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81. 发明授权

US07250101B2 Electrochemically fabricated structures having dielectric or active bases and methods of and apparatus for producing such structures 有权
标题翻译：具有电介质或活性碱的电化学制造结构以及用于制造这种结构的方法和装置
公开(公告)号：US07250101B2
公开(公告)日：2007-07-31
申请号：US10434493
申请日：2003-05-07
申请人： Jeffrey A. Thompson , Adam L. Cohen , Michael S. Lockard , Dennis R. Smalley
发明人： Jeffrey A. Thompson , Adam L. Cohen , Michael S. Lockard , Dennis R. Smalley
IPC分类号： C25D1/00 , C25D5/02 , C25D5/48 , C25D5/52
CPC分类号： B81C1/00126 , B33Y10/00 , B33Y70/00 , B81C2201/0181 , B81C2201/0188 , B81C2201/019
摘要： Multilayer structures are electrochemically fabricated on a temporary (e.g. conductive) substrate and are thereafter bonded to a permanent (e.g. dielectric, patterned, multi-material, or otherwise functional) substrate and removed from the temporary substrate. In some embodiments, the structures are formed from top layer to bottom layer, such that the bottom layer of the structure becomes adhered to the permanent substrate, while in other embodiments the structures are form from bottom layer to top layer and then a double substrate swap occurs. The permanent substrate may be a solid that is bonded (e.g. by an adhesive) to the layered structure or it may start out as a flowable material that is solidified adjacent to or partially surrounding a portion of the structure with bonding occurs during solidification. The multilayer structure may be released from a sacrificial material prior to attaching the permanent substrate or it may be released after attachment.
摘要翻译：多层结构在临时的（例如导电的）衬底上电化学地制造，然后在永久（例如电介质，图案化，多材料或其他功能）的衬底上结合并从临时衬底去除。在一些实施例中，结构由顶层到底层形成，使得结构的底层变得粘附到永久性基底上，而在其它实施例中，结构是从底层到顶层形成的，然后是双层衬底交换发生。永久性基材可以是与层状结构结合的固体（例如通过粘合剂），或者可以作为在凝固期间发生结合而在结构的一部分附近凝固的可流动材料开始。多层结构可以在附着永久性基底之前从牺牲材料上释放，或者在附着后可以释放多层结构。

82. 发明授权

US06333741B1 Boolean layer comparison slice 失效
标题翻译：布尔层比较片
公开(公告)号：US06333741B1
公开(公告)日：2001-12-25
申请号：US09215793
申请日：1998-12-18
申请人： David E. Snead , Dennis R. Smalley , Adam L. Cohen , Joseph W. Allison , Thomas J. Vorgitch , Thomas P. Chen
发明人： David E. Snead , Dennis R. Smalley , Adam L. Cohen , Joseph W. Allison , Thomas J. Vorgitch , Thomas P. Chen
IPC分类号： G06T1700
CPC分类号： G06T17/20 , B29C64/124 , B29C64/135 , B29C64/386 , B29C64/40 , B29K2995/0073 , B33Y10/00 , B33Y50/00 , B33Y50/02 , G01J1/4257 , G03F7/0037 , G03F7/70416 , G05B2219/49013 , G06T17/00 , G06T17/10
摘要： A method of and apparatus for slicing a three-dimensional object representation into a plurality of layer representations is described, wherein the layer representations are subsequently used to form the object layer-by-layer according to the principles of stereolithography. If not already provided in the object representation, a plurality of layer boundary representations are first formed, and then the boolean difference of successive layer boundary representations are computed to derive boundaries of up and down-facing regions, enabling different cure parameters to be specified for these different regions.
摘要翻译：描述用于将三维对象表示分割成多个层表示的方法和装置，其中随后根据立体光刻原理逐层地形成层表示。如果没有在对象表示中提供，则首先形成多个层边界表示，然后计算连续层边界表示的布尔差以导出上下区域的边界，从而为这些不同的地区。

