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81. 外观设计

USD549189S1 Dicing die-bonding film 有权
标题翻译：切片芯片接合薄膜
公开(公告)号：USD549189S1
公开(公告)日：2007-08-21
申请号：US29225423
申请日：2005-03-16
申请人： Sadahito Misumi , Takeshi Matsumura
设计人： Sadahito Misumi , Takeshi Matsumura

82. 发明申请

US20070143877A1 Plant virus vector 有权
标题翻译：植物病毒载体
公开(公告)号：US20070143877A1
公开(公告)日：2007-06-21
申请号：US10562227
申请日：2004-06-25
申请人： Chikara Masuta , Takeshi Matsumura , Noriko Itchoda
发明人： Chikara Masuta , Takeshi Matsumura , Noriko Itchoda
IPC分类号： A01H1/00 , C12N7/00
CPC分类号： C12N15/8203
摘要： A novel plant virus vector and a method of gene expression into plants are provided, and the present invention relates to a plant virus vector characterized in that a part of the sequence of the 2b region of the RNA2 molecule of the Cucumber mosaic virus (CMV) is deleted; the aforementioned plant virus vector characterized in that the region from the StuI site to the stop codon of the 2b ORF of pCY2, which is an infectious clone of CMV-Y RNA2, is deleted; and a method of gene expression in plants characterized in that a foreign gene is introduced so as to be stably expressed in a plant using the genetic recombinant. This vector is useful as a plant RNA vector for causing stable expression of foreign genes.
摘要翻译：提供了一种新型植物病毒载体和植物基因表达方法，本发明涉及植物病毒载体，其特征在于黄瓜花叶病毒（CMV）的RNA2分子的2b区的一部分序列，被删除上述植物病毒载体的特征在于缺失了作为CMV-Y RNA2的感染性克隆的pCY2的2b ORF的StuI位点至终止密码子的区域; 以及植物中的基因表达方法，其特征在于引入外源基因，以便使用遗传重组体在植物中稳定表达。该载体可用作引起外源基因稳定表达的植物RNA载体。

83. 发明申请

US20070112270A1 Ultrasonic imaging apparatus 失效
标题翻译：超声波成像装置
公开(公告)号：US20070112270A1
公开(公告)日：2007-05-17
申请号：US10580100
申请日：2004-11-11
申请人： Kouji Waki , Takashi Osaka , Mitsuaki Ito , Takeshi Matsumura , Naoyuki Murayama , Takashi Kashiwagi
发明人： Kouji Waki , Takashi Osaka , Mitsuaki Ito , Takeshi Matsumura , Naoyuki Murayama , Takashi Kashiwagi
IPC分类号： A61B8/00
CPC分类号： A61B8/485 , A61B8/08 , A61B8/14
摘要： An ultrasonic imaging apparatus according to the present invention includes an ultrasonic probe (2) for receiving and transmitting ultrasonic waves from/to an object (1), ultrasound image structuring means (6) for generating an ultrasound image from a reflected echo signal received by the ultrasonic probe, elastic image structuring means (7) for obtaining a physical quantity of the elasticity of a region of the object corresponding to the ultrasound image from the reflected echo signal and generating a color elastic image, display means (9) for overlaying the ultrasound image to the color elastic image, or arranging the ultrasound image and the color elastic input means (17) for variably setting a corresponding relationship between a hue of the color elastic image and the level of the physical quantity displayed on the screen. The level of the elasticity, such as the strain of each region in the tissue or an elastic modulus, is displayed with colors in accordance with the interest of the examiner, thus improving the convenience of use.
摘要翻译：根据本发明的超声波成像装置包括：用于从物体（1）接收和发射超声波的超声波探头（2），用于从由下列部件接收的反射回波信号产生超声波图像的超声波图像结构装置（6）超声波探头，用于从反射回波信号中获得与超声波图像对应的物体的区域的弹性的物理量并产生彩色弹性图像的弹性图像构造装置（7），用于将所述超声波探头超声图像或颜色弹性图像的布置，或者布置超声图像和颜色弹性输入装置，用于可变地设置彩色弹性图像的色调和屏幕上显示的物理量的水平之间的对应关系。根据检查者的兴趣，以颜色显示弹性水平，例如组织中每个区域的应变或弹性模量，从而提高使用的便利性。

