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    • 84. 发明申请
    • Manufacturing method for wiring
    • 接线方法
    • US20070167023A1
    • 2007-07-19
    • US11715468
    • 2007-03-08
    • Shunpei YamazakiHideaki Kuwabara
    • Shunpei YamazakiHideaki Kuwabara
    • C23F1/00H01L21/302H01L21/461
    • H01L21/32139C23C16/45589C23C16/509C23C16/54H01J2237/3342H01L21/2855H01L21/28562H01L21/312H01L21/76802H01L21/76838H01L27/124H01L27/1288H01L27/3246H01L51/0017H01L51/0022H01L51/5206H01L51/56
    • In the case in which a film for a resist is formed by spin coating, there is a resist material to be wasted, and the process of edge cleaning is added as required. Further, when a thin film is formed on a substrate using a vacuum apparatus, a special apparatus or equipment to evacuate the inside of a chamber vacuum is necessary, which increases manufacturing cost. The invention is characterized by including: a step of forming conductive layers on a substrate having a dielectric surface in a selective manner with a CVD method, an evaporation method, or a sputtering method; a step of discharging a compound to form resist masks so as to come into contact with the conductive layer; a step of etching the conductive layers with plasma generating means using the resist masks under the atmospheric pressure or a pressure close to the atmospheric pressure; and a step of ashing the resist masks with the plasma generating means under the atmospheric pressure or a pressure close to the atmospheric pressure. With the above-mentioned characteristics, efficiency in use of a material is improved, and a reduction in manufacturing cost is realized.
    • 在通过旋涂形成抗蚀剂用膜的情况下,存在要浪费的抗蚀剂材料,根据需要添加边缘清洁处理。 此外,当使用真空装置在基板上形成薄膜时,需要用于抽真空室内的专用装置或设备,这增加了制造成本。 本发明的特征在于包括:通过CVD法,蒸发法或溅射法以选择性方式在具有电介质表面的基板上形成导电层的步骤; 将化合物排出以形成抗蚀剂掩模以与导电层接触的步骤; 在大气压或接近大气压的压力下使用抗蚀剂掩模的等离子体发生装置蚀刻导电层的步骤; 以及在大气压或接近大气压的压力下用等离子体产生装置对抗蚀剂掩模进行灰化的步骤。 利用上述特征,提高了材料的使用效率,实现了制造成本的降低。