83. 发明授权

US5891382A Recoating of stereolithographic layers 失效
标题翻译：重新制备立体光刻层
公开(公告)号：US5891382A
公开(公告)日：1999-04-06
申请号：US767695
申请日：1996-12-17
申请人： Thomas A. Almquist , Charles W. Hull , Borzo Modrek , Paul F. Jacobs , Charles W. Lewis , Adam L. Cohen , Stuart T. Spence , Hop D. Nguyen , Mark A. Lewis , Abraham Liran , Dennis R. Smalley
发明人： Thomas A. Almquist , Charles W. Hull , Borzo Modrek , Paul F. Jacobs , Charles W. Lewis , Adam L. Cohen , Stuart T. Spence , Hop D. Nguyen , Mark A. Lewis , Abraham Liran , Dennis R. Smalley
IPC分类号： B29C35/08 , B29C41/02 , B29C41/12 , B29C41/52 , B29C67/00 , G01F23/292 , G01F23/36 , G05D9/12
CPC分类号： G05D9/12 , B29C41/12 , B29C67/0066 , G01F23/2921 , G01F23/366 , B29K2995/0073 , Y10T156/17
摘要： Improved apparatus and methods for forming a layer of material over a surface of a previously-formed cross-section of a three-dimensional object in anticipation of forming a next cross-section of the object out of the layer. A volume of material, including at least some excess material, is placed over the surface, and the excess material is swept off by placing the excess material in the predetermined path of a sweeping member, the path being substantially in a plane spaced from a working surface of material. The member may be directed to sweep the excess material away through a successive number of sweeps, which may vary for each cross-section, at least a velocity which may vary for each sweep. Additionally, the clearance between the member and the surface of the previous cross-section may vary for each sweep. A "winged" member is also provided, comprising two legs extending from a base, and a "Trident" embodiment is also provided, comprising three legs extending from a base.
摘要翻译：改进的用于在三维物体的预先形成的横截面的表面上形成材料层的装置和方法，以期将物体的下一个横截面形成在该层之外。将一定体积的材料（包括至少一些多余的材料）放置在表面上，并且通过将多余的材料放置在扫掠构件的预定路径中来清除多余的材料，该路径基本上处于与工作材料表面。该构件可以被引导以通过连续数量的扫描来扫过多余的材料，该扫描对于每个横截面可以变化，至少每个扫描可能变化的速度。此外，构件和前一横截面的表面之间的间隙可以针对每个扫掠而变化。还提供了一个“翼形”构件，其包括从基座延伸的两个腿部，并且还提供了“三叉戟”实施例，其包括从底座延伸的三个腿部。

84. 发明授权

US08613846B2 Multi-layer, multi-material fabrication methods for producing micro-scale and millimeter-scale devices with enhanced electrical and/or mechanical properties 有权
标题翻译：用于生产具有增强的电和/或机械性能的微尺度和毫米级装置的多层多材料制造方法
公开(公告)号：US08613846B2
公开(公告)日：2013-12-24
申请号：US12906970
申请日：2010-10-18
申请人： Ming Ting Wu , Rulon Joseph Larsen, III , Young Kim , Kieun Kim , Adam L. Cohen , Ananda H. Kumar , Michael S. Lockard , Dennis R. Smalley
发明人： Ming Ting Wu , Rulon Joseph Larsen, III , Young Kim , Kieun Kim , Adam L. Cohen , Ananda H. Kumar , Michael S. Lockard , Dennis R. Smalley
IPC分类号： C25D5/02 , C25D5/10
CPC分类号： G01R1/06716 , B33Y10/00 , C23C18/1605 , C23C18/1651 , C25D1/003 , G01R1/06744 , G01R1/06755 , G01R3/00 , H01L21/4853
摘要： Some embodiments of the invention are directed to electrochemical fabrication methods for forming structures or devices (e.g. microprobes for use in die level testing of semiconductor devices) from a core material and a shell or coating material that partially coats the surface of the structure. Other embodiments are directed to electrochemical fabrication methods for producing structures or devices (e.g. microprobes) from a core material and a shell or coating material that completely coats the surface of each layer from which the probe is formed including interlayer regions. Additional embodiments of the invention are directed to electrochemical fabrication methods for forming structures or devices (e.g. microprobes) from a core material and a shell or coating material wherein the coating material is located around each layer of the structure without locating the coating material in inter-layer regions. Each of these groups of embodiments incorporate both the core material and the coating material during the formation of each layer and each layer is also formed with a sacrificial material that is removed after formation of all layers of the structure. In some embodiments the core material may be a genuine structural material while in others it may be only a functional structural material (i.e. a material that would be removed with sacrificial material if it were accessible by an etchant during removal of sacrificial material.
摘要翻译：本发明的一些实施方案涉及用于从芯材料和部分涂覆结构表面的壳或涂层材料形成结构或器件（例如用于半导体器件的晶片级测试的微探针）的电化学制造方法。其它实施方案涉及用于从芯材和壳或涂层材料制造结构或器件（例如微探针）的电化学制造方法，其完全涂覆形成探针的每个层的表面，包括中间层区域。本发明的另外的实施方案涉及用于从核心材料和壳或涂层材料形成结构或器件（例如微针）的电化学制造方法，其中涂层材料围绕结构的每一层定位，而不将涂层材料定位在相互之间，层区域。这些实施例组中的每一个在形成每个层期间都包括芯材料和涂层材料，并且每个层还形成有牺牲材料，该牺牲材料在形成所述结构的所有层之后被去除。在一些实施例中，芯材料可以是真正的结构材料，而在其它实施例中，其可以仅是功能性结构材料（即，如果在去除牺牲材料期间可通过蚀刻剂获得牺牲材料，则该材料将被除去。