84. 发明授权

US06972514B2 Low-pressure mercury vapor discharge lamp with improved heat dissipation, and manufacturing method therefore 失效
标题翻译：具有改善散热性能的低压汞蒸汽放电灯及其制造方法
公开(公告)号：US06972514B2
公开(公告)日：2005-12-06
申请号：US10247125
申请日：2002-09-19
申请人： Kenji Itaya , Takeshi Matsumura , Yoshinori Kakuno
发明人： Kenji Itaya , Takeshi Matsumura , Yoshinori Kakuno
IPC分类号： F21S2/00 , F21Y103/025 , H01J5/48 , H01J5/50 , H01J9/24 , H01J61/30 , H01J5/54
CPC分类号： H01J9/247 , F21V17/101 , F21V31/03 , H01J5/48 , H01J5/50
摘要： A bulb-type fluorescent lamp has a case having an open end portion for housing a lighting circuit therein, an arc tube extending outside through the open end portion of the case, and a globe having an open end portion for housing the arc tube therein. An adhesive is supplied to the inner surface of the open end portion of the case at four circumferentially spaced areas, and the open end portion of the globe is inserted into the open end portion of the case. As a result, the globe is fixed to the case with the adhesive.
摘要翻译：灯泡式荧光灯具有壳体，其具有用于容纳照明电路的开口端部，通过壳体的开口端部向外延伸的电弧管，以及具有用于将电弧管容纳在其中的开口端部的灯泡。在四个周向间隔的区域处，在壳体的开口端部的内表面提供粘合剂，并且将球状体的开口端部插入壳体的开口端部。结果，用粘合剂将球体固定在壳体上。

85. 发明申请

US20050208736A1 Dicing die-bonding film 有权
标题翻译：切片芯片接合薄膜
公开(公告)号：US20050208736A1
公开(公告)日：2005-09-22
申请号：US11082112
申请日：2005-03-16
申请人： Takeshi Matsumura , Masaki Mizutani , Sadahito Misumi
发明人： Takeshi Matsumura , Masaki Mizutani , Sadahito Misumi
IPC分类号： C09J7/02 , C09J133/00 , C09J201/00 , H01L21/301 , H01L21/58 , H01L21/68 , H01L23/52 , H01L21/78 , H01L21/50
CPC分类号： H01L21/6836 , C09J7/20 , C09J2201/36 , C09J2201/606 , C09J2201/61 , C09J2203/326 , C09J2205/31 , C09J2433/00 , H01L24/27 , H01L24/83 , H01L2221/68327 , H01L2224/274 , H01L2224/2919 , H01L2224/8385 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01016 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01051 , H01L2924/01061 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/3025 , H01L2924/00 , H01L2924/3512
摘要： The invention relates to a dicing die-bonding film having a pressure-sensitive adhesive layer (2) on a substrate material (1) and a die-bonding adhesive layer (3) on the pressure-sensitive adhesive layer (2), wherein the adhesion of the pressure-sensitive adhesive layer (2) to the die-bonding adhesive layer (3), as determined under the conditions of a peel angle of 15° and a peel point moving rate of 2.5 mm/sec. at 23° C., is different between a region (2a) corresponding to a work attachment region (3a) and a region (2b) corresponding to a part or the whole of the other region (3b), in the die-bonding adhesive layer (3), and satisfies the following relationship: adhesion of the pressure-sensitive adhesive layer (2a)
摘要翻译：本发明涉及一种在基材（1）上具有压敏粘合剂层（2）和压敏粘合剂层（2）上的芯片粘合层（3）的切割芯片接合膜，其中在剥离角度为15°，剥离移动速度为2.5mm / sec的条件下测定粘合剂层（2）与芯片粘接层（3）的粘合性。在23℃下，在与工件附着区域（3a）相对应的区域（2a）和对应于另一区域（3b）的一部分或全部的区域（2b）之间是不同的，剥离粘合剂层（3），并且满足以下关系：粘合剂层（2a）的粘合性<粘合剂层（2b）的粘合性和粘合剂的粘合性层（2a）到芯片粘合层（3）的面积不高于2.3N / 25mm。因此，即使工作较薄，也可以提供切割/切断/芯片接合薄膜，其与切片粘合剂层一起在切割薄片时的保持性和切割的切片加工的脱模性之间的平衡优异。

