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    • 82. 发明申请
    • Single Gate Inverter Nanowire Mesh
    • 单门逆变器纳米线网
    • US20100295021A1
    • 2010-11-25
    • US12470128
    • 2009-05-21
    • Josephine ChangPaul ChangMichael A. GuillornJeffrey Sleight
    • Josephine ChangPaul ChangMichael A. GuillornJeffrey Sleight
    • H01L29/15H01L21/336H01L27/12
    • H01L27/1203H01L27/092H01L29/0673H01L29/42392H01L29/78696Y10S977/762Y10S977/938
    • Nanowire-based devices are provided. In one aspect, a field-effect transistor (FET) inverter is provided. The FET inverter includes a plurality of device layers oriented vertically in a stack, each device layer having a source region, a drain region and a plurality of nanowire channels connecting the source region and the drain region, wherein the source and drain regions of one or more of the device layers are doped with an n-type dopant and the source and drain regions of one or more other of the device layers are doped with a p-type dopant; a gate common to each of the device layers surrounding the nanowire channels; a first contact to the source regions of the one or more device layers doped with an n-type dopant; a second contact to the source regions of the one or more device layers doped with a p-type dopant; and a third contact common to the drain regions of each of the device layers. Techniques for fabricating a FET inverter are also provided.
    • 提供基于纳米线的设备。 一方面,提供了场效应晶体管(FET)逆变器。 FET反相器包括在堆叠中垂直取向的多个器件层,每个器件层具有源极区,漏极区和连接源极区和漏极区的多个纳米线通道,其中一个或多个 更多的器件层掺杂有n型掺杂剂,并且器件层中的一个或多个其它器件层的源极和漏极区掺杂有p型掺杂剂; 围绕纳米线通道的每个器件层共用的栅极; 与掺杂有n型掺杂剂的一个或多个器件层的源极区的第一接触; 与掺杂有p型掺杂剂的一个或多个器件层的源极区的第二接触; 以及每个器件层的漏极区域共同的第三接触。 还提供了用于制造FET逆变器的技术。
    • 89. 发明授权
    • Compressive (PFET) and tensile (NFET) channel strain in nanowire FETs fabricated with a replacement gate process
    • 用替代栅极工艺制造的纳米线FET中的压电(PFET)和拉伸(NFET)沟道应变
    • US08492208B1
    • 2013-07-23
    • US13344352
    • 2012-01-05
    • Guy CohenMichael A. GuillornConal Eugene Murray
    • Guy CohenMichael A. GuillornConal Eugene Murray
    • H01L21/00H01L29/76
    • H01L29/775B82Y10/00B82Y40/00H01L29/66439
    • A method of fabricating a FET device is provided which includes the following steps. Nanowires/pads are formed in a SOI layer over a BOX layer, wherein the nanowires are suspended over the BOX. A HSQ layer is deposited that surrounds the nanowires. A portion(s) of the HSQ layer that surround the nanowires are cross-linked, wherein the cross-linking causes the portion(s) of the HSQ layer to shrink thereby inducing strain in the nanowires. One or more gates are formed that retain the strain induced in the nanowires. A FET device is also provided wherein each of the nanowires has a first region(s) that is deformed such that a lattice constant in the first region(s) is less than a relaxed lattice constant of the nanowires and a second region(s) that is deformed such that a lattice constant in the second region(s) is greater than the relaxed lattice constant of the nanowires.
    • 提供一种制造FET器件的方法,其包括以下步骤。 纳米线/焊盘形成在BOX层上的SOI层中,其中纳米线悬挂在BOX上。 沉积围绕纳米线的HSQ层。 围绕纳米线的HSQ层的一部分交联,其中交联导致HSQ层的一部分收缩,从而诱导纳米线中的应变。 形成一个或多个保持在纳米线中诱发的应变的栅极。 还提供了一种FET器件,其中每个纳米线具有变形的第一区域,使得第一区域中的晶格常数小于纳米线的松弛晶格常数和第二区域, 其变形使得第二区域中的晶格常数大于纳米线的松弛晶格常数。