85. 发明申请

US20110315556A1 Methods and Apparatus for Forming Multi-Layer Structures Using Adhered Masks 审中-公开
标题翻译：使用粘附掩模形成多层结构的方法和装置
公开(公告)号：US20110315556A1
公开(公告)日：2011-12-29
申请号：US13206133
申请日：2011-08-09
申请人： Adam L. Cohen , Jill R. Thomassian , Michael S. Lockard , Marvin M. Kilgo, III , Uri Frodis , Dennis R. Smalley
发明人： Adam L. Cohen , Jill R. Thomassian , Michael S. Lockard , Marvin M. Kilgo, III , Uri Frodis , Dennis R. Smalley
IPC分类号： C25D5/02
CPC分类号： C25D1/003 , C25D1/00 , C25D1/20 , C25D5/02 , C25D5/022 , C25D5/10 , C25D5/14 , C25D5/48 , C25D5/50
摘要： Numerous electrochemical fabrication methods and apparatus are provided for producing multi-layer structures (e.g. having meso-scale or micro-scale features) from a plurality of layers of deposited materials using adhered masks (e.g. formed from liquid photoresist or dry film), where two or more materials may be provided per layer where at least one of the materials is a structural material and one or more of any other materials may be a sacrificial material which will be removed after formation of the structure. Materials may comprise conductive materials that are electrodeposited or deposited in an electroless manner. In some embodiments special care is undertaken to ensure alignment between patterns formed on successive layers.
摘要翻译：提供了多种电化学制造方法和装置，用于使用粘附的掩模（例如由液体光致抗蚀剂或干膜形成）从多层沉积材料制备多层结构（例如具有中尺度或微尺度特征），其中两个或者可以在每层中提供更多的材料，其中至少一种材料是结构材料，并且任何其它材料中的一种或多种可以是在形成结构之后被去除的牺牲材料。材料可以包括以无电解方式电沉积或沉积的导电材料。在一些实施例中，特别注意确保在连续层上形成的图案之间的对准。

86. 发明授权

US07611616B2 Mesoscale and microscale device fabrication methods using split structures and alignment elements 失效
标题翻译：使用分裂结构和对准元件的中尺度和微米器件制造方法
公开(公告)号：US07611616B2
公开(公告)日：2009-11-03
申请号：US11506586
申请日：2006-08-18
申请人： Adam L. Cohen , Michael S. Lockard , Dennis R. Smalley
发明人： Adam L. Cohen , Michael S. Lockard , Dennis R. Smalley
IPC分类号： C25D5/02
CPC分类号： C25D1/003 , B33Y10/00 , B81B2201/042 , B81C1/00293 , B81C1/00333 , B81C2201/0197 , B81C2203/0145 , C25D1/10 , C25D5/022 , G01P15/0802 , G01P15/125 , H01P1/202 , H01P3/06 , H01P5/183 , H01P11/00 , H01P11/005 , H05K3/4647 , Y10T156/10
摘要： Various embodiments of the invention are directed to formation of mesoscale or microscale devices using electrochemical fabrication techniques where structures are formed from a plurality of layers as opened structures which can be folded over or other otherwise combined to form structures of desired configuration. Each layer is formed from at least one structural material and at least one sacrificial material. The initial formation of open structures may facilitate release of the sacrificial material, ability to form fewer layers to complete a structure, ability to locate additional materials into the structure, ability to perform additional processing operations on regions exposed while the structure is open, and/or the ability to form completely encapsulated and possibly hollow structures.
摘要翻译：本发明的各种实施例涉及使用电化学制造技术形成中尺度或微尺寸器件，其中结构由多个层形成为打开的结构，其可折叠或以其他方式组合以形成所需构造的结构。每个层由至少一种结构材料和至少一种牺牲材料形成。开放结构的初始形成可以促进牺牲材料的释放，形成较少层以完成结构的能力，将附加材料定位到结构中的能力，对结构打开时暴露的区域执行附加处理操作的能力和/ 或形成完全封装和可能中空结构的能力。