86. 发明申请

US20050153129A1 Pressure-sensitive adhesive sheet, method for producing the same and method for using the same as well as a multi-layer sheet for use in the pressure-sensitive adhesive sheet and method for producing the same 审中-公开
标题翻译：压敏粘合片及其制造方法及其使用方法以及用于该压敏粘合片的多层片及其制造方法
公开(公告)号：US20050153129A1
公开(公告)日：2005-07-14
申请号：US11038147
申请日：2005-01-21
申请人： Yoshinori Yoshida , Yohei Maeno , Kouji Akazawa , Takeshi Matsumura , Tomokazu Takahashi
发明人： Yoshinori Yoshida , Yohei Maeno , Kouji Akazawa , Takeshi Matsumura , Tomokazu Takahashi
IPC分类号： B32B27/08 , C09J7/02 , H01L21/68 , B32B9/00 , B32B33/00 , B32B7/12 , B32B15/04
CPC分类号： B32B27/08 , B32B7/12 , B32B2307/748 , B32B2405/00 , C09J7/29 , C09J2201/162 , C09J2433/006 , C09J2475/006 , H01L21/6835 , H01L21/6836 , H01L2221/68327 , H01L2221/6839 , Y10T428/28 , Y10T428/2848
摘要： Disclosed is a pressure-sensitive adhesive sheet for use in processing a product such a semiconductor wafer. To provide a pressure-sensitive adhesive sheet that provides a minimized number of broken semiconductor wafers during the process of polishing them and that produces a less curl of the wafer due to the residual stress of the pressure-sensitive adhesive sheet, the pressure-sensitive adhesive sheet includes a composite film formed from a composition containing a urethane polymer and a vinyl polymer as effective components, a first film comprising a material different from that of the composite film, and a pressure-sensitive adhesive layer. It is preferable that the pressure-sensitive adhesive sheet has a modulus of 9 N/mm2 or more and 250 N/mm2 or less when an oblong piece of the pressure-sensitive adhesive sheet with a width of 20 mm is bent at a radius of curvature of 3.0 mm.
摘要翻译：公开了一种用于加工诸如半导体晶片的产品的压敏粘合片。为了提供在抛光过程中提供最小数目的破裂的半导体晶片的压敏粘合片，并且由于压敏粘合片的残余应力而使晶片产生较少的卷曲，压敏粘合剂片材包括由含有氨基甲酸酯聚合物和乙烯基聚合物作为有效成分的组合物形成的复合膜，包含不同于复合膜的材料的第一膜和压敏粘合剂层。优选的是，压力敏感粘合片的长方体压力为9N / mm 2以上且250N / mm 2以下的模量宽度为20mm的敏感性粘合片以3.0mm的曲率半径弯曲。

87. 发明申请

US20050139973A1 Dicing die-bonding film 失效
标题翻译：切片芯片接合薄膜
公开(公告)号：US20050139973A1
公开(公告)日：2005-06-30
申请号：US11012998
申请日：2004-12-15
申请人： Takeshi Matsumura , Masayuki Yamamoto
发明人： Takeshi Matsumura , Masayuki Yamamoto
IPC分类号： C09J7/02 , C09J201/00 , H01L21/301 , H01L21/52 , H01L21/58 , H01L21/66 , H01L21/68 , H01L23/544 , H01L21/44 , H01L21/48 , H01L21/50 , H01L23/02
CPC分类号： H01L21/6836 , H01L22/20 , H01L23/544 , H01L24/27 , H01L24/29 , H01L24/83 , H01L2221/68327 , H01L2223/5442 , H01L2223/54426 , H01L2223/54453 , H01L2224/274 , H01L2224/2919 , H01L2224/83191 , H01L2224/8385 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01016 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/19043 , H01L2924/3025 , H01L2924/00
摘要： A dicing die-bonding film has a supporting substrate, an adhesive layer formed on the supporting substrate, and a die-bonding adhesive layer formed on the adhesive layer, and further has a mark for recognizing the position of the die-bonding adhesive layer. It is possible to provide a dicing die-bonding film in which in the case a semiconductor wafer and the dicing die-bonding film are stuck onto each other, the position of the die-bonding adhesive layer in the film can be recognized.
摘要翻译：切割芯片接合膜具有支撑基板，形成在支撑基板上的粘合层，以及形成在粘合剂层上的芯片接合粘合剂层，并且还具有用于识别芯片粘合粘合剂层的位置的标记。可以提供一种切割芯片接合膜，其中在半导体晶片和切割芯片接合膜彼此粘合的情况下，可以识别膜中的芯片粘合粘合剂层的位置。

