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81. 发明授权

US09614454B2 Power conversion device with reduced wiring distance 有权
公开(公告)号：US09614454B2
公开(公告)日：2017-04-04
申请号：US14122413
申请日：2012-05-07
申请人： Hironori Koyano , Takamasa Nakamura , Masao Saito , Kouji Yamamoto , Tsutomu Matsukawa , Manabu Koshijo , Junichi Itoh , Yoshiya Ohnuma
发明人： Hironori Koyano , Takamasa Nakamura , Masao Saito , Kouji Yamamoto , Tsutomu Matsukawa , Manabu Koshijo , Junichi Itoh , Yoshiya Ohnuma
IPC分类号： H02M5/293 , H02M7/00 , H05K7/14 , H02M5/297 , H02M1/42
CPC分类号： H02M5/293 , H02M1/4258 , H02M5/297 , H02M7/003 , H05K7/1432 , Y02B70/126
摘要： Provided is a power converter 3 that directly converts polyphase AC power to AC power. A converter circuit has a plurality of switching elements 311, 313, 315, 312, 314 and 316 which are connected to each phase R, S or T of the polyphase AC power to enable switching for turning on current-carrying bidirectionally. At least three condensers 821 to 826 are provided between phases of the converter circuit. The three condensers are respectively placed at apexes of a triangle on a plane that is in parallel with a part-mounting surface on which the switching elements are actually mounted. The wiring distance between the condensers and the switching elements can be shortened.

82. 发明授权

US09203325B2 Power conversion device 有权
标题翻译：电源转换装置
公开(公告)号：US09203325B2
公开(公告)日：2015-12-01
申请号：US14342858
申请日：2012-09-06
申请人： Masao Saito , Takamasa Nakamura , Kouji Yamamoto , Junichi Itoh , Yoshiya Ohnuma
发明人： Masao Saito , Takamasa Nakamura , Kouji Yamamoto , Junichi Itoh , Yoshiya Ohnuma
IPC分类号： H02M5/458 , H02M5/293 , H02M7/217
CPC分类号： H02M5/458 , H02M5/293 , H02M7/217
摘要： An electric power conversion device comprises a conversion circuit having bi-directionally switchable plural pairs of switching elements connected to respective phases and converting an inputted AC power into an AC electric power. A first switching time is calculated using detected voltages detected by voltage sensors and an output command value. A second switching time is calculated using a carrier and the first switching time. A control signal generating section generates control signals to switch on and off of the switching elements using the first switching time and second switching time. In a case where a state is transited from the first switching time to the second switching time, a controller turns off one of on a state switching elements of either one of an upper arm circuit or a lower arm circuit and maintains on state of the other of the on state switching elements of the other arm circuit.
摘要翻译：电力转换装置包括具有双向可切换的多对开关元件的转换电路，其连接到各相，并将输入的AC电力转换成AC电力。使用由电压传感器检测的检测电压和输出指令值来计算第一切换时间。使用载波和第一切换时间计算第二切换时间。控制信号生成部使用第一切换时间和第二切换时间来生成开关元件的接通和断开的控制信号。在状态从第一切换时间转移到第二切换时间的情况下，控制器关闭上臂电路或下臂电路中的任一个的状态切换元件中的一个，并保持其他状态的另一臂电路的导通状态开关元件。

83. 发明申请

US20140226386A1 POWER CONVERSION DEVICE 有权
标题翻译：电源转换器件
公开(公告)号：US20140226386A1
公开(公告)日：2014-08-14
申请号：US14342878
申请日：2012-09-06
申请人： Masao Saito , Takamasa Nakamura , Kouji Yamamoto , Junichi Itoh , Yoshiya Ohnuma
发明人： Masao Saito , Takamasa Nakamura , Kouji Yamamoto , Junichi Itoh , Yoshiya Ohnuma
IPC分类号： H02M5/297
CPC分类号： H02M5/297 , H02M5/293 , H02M7/217
摘要： An electric power conversion device comprises a conversion circuit having bi-directionally switchable plural pairs of switching elements connected to respective phases and converting an inputted AC power into an AC electric power. A first switching time is calculated using detected voltages detected by voltage sensors and an output command value. A second switching time is calculated in a form of a time which is a subtraction of the first switching time from a half period of a carrier and, using this time, control signals to switch on and off of the switching elements are generated.
摘要翻译：电力转换装置包括具有双向可切换的多对开关元件的转换电路，其连接到各相，并将输入的AC电力转换成AC电力。使用由电压传感器检测的检测电压和输出指令值来计算第一切换时间。以从载波的半个周期减去第一切换时间的时间的形式计算第二切换时间，并且使用此时产生开关元件的接通和断开的控制信号。

