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热词
    • 88. 发明授权
    • Method of manufacturing a coin detector
    • 制造硬币检测器的方法
    • US5575057A
    • 1996-11-19
    • US410066
    • 1995-03-24
    • Thomas Seitz
    • Thomas Seitz
    • G07D5/08G07F1/04H01F17/00H01F41/02
    • G07D5/08G07D5/02Y10T29/4902
    • Coin detector may be manufactured in several steps. An integrated circuit board (ICB) having conductive material on its surface is covered with an etching mask where conductive elements are to be located. The unmasked portion of the ICB surface is etched off, and then the etching mask is removed. The ICB substrate is attached with a detector circuit located on an etched portion of the ICB surface. An oscillator circuit is connected to a conductive coil. If the coin detector uses a two-layer coil, the coils are connected by a through-going board. The structure is encased in a synthetic material.
    • 硬币检测器可以在几个步骤中制造。 在其表面上具有导电材料的集成电路板(ICB)被要被定位导电元件的蚀刻掩模覆盖。 蚀刻掉ICB表面的未屏蔽部分,然后去除蚀刻掩模。 ICB衬底附接有位于ICB表面的蚀刻部分上的检测器电路。 振荡电路连接到导电线圈。 如果硬币检测器使用双层线圈,则线圈通过贯穿板连接。 结构被包裹在合成材料中。