88. 发明申请

US20050031861A1 Re-peelable pressure-sensitive adhesive sheet 失效
标题翻译：可再剥离的压敏粘合片
公开(公告)号：US20050031861A1
公开(公告)日：2005-02-10
申请号：US10912615
申请日：2004-08-05
申请人： Takeshi Matsumura , Kouji Akazawa , Kazuyuki Kiuchi , Tomokazu Takahashi
发明人： Takeshi Matsumura , Kouji Akazawa , Kazuyuki Kiuchi , Tomokazu Takahashi
IPC分类号： B32B7/12 , C09J7/02 , C09J9/00 , C09J133/00 , C09J201/00 , H01L21/301 , H01L21/304 , H01L21/68 , H01L21/683
CPC分类号： C09J7/29 , C09J2201/162 , C09J2203/326 , Y10T156/1052 , Y10T428/1471 , Y10T428/1476 , Y10T428/28 , Y10T428/2848
摘要： The re-peelable pressure-sensitive adhesive sheet of the invention is a re-peelable pressure-sensitive adhesive sheet, which comprises an adhesive agent layer formed over a base film, and which further comprises at least one intermediate layer between the base film and the adhesive agent layer, the intermediate layer having a storage elastic modulus (G′) of 3.0×104 to 1.0×108 Pa at 23° C. and a storage elastic modulus (G′) of 1.0×103 to 8.0×104 Pa at 200° C. Even when this re-peelable pressure-sensitive adhesive sheet and a semiconductor wafer are adhered to each other and they are placed, as they are, in a heating environment, the wafer can be prevented from being warped.
摘要翻译：本发明的可再剥离粘合片是可再剥离的粘合片，其包含在基膜上形成的粘合剂层，并且还包括在基膜和粘合剂层，中间层在23℃下的储能弹性模量（G'）为3.0×10 4至1.0×10 8 Pa，储存弹性模量（G'）为1.0×10 3至在200℃下为8.0×10 4 Pa。即使这种可再剥离粘合片和半导体晶片彼此粘合并且它们被放置在加热环境中，也可以防止晶片从扭曲。

89. 发明授权

US06558019B2 Bulb-shaped fluorescent lamp 有权
公开(公告)号：US06558019B2
公开(公告)日：2003-05-06
申请号：US10075307
申请日：2002-02-15
申请人： Shiro Iida , Takeshi Matsumura , Kenji Itaya , Nobuharu Hata
发明人： Shiro Iida , Takeshi Matsumura , Kenji Itaya , Nobuharu Hata
IPC分类号： F21V2900
CPC分类号： H01J61/32 , H01J61/34 , H01J61/56 , H01J61/72
摘要： A less costly bulb-shaped fluorescent lamp with improved assembly efficiency is provided which prevents the impairment of product quality due to the change in color of a holder or the slipping off of a fluorescent tube from the holder decreased in resin strength. The fluorescent lamp includes a set of fluorescent tubes, filament coils disposed at both ends of each fluorescent tube, a starter circuit for activating the fluorescent tubes, a holder for retaining the fluorescent tubes, and a case containing the starter circuit. The holder includes holes for receiving the fluorescent tubes, and a recess defined in a central portion of the holder and extended in the opposite direction of the fluorescent tubes.

90. 发明授权

US06456001B1 Fluorescent lamp having V-shaped grooves for guiding lead wire 有权
标题翻译：荧光灯具有用于引导引线的V形槽
公开(公告)号：US06456001B1
公开(公告)日：2002-09-24
申请号：US09498226
申请日：2000-02-03
申请人： Shiro Iida , Takeshi Matsumura , Kenji Itaya , Tetsuya Tahara
发明人： Shiro Iida , Takeshi Matsumura , Kenji Itaya , Tetsuya Tahara
IPC分类号： H01J162
CPC分类号： H01J5/62
摘要： A fluorescent lamp in which a connecting terminals of a lighting circuit board and lead wires of a fluorescent tube easily can be connected. The lamp includes a fluorescent tube, a holder holding the fluorescent tube, a lighting circuit board provided with a lighting circuit for lighting the fluorescent tube, and a case connected to the holder and housing the lighting circuit board. At the end portion of the lighting circuit board, V-shaped or Y-shaped cut-outs, which widen toward an outer side, are formed. In the vicinity of the inner narrow portion of the cut-outs, the connecting terminals connected to the lighting circuit are provided. On a side wall formed on the holder opposite to the fluorescent tube, V-shaped or Y-shaped cut-outs, which widen as the distance from said fluorescent tube increases, are provided, and the broad portion of the cut-outs of the holder and the broad portion of the cut-outs of the lighting circuit board are arranged facing each other. The lead wires of the fluorescent tube are connected to the connection terminals by welding.
摘要翻译：一种荧光灯，其中可以容易地连接照明电路板的连接端子和荧光管的引线。灯包括荧光管，保持荧光管的保持器，设置有用于点亮荧光管的点亮电路的照明电路板，以及连接到保持器并容纳照明电路板的壳体。在照明电路板的端部，形成向外侧变宽的V形或Y形切口。在切口的内部狭窄部分附近，设置连接到照明电路的连接端子。在形成在与荧光管相对的保持架上的侧壁上，设置有与所述荧光管的距离变宽的V形或Y形切口，并且所述切口的大部分并且照明电路板的切口的宽部被布置为彼此面对。荧光管的引线通过焊接连接到连接端子。

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