84. 发明申请

US20140085950A1 POWER CONVERSION DEVICE 有权
标题翻译：电源转换器件
公开(公告)号：US20140085950A1
公开(公告)日：2014-03-27
申请号：US14122268
申请日：2012-05-07
申请人： Hironori Koyano , Takamasa Nakamura , Masao Saito , Kouji Yamamoto , Tsutomu Matsukawa , Manabu Koshijo , Junichi Itoh , Yoshiya Ohnuma
发明人： Hironori Koyano , Takamasa Nakamura , Masao Saito , Kouji Yamamoto , Tsutomu Matsukawa , Manabu Koshijo , Junichi Itoh , Yoshiya Ohnuma
IPC分类号： H02M5/00
CPC分类号： H02M5/00 , H02M1/4258 , H02M5/293 , H02M7/003 , H05K7/1432 , Y02B70/126
摘要： Provided is a power converter 3 that directly converts polyphase AC power to AC power. A converter circuit has a plurality of first switching elements 311, 313 and 315 and a plurality of second switching elements 312, 314 and 316, both of which are connected to each phase R, S or T of the polyphase AC power to enable switching for turning on current-carrying bidirectionally. Condensers 821 to 826 are provided between phases. Input terminals of the first switching elements and those of the second switching elements are arranged to form respective lines. Some of the plurality of condensers 821 and 822 are arranged to be angled relative to the arrangement direction of the terminals. The wiring distance between the condensers and the switching elements can be shortened.
摘要翻译：提供了将多相交流电力直接转换为交流电力的电力转换器3。 A转换器电路具有多个第一开关元件311,313和315以及多个第二开关元件312,314和316，两个第二开关元件312,314和316都连接到多相AC电源的每相R，S或T，以使得能够切换打开电流双向。在相间设置冷凝器821〜826。第一开关元件和第二开关元件的输入端子被配置成形成相应的线。多个冷凝器821和822中的一些被布置成相对于端子的排列方向成一定角度。可以缩短电容器与开关元件之间的布线距离。

85. 发明申请

US20120301769A1 POWER SOURCE APPARATUS TO SUPPLY ELECTRIC POWER AND VEHICLE EQUIPPED WITH THE POWER SOURCE APPARATUS 审中-公开
标题翻译：供电电源的电源装置和配备电源设备的车辆
公开(公告)号：US20120301769A1
公开(公告)日：2012-11-29
申请号：US13479802
申请日：2012-05-24
申请人： Wataru OKADA , Masao Saito
发明人： Wataru OKADA , Masao Saito
IPC分类号： H01M10/50
CPC分类号： H01M2/1077 , H01M10/625 , H01M10/647 , H01M10/653 , H01M10/6554 , H01M10/6568
摘要： The power source apparatus to supply electric power is provided with a battery block 3 having a plurality of rectangular batteries 1 disposed in a stacked configuration with conducting external cases 11 insulated by insulating layers 2, a cooling plate 4 disposed at the bottom of the battery block 3 in a manner that thermally couples with each rectangular battery 1 and forcibly cools each battery 1 from its bottom surface, and a cooling mechanism 5 that cools the cooling plate 4. The insulating layers 2 are formed as a unit with each external case 11 and have a fit-together structure that enables stacking in fixed positions. Each rectangular battery 1 and insulating layers 2 form a single-piece battery module 10, and a battery block 3 is made up of a plurality of stacked battery modules 10.
摘要翻译：提供电力的电源装置设置有电池块3，电池块3具有多个矩形电池1，该矩形电池1以层叠形式设置，导电外壳11由绝缘层2绝缘，冷却板4设置在电池块的底部 3以与每个矩形电池1热耦合并且从其底面强制冷却每个电池1的方式，以及冷却冷却板4的冷却机构5.绝缘层2形成为与每个外部壳体11和具有能够在固定位置堆叠的配合结构。每个矩形电池1和绝缘层2形成单件电池模块10，并且电池块3由多个堆叠的电池模块10组成。