87. 发明授权

US07531077B2 Electrochemical fabrication process for forming multilayer multimaterial microprobe structures 有权
标题翻译：用于形成多层多材料微探针结构的电化学制造工艺
公开(公告)号：US07531077B2
公开(公告)日：2009-05-12
申请号：US11029221
申请日：2005-01-03
申请人： Adam L. Cohen , Ananda H. Kumar , Michael S. Lockard , Dennis R. Smalley
发明人： Adam L. Cohen , Ananda H. Kumar , Michael S. Lockard , Dennis R. Smalley
IPC分类号： C25D5/02
CPC分类号： G01R1/06716 , B33Y10/00 , C23C18/1605 , C23C18/1651 , C25D1/003 , G01R1/0483 , G01R1/07357 , G01R31/2886
摘要： Some embodiments of the invention are directed to the electrochemical fabrication of microprobes which are formed from a core material and a material that partially coats the surface of the probe. Other embodiments are directed to the electrochemical fabrication of microprobes which are formed from a core material and a material that completely coats the surface of each layer from which the probe is formed including interlayer regions. These first two groups of embodiments incorporate both the core material and the coating material during the formation of each layer. Still other embodiments are directed to the electrochemical fabrication of microprobe arrays that are partially encapsulated by a dielectric material during a post layer formation coating process. In even further embodiments, the electrochemical fabrication of microprobes from two or more materials may occur by incorporating a coating material around each layer of the structure without locating the coating material in inter-layer regions.
摘要翻译：本发明的一些实施方案涉及由芯材料和部分涂覆探针的表面的材料形成的微针的电化学制造。其它实施方案涉及由核心材料形成的微结构的电化学制造，以及完全涂覆形成探针的每个层的表面的材料，包括中间层区域。这些前两组实施例在形成每个层期间都包括芯材料和涂层材料。其他实施例涉及在后层形成涂覆工艺期间由电介质材料部分封装的微探针阵列的电化学制造。在甚至进一步的实施方案中，来自两种或更多种材料的微结构的电化学制造可以通过在结构的每一层周围并入涂层材料而不将涂层材料定位在层间区域中而进行。

88. 发明申请

US20090084756A1 Electrochemical Fabrication Method and Application for Producing Three-Dimensional Structures Having Improved Surface Finish 审中-公开
标题翻译：电化学制造方法及应用于生产具有改进表面光洁度的三维结构
公开(公告)号：US20090084756A1
公开(公告)日：2009-04-02
申请号：US12242802
申请日：2008-09-30
申请人： Adam L. Cohen , Dennis R. Smalley
发明人： Adam L. Cohen , Dennis R. Smalley
IPC分类号： C23F1/00 , C25D5/02
CPC分类号： C25D5/02 , B81C1/00373 , B81C2201/019 , C23F1/00 , C25D1/003 , H01P11/003
摘要： An electrochemical fabrication process produces three-dimensional structures (e.g. components or devices) from a plurality of layers of deposited materials wherein the formation of at least some portions of some layers are produced by operations that remove material or condition selected surfaces of a deposited material. In some embodiments, removal or conditioning operations are varied between layers or between different portions of a layer such that different surface qualities are obtained. In other embodiments varying surface quality may be obtained without varying removal or conditioning operations but instead by relying on differential interaction between removal or conditioning operations and different materials encountered by these operations.
摘要翻译：电化学制造工艺从多个沉积材料层产生三维结构（例如组件或器件），其中通过去除沉积材料的选定表面的材料或条件的操作产生一些层的至少一些部分的形成。在一些实施例中，去除或调节操作在层之间或层的不同部分之间变化，使得获得不同的表面质量。在其它实施例中，可以在不改变去除或调节操作的情况下获得变化的表面质量，而是通过依赖于去除或调节操作与这些操作遇到的不同材料之间的差异相互作用。

