. , YAMA, Gary
IPC分类号： B81B7/02
CPC分类号： H01L23/3171 , B81B7/02 , B81B2201/0235 , B81B2201/0242 , B81C1/00293 , B81C2203/0136 , H01L2924/0002 , H01L2924/00
摘要： A method of forming a device with multiple encapsulated pressures is disclosed herein. In accordance with one embodiment of the present invention, there is provided a method of forming a device with multiple encapsulated pressures, including providing a substrate, forming a functional layer on top of a surface of the substrate, the functional layer including a first device portion at a first location, and a second device portion at a second location adjacent to the first location, encapsulating the functional layer, forming at least one diffusion resistant layer above the encapsulated functional layer at a location above the first location and not above the second location, modifying an environment adjacent the at least one diffusion resistant layer, and diffusing a gas into the second location as a result of the modified environment.

89. 发明公开

EP2387722A1 METHOD OF FORMING A DEVICE WITH A PIEZORESISTOR AND ACCELEROMETER 有权转让
标题翻译：一种用于形成设备与压电电阻和加速度计
公开(公告)号：EP2387722A1
公开(公告)日：2011-11-23
申请号：EP10700463.2
申请日：2010-01-12
申请人： Robert Bosch GmbH
发明人： YAMA, Gary , PRUITT, Beth , BARLIAN, Arnoldus, Alvin
IPC分类号： G01P15/12 , G01C19/56 , H01L21/762 , H01L27/12
CPC分类号： G01C19/56 , B81B3/0086 , B81B2201/0235 , B81B2203/051 , B81B2207/053 , G01P15/0802 , G01P15/123 , G01P2015/0817
摘要： A method of forming a device with a piezoresistor is disclosed herein. In one embodiment, the method includes providing a substrate, etching a trench in the substrate to form a vertical wall, growing a piezoresistor layer epitaxially on the vertical wall, and separating the vertical wall from an underlying layer of the substrate that extends along a horizontal plane such that the piezoresistor layer is movable with respect to the underlying layer within the horizontal plane.

90. 发明授权

EP2387722B1 METHOD OF FORMING A DEVICE WITH A PIEZORESISTOR AND ACCELEROMETER 有权转让
公开(公告)号：EP2387722B1
公开(公告)日：2020-03-11
申请号：EP10700463.2
申请日：2010-01-12
申请人： Robert Bosch GmbH
发明人： YAMA, Gary , PRUITT, Beth , BARLIAN, Arnoldus, Alvin
IPC分类号： G01P15/12 , G01C19/56 , B81B5/00 , G01P15/08

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