86. 发明申请

US20120229985A1 SEMICONDUCTOR DEVICE 有权
标题翻译：半导体器件
公开(公告)号：US20120229985A1
公开(公告)日：2012-09-13
申请号：US13479032
申请日：2012-05-23
申请人： Keiji Okumura , Takukazu Otsuka , Masao Saito
发明人： Keiji Okumura , Takukazu Otsuka , Masao Saito
IPC分类号： H05K7/20
CPC分类号： H02M7/003 , H01L25/162 , H01L25/18 , H01L2224/45124 , H01L2224/48091 , H01L2924/01019 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/30107 , H05K1/14 , H05K7/02 , H05K7/20509 , H01L2924/00014 , H01L2924/00
摘要： A semiconductor device includes: a first output unit configured to output a first phase; a second output unit configured to output a second phase different from the first phase, the second output unit being disposed to be stacked on the first output unit; and a controller configured to control the output units.
摘要翻译：半导体器件包括：第一输出单元，被配置为输出第一相位; 第二输出单元，被配置为输出与所述第一相不同的第二相，所述第二输出单元被布置为堆叠在所述第一输出单元上; 以及控制器，被配置为控制所述输出单元。

87. 发明授权

US08208260B2 Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：US08208260B2
公开(公告)日：2012-06-26
申请号：US12954451
申请日：2010-11-24
申请人： Keiji Okumura , Takukazu Otsuka , Masao Saito
发明人： Keiji Okumura , Takukazu Otsuka , Masao Saito
IPC分类号： H05K7/20
CPC分类号： H02M7/003 , H01L25/162 , H01L25/18 , H01L2224/45124 , H01L2224/48091 , H01L2924/01019 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/30107 , H05K1/14 , H05K7/02 , H05K7/20509 , H01L2924/00014 , H01L2924/00
摘要： A semiconductor device includes: a first output unit configured to output a first phase; a second output unit configured to output a second phase different from the first phase, the second output unit being disposed to be stacked on the first output unit; and a controller configured to control the output units.
摘要翻译：半导体器件包括：第一输出单元，被配置为输出第一相位; 第二输出单元，被配置为输出与所述第一相不同的第二相，所述第二输出单元被布置为堆叠在所述第一输出单元上; 以及控制器，被配置为控制所述输出单元。

88. 发明申请

US20120058590A1 METHOD FOR MANUFACTURING SOLAR CELL MODULE 有权
标题翻译：制造太阳能电池模块的方法
公开(公告)号：US20120058590A1
公开(公告)日：2012-03-08
申请号：US13319396
申请日：2010-05-14
申请人： Hideaki Okumiya , Satoshi Yamamoto , Masao Saito
发明人： Hideaki Okumiya , Satoshi Yamamoto , Masao Saito
IPC分类号： H01L31/18
CPC分类号： H01L31/188 , B32B17/10018 , B32B17/10788 , B32B17/10871 , H01L31/02008 , H01L31/048 , H01L31/0512 , Y02E10/50
摘要： In manufacturing of a solar cell module in which a solar cell having a surface electrode to which a tab lead is connected is sealed with a resin, the step of connecting the tab lead and the step of sealing the solar cell with the resin are performed simultaneously at a relatively low temperature that is used for the resin sealing step. To perform these steps simultaneously, the solar cell having the surface electrode to which the tab lead is connected with an adhesive is resin-sealed using a vacuum laminator to manufacture the solar cell module. The vacuum laminator used includes a first chamber and a second chamber partitioned by a flexible sheet. The internal pressures of these chambers can be controlled independently, and a heating stage for heating is provided in the second chamber.
摘要翻译：在其中用树脂密封具有连接有引线的表面电极的太阳能电池的太阳能电池模块的制造中，同时执行连接片状引线的步骤和用树脂密封太阳能电池的步骤在用于树脂密封步骤的较低温度下。为了同时执行这些步骤，使用真空层压机对具有突片引线与粘合剂连接的表面电极的太阳能电池进行树脂密封以制造太阳能电池模块。使用的真空层压机包括由柔性片分隔开的第一室和第二室。可以独立地控制这些室的内部压力，并且在第二室中设置用于加热的加热阶段。