89. 发明申请

US20080230392A1 Non-Conformable Masks and Methods and Apparatus for Forming Three-Dimensional Structures 审中-公开
标题翻译：不适合的面罩和形成三维结构的方法和装置
公开(公告)号：US20080230392A1
公开(公告)日：2008-09-25
申请号：US12055188
申请日：2008-03-25
申请人： Adam L. Cohen , Dennis R. Smalley
发明人： Adam L. Cohen , Dennis R. Smalley
IPC分类号： C25D5/02
CPC分类号： B81C1/00182 , B33Y10/00
摘要： Electrochemical Fabrication techniques are used to modify substrates or to form multilayer structures (e.g. components or devices) from a plurality of overlaying and adhered layers. Masks are used to selectively etch or deposit material. Some masks may be of the contact type and may be formed of multiple materials some of which may be support materials, some of which may be mating materials for contacting a substrate and some may be intermediate materials. In some embodiments the contact masks may have conformable contact surfaces (i.e. surfaces with sufficient flexibility or deformability that they can substantially conform to surface of the substrate to form a seal with it) or they may have semi-rigid or even rigid surfaces. In embodiments where masks are used for selective deposition operations, etching operations may be performed after deposition to remove flash deposits (thin undesired deposits from areas that were intended to be masked).
摘要翻译：电化学制造技术用于修饰衬底或从多个覆盖和粘附层形成多层结构（例如组件或器件）。掩模用于选择性地蚀刻或沉积材料。一些掩模可以是接触型并且可以由多种材料形成，其中一些可以是支撑材料，其中一些可以是用于接触基底的配合材料，一些可以是中间材料。在一些实施例中，接触掩模可以具有适形的接触表面（即具有足够的柔性或可变形性的表面，使得它们可以基本上符合基底的表面以与其形成密封），或者它们可以具有半刚性或甚至刚性的表面。在掩模用于选择性沉积操作的实施例中，可以在沉积之后执行蚀刻操作以去除闪蒸沉积物（来自旨在被掩蔽的区域的不希望的沉积物）。

90. 发明授权

US07384530B2 Methods for electrochemically fabricating multi-layer structures including regions incorporating maskless, patterned, multiple layer thickness depositions of selected materials 有权
标题翻译：用于电化学制造多层结构的方法，包括掺入所选材料的无掩模，图案化，多层厚度沉积的区域
公开(公告)号：US07384530B2
公开(公告)日：2008-06-10
申请号：US10841001
申请日：2004-05-07
申请人： Adam L. Cohen , Dennis R. Smalley
发明人： Adam L. Cohen , Dennis R. Smalley
IPC分类号： C25D5/02 , C25D5/48
CPC分类号： B81C1/00126 , B33Y10/00 , B81B2201/042 , B81C1/00396 , B81C2201/032 , G01P15/0802 , G01P15/125 , H01P1/202 , H01P3/06 , H01P5/183 , H01P11/00 , H01P11/005 , H05K3/4647
摘要： The invention includes methods of fabrication and apparatuses. In at least some embodiments of the applicants' invention, the methods include processes of: maskless selective deposition of non-layered structures, selective etching and/or deposition without use of a separate mask and/or lithography techniques, retaining selected portions of sacrificial material during removal (e.g. etching) of other portions of sacrificial material, depositing materials other than the structural and sacrificial materials, including more than one type of structural and/or sacrificial material, and fabrication of interlacing elements. Embodiments of the methods of the invention provide increased capabilities, properties, flexibility and in the fabrication of three-dimensional structures by electro-deposition or other techniques. In certain embodiments, the apparatuses of the invention include structures having non-layered elements, retained sacrificial materials, three or more different deposited materials, and interlaced elements.
摘要翻译：本发明包括制造方法和装置。在申请人的发明的至少一些实施例中，所述方法包括以下过程：无掩模地选择性沉积非分层结构，选择性蚀刻和/或沉积，而不使用单独的掩模和/或光刻技术，保留牺牲材料的选定部分在牺牲材料的其它部分的去除（例如蚀刻）期间，沉积除结构和牺牲材料之外的材料，包括多于一种类型的结构和/或牺牲材料，以及制造隔行元件。本发明的方法的实施例通过电沉积或其他技术提供增强的能力，性质，柔性和制造三维结构。在某些实施例中，本发明的装置包括具有非层状元件，保留的牺牲材料，三种或更多种不同沉积材料和隔行元件的结构。

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