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    • 81. 发明授权
    • CMOS imager photodiode with enhanced capacitance
    • 具有增强电容的CMOS成像光电二极管
    • US08440490B2
    • 2013-05-14
    • US13288686
    • 2011-11-03
    • James W. AdkissonJohn J. Ellis-MonaghanMark D. JaffeDale J. PearsonDennis L. Rogers
    • James W. AdkissonJohn J. Ellis-MonaghanMark D. JaffeDale J. PearsonDennis L. Rogers
    • H01L31/18
    • H01L27/14643H01L27/1463H01L27/14689H01L31/035281
    • A method for manufacturing a pixel sensor cell that includes a photosensitive element having a non-laterally disposed charge collection region. The method includes forming a trench recess in a substrate of a first conductivity type material, and filling the trench recess with a material having second conductivity type material. The second conductivity type material is then diffused out of the filled trench material to the substrate region surrounding the trench to form the non-laterally disposed charge collection region. The filled trench material is removed to provide a trench recess, and the trench recess is filled with a material having a first conductivity type material. A surface implant layer is formed at either side of the trench having a first conductivity type material. A collection region of a trench-type photosensitive element is formed of the outdiffused second conductivity type material and is isolated from the substrate surface.
    • 一种制造像素传感器单元的方法,该像素传感器单元包括具有非横向放置的电荷收集区域的感光元件。 该方法包括在第一导电类型材料的衬底中形成沟槽凹槽,并用具有第二导电类型材料的材料填充沟槽凹槽。 然后将第二导电类型材料从填充的沟槽材料扩散到围绕沟槽的衬底区域,以形成非横向布置的电荷收集区域。 去除填充的沟槽材料以提供沟槽凹槽,并且用具有第一导电类型材料的材料填充沟槽凹槽。 表面注入层形成在具有第一导电类型材料的沟槽的任一侧。 沟槽型感光元件的收集区域由向外扩散的第二导电型材料形成,并与衬底表面隔离。
    • 83. 发明申请
    • CMOS IMAGER PHOTODIODE WITH ENHANCED CAPACITANCE
    • 具有增强电容的CMOS IMAGER光电二极管
    • US20120122261A1
    • 2012-05-17
    • US13288686
    • 2011-11-03
    • James W. AdkissonJohn J. Ellis-MonaghanMark D. JaffeDale J. PearsonDennis L. Rogers
    • James W. AdkissonJohn J. Ellis-MonaghanMark D. JaffeDale J. PearsonDennis L. Rogers
    • H01L31/18
    • H01L27/14643H01L27/1463H01L27/14689H01L31/035281
    • A method for manufacturing a pixel sensor cell that includes a photosensitive element having a non-laterally disposed charge collection region. The method includes forming a trench recess in a substrate of a first conductivity type material, and filling the trench recess with a material having second conductivity type material. The second conductivity type material is then diffused out of the filled trench material to the substrate region surrounding the trench to form the non-laterally disposed charge collection region. The filled trench material is removed to provide a trench recess, and the trench recess is filled with a material having a first conductivity type material. A surface implant layer is formed at either side of the trench having a first conductivity type material. A collection region of a trench-type photosensitive element is formed of the outdiffused second conductivity type material and is isolated from the substrate surface.
    • 一种制造像素传感器单元的方法,该像素传感器单元包括具有非横向放置的电荷收集区域的感光元件。 该方法包括在第一导电类型材料的衬底中形成沟槽凹槽,并用具有第二导电类型材料的材料填充沟槽凹槽。 然后将第二导电类型材料从填充的沟槽材料扩散到围绕沟槽的衬底区域,以形成非横向布置的电荷收集区域。 去除填充的沟槽材料以提供沟槽凹槽,并且用具有第一导电类型材料的材料填充沟槽凹槽。 表面注入层形成在具有第一导电类型材料的沟槽的任一侧。 沟槽型感光元件的收集区域由向外扩散的第二导电型材料形成,并与衬底表面隔离。
    • 85. 发明授权
    • Pixel sensor having doped isolation structure sidewall
    • 具有掺杂隔离结构侧壁的像素传感器
    • US07141836B1
    • 2006-11-28
    • US10908885
    • 2005-05-31
    • James W. AdkissonMark D. JaffeRobert K. Leidy
    • James W. AdkissonMark D. JaffeRobert K. Leidy
    • H01L27/148
    • H01L27/14603H01L27/1463H01L27/14643H01L27/14683
    • A novel pixel sensor structure formed on a substrate of a first conductivity type includes a photosensitive device of a second conductivity type and a surface pinning layer of the first conductivity type. An isolation structure is formed adjacent to the photosensitive device pinning layer. The isolation structure includes a dopant region comprising material of the first conductivity type selectively formed along a sidewall of the isolation structure that is adapted to electrically couple the surface pinning layer to the underlying substrate. The corresponding method for forming the dopant region selectively formed along the sidewall of the isolation structure comprises an out-diffusion process whereby dopant materials present in a doped material layer formed along selected portions in the isolation structure are driven into the underlying substrate during an anneal. Alternately, or in conjunction, an angled ion implantation of dopant material in the isolation structure sidewall may be performed by first fabricating a photoresist layer and reducing its size by removing a corner, or a corner portion thereof, which may block the angled implant material.
    • 形成在第一导电类型的衬底上的新型像素传感器结构包括第二导电类型的光敏器件和第一导电类型的表面钉扎层。 在光敏器件钉扎层附近形成隔离结构。 隔离结构包括掺杂区域,该掺杂剂区域包括沿着隔离结构的侧壁选择性地形成的第一导电类型的材料,其适于将表面钉扎层电耦合到下面的衬底。 用于形成沿着隔离结构的侧壁选择性地形成的掺杂剂区域的相应方法包括外扩散工艺,由此在退火期间,存在于沿隔离结构中的选定部分形成的掺杂材料层中的掺杂剂材料被驱动到下面的衬底中。 替代地或结合地,隔离结构侧壁中的掺杂剂材料的成角度的离子注入可以通过首先制造光致抗蚀剂层并通过去除可能阻挡成角度的植入材料的角部或其角部来减小其尺寸来执行。
    • 86. 发明授权
    • CMOS imager photodiode with enhanced capacitance
    • 具有增强电容的CMOS成像光电二极管
    • US08106432B2
    • 2012-01-31
    • US12634898
    • 2009-12-10
    • James W. AdkissonJohn J. Ellis-MonaghanMark D. JaffeDale J. PearsonDennis L. Rogers
    • James W. AdkissonJohn J. Ellis-MonaghanMark D. JaffeDale J. PearsonDennis L. Rogers
    • H01L31/04
    • H01L27/14643H01L27/1463H01L27/14689H01L31/035281
    • A pixel sensor cell having a semiconductor substrate having a surface; a photosensitive element formed in a substrate having a non-laterally disposed charge collection region entirely isolated from a physical boundary including the substrate surface. The photosensitive element comprises a trench having sidewalls formed in the substrate of a first conductivity type material; a first doped layer of a second conductivity type material formed adjacent to at least one of the sidewalls; and a second doped layer of the first conductivity type material formed between the first doped layer and the at least one trench sidewall and formed at a surface of the substrate, the second doped layer isolating the first doped layer from the at least one trench sidewall and the substrate surface. In a further embodiment, an additional photosensitive element is provided that includes a laterally disposed charge collection region that contacts the non-laterally disposed charge collection region of the photosensitive element and underlies the doped layer formed at the substrate surface.
    • 一种像素传感器单元,具有具有表面的半导体衬底; 形成在具有与包括基板表面的物理边界完全隔离的非横向布置的电荷收集区域的基板中的感光元件。 感光元件包括具有形成在第一导电类型材料的衬底中的侧壁的沟槽; 与所述侧壁中的至少一个相邻形成的第二导电类型材料的第一掺杂层; 以及形成在所述第一掺杂层和所述至少一个沟槽侧壁之间并形成在所述衬底的表面处的所述第一导电类型材料的第二掺杂层,所述第二掺杂层将所述第一掺杂层与所述至少一个沟槽侧壁隔离, 基材表面。 在另一个实施例中,提供附加的光敏元件,其包括横向设置的电荷收集区域,其接触感光元件的非横向设置的电荷收集区域,并且位于在衬底表面形成的掺杂层的下方。
    • 89. 发明授权
    • CMOS imager photodiode with enhanced capacitance
    • 具有增强电容的CMOS成像光电二极管
    • US07659564B2
    • 2010-02-09
    • US11276085
    • 2006-02-14
    • James W. AdkissonJohn J. Ellis-MonaghanMark D. JaffeDale J. PearsonDennis L. Rogers
    • James W. AdkissonJohn J. Ellis-MonaghanMark D. JaffeDale J. PearsonDennis L. Rogers
    • H01L31/04
    • H01L27/14643H01L27/1463H01L27/14689H01L31/035281
    • A pixel sensor cell having a semiconductor substrate having a surface; a photosensitive element formed in a substrate having a non-laterally disposed charge collection region entirely isolated from a physical boundary including the substrate surface. The photosensitive element comprises a trench having sidewalls formed in the substrate of a first conductivity type material; a first doped layer of a second conductivity type material formed adjacent to at least one of the sidewalls; and a second doped layer of the first conductivity type material formed between the first doped layer and the at least one trench sidewall and formed at a surface of the substrate, the second doped layer isolating the first doped layer from the at least one trench sidewall and the substrate surface. In a further embodiment, an additional photosensitive element is provided that includes a laterally disposed charge collection region that contacts the non-laterally disposed charge collection region of the photosensitive element and underlies the doped layer formed at the substrate surface.
    • 一种像素传感器单元,具有具有表面的半导体衬底; 形成在具有与包括基板表面的物理边界完全隔离的非横向布置的电荷收集区域的基板中的感光元件。 感光元件包括具有形成在第一导电类型材料的衬底中的侧壁的沟槽; 与所述侧壁中的至少一个相邻形成的第二导电类型材料的第一掺杂层; 以及形成在所述第一掺杂层和所述至少一个沟槽侧壁之间并形成在所述衬底的表面处的所述第一导电类型材料的第二掺杂层,所述第二掺杂层将所述第一掺杂层与所述至少一个沟槽侧壁隔离, 基材表面。 在另一个实施例中,提供附加的光敏元件,其包括横向设置的电荷收集区域,其接触感光元件的非横向设置的电荷收集区域,并且位于在衬底表面形成的掺杂层的下方。