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    • 89. 发明申请
    • TUNNELING TRANSISTORS INCLUDING SOURCE/DRAIN REGIONS EMPLOYING DIFFERENT SEMICONDUCTOR MATERIAL
    • 包括使用不同半导体材料的源/漏区的隧道晶体管
    • WO2018063310A1
    • 2018-04-05
    • PCT/US2016/054724
    • 2016-09-30
    • INTEL CORPORATION
    • GLASS, Glenn A.MURTHY, Anand S.YOUNG, Ian A.AVCI, Uygar E.
    • H01L29/78H01L29/73H01L29/66H01L21/8238H01L29/423
    • H01L29/7391H01L21/823418H01L21/823481H01L29/0834H01L29/165H01L29/205H01L29/423H01L29/66356H01L29/775H01L29/785
    • Techniques are disclosed for forming tunneling transistors including source and drain (S/D) regions employing different material. Using material bandgap engineering, the techniques enhance the ability of transistor devices that employ quantum tunneling, such as