89. 发明申请

US20100265664A1 Semiconductor Device 有权
标题翻译：半导体器件
公开(公告)号：US20100265664A1
公开(公告)日：2010-10-21
申请号：US12826334
申请日：2010-06-29
申请人： Keiji Okumura , Takukazu Otsuka , Masao Saito
发明人： Keiji Okumura , Takukazu Otsuka , Masao Saito
IPC分类号： H05K7/20
CPC分类号： H02M7/003 , H01L25/162 , H01L25/18 , H01L2224/45124 , H01L2224/48091 , H01L2924/01019 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/30107 , H05K1/14 , H05K7/02 , H05K7/20509 , H01L2924/00014 , H01L2924/00
摘要： A semiconductor device includes: a first output unit configured to output a first phase; a second output unit configured to output a second phase different from the first phase, the second output unit being disposed to be stacked on the first output unit; and a controller configured to control the output units.
摘要翻译：半导体器件包括：第一输出单元，被配置为输出第一相位; 第二输出单元，被配置为输出与所述第一相不同的第二相，所述第二输出单元被布置为堆叠在所述第一输出单元上; 以及控制器，被配置为控制所述输出单元。

90. 发明申请

US20100251541A1 WIRING BOARD RECEIVING PLATE, AND DEVICE AND METHOD FOR CONNECTION OF WIRING BOARD USING THE SAME 有权
标题翻译：接线板接线板，以及用于连接使用该接线板的接线板的设备和方法
公开(公告)号：US20100251541A1
公开(公告)日：2010-10-07
申请号：US12734285
申请日：2008-09-04
申请人： Masao Saito
发明人： Masao Saito
IPC分类号： H05K3/36
CPC分类号： H05K3/361 , H05K3/323 , H05K2203/0173 , H05K2203/0195 , H05K2203/0278 , Y10T29/49126 , Y10T29/4913 , Y10T29/49144 , Y10T29/5317
摘要： Connection with an ACF is realized relative to a wiring board having an electronic component mounted on the rear surface thereof with high connection reliability and uniform thermal compression bonding. A thermal compression bonding head 12 is used to apply pressure to flexible printed circuit boards 4 and 5 relative to a motherboard substrate 1 having an electronic component 6 mounted thereon and heat an anisotropic conductive film, thereby connecting the motherboard substrate 1 with the ACF to the flexible printed circuit boards 4 and 5 that are connecting members. At this time, in a state in which a receiving plate 13 made of an elastic material, such as silicone rubber, and provided at a mounting position of the electronic component 6 of the motherboard substrate 1 with a concave portion 13a corresponding in shape to the electronic component 6 supports thereon the rear surface of the motherboard substrate 1, the thermal compression bonding is performed.
摘要翻译：与ACF的连接相对于具有安装在其后表面上的电子部件的布线板实现，具有高连接可靠性和均匀的热压接合。使用热压接头12相对于具有安装在其上的电子部件6的母板基板1对柔性印刷电路板4和5施加压力，并加热各向异性导电膜，从而将母板基板1与ACF连接到作为连接构件的柔性印刷电路板4和5。此时，在由主体基板1的电子部件6的安装位置设置有由弹性材料制成的接收板13，例如硅橡胶的状态下，在主板基板1的电子部件6的安装位置，电子部件6在其上支撑母板基板1的背面，进行热压接。

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