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    • 88. 发明授权
    • Small molecular thiophene compound
    • 小分子噻吩化合物
    • US07700787B2
    • 2010-04-20
    • US11927871
    • 2007-10-30
    • Beng S OngPing LiuMaria BirauYiliang Wu
    • Beng S OngPing LiuMaria BirauYiliang Wu
    • C07D409/14
    • H01L51/0036H01L51/0052H01L51/0068H01L51/0541H01L51/0545Y10T428/31504
    • A small molecular thiophene compound consisting of a plurality of thiophene units, each thiophene unit being represented by structure (A) wherein each thiophene unit is bonded at either or both of the second ring position and the fifth ring position, wherein m is 0, 1, or 2, wherein each thiophene unit is the same or different from each other in terms of substituent number, substituent identity, and substituent position, wherein each R1 is independently selected from the group consisting of: (a) a hydrocarbon group, (b) a heteroatom containing group, and (c) a halogen, wherein there is at least one thiophene unit where R1 is present at the third ring position or the fourth ring position, or at both the third ring position and the fourth ring position, wherein for any two adjacent thiophene units as represented by structure (A1): there is excluded the simultaneous presence of the same or different R1 at the 3-position of one thiophene unit and at the 3′-position of the other thiophene unit wherein R1 is not part of a cyclic ring structure fused to the thiophene unit.
    • 由多个噻吩单元组成的小分子噻吩化合物,每个噻吩单元由结构(A)表示,其中每个噻吩单元在第二环位置和第五环位置的一个或两个上键合,其中m为0,1 或2,其中每个噻吩单元根据取代基号,取代基同一性和取代基位置彼此相同或不同,其中每个R 1独立地选自:(a)烃基,(b )含有杂原子的基团,和(c)卤素,其中存在至少一个噻吩单元,其中R 1存在于第三环位置或第四环位置,或者位于第三环位置和第四环位置,其中 对于由结构(A1)表示的任何两个相邻的噻吩单元:不排除在一个噻吩单元的3位和在另一个噻吩的3'-位上同时存在相同或不同的R 1 单元,其中R1不是与噻吩单元稠合的环状结构的一部分。
    • 90. 发明授权
    • TFT fabrication process
    • TFT制造工艺
    • US07553706B2
    • 2009-06-30
    • US11276634
    • 2006-03-08
    • Ping LiuYiliang WuBeng S Ong
    • Ping LiuYiliang WuBeng S Ong
    • H01L21/00
    • H01L29/513H01L51/0036H01L51/0097H01L51/052H01L51/0529H01L51/0537H01L51/0541H01L51/0545
    • A process for fabricating a thin film transistor including: (a) depositing a semiconductor layer; and (b) depositing a multilayer gate dielectric prior to or subsequent to the depositing the semiconductor layer, wherein the multilayer dielectric comprises: (i) a first layer comprising a first material selected from the group consisting of an optionally substituted silsesquioxane, an optionally substituted silsesquioxane-metal oxide hybrid composition, an optionally substituted siloxane-metal oxide hybrid composition, and a mixture thereof, and (ii) a second layer in contact with the first layer, wherein the second layer comprises a second material, wherein the first layer is closer to the semiconductor layer than the second layer.
    • 一种制造薄膜晶体管的方法,包括:(a)沉积半导体层; 以及(b)在沉积半导体层之前或之后沉积多层栅极电介质,其中所述多层电介质包括:(i)第一层,其包含选自任选取代的倍半硅氧烷,任选取代的第一材料 倍半硅氧烷 - 金属氧化物杂化组合物,任选取代的硅氧烷 - 金属氧化物杂化组合物及其混合物,和(ii)与第一层接触的第二层,其中第二层包括第二材料,其中第一层为 比第二层更靠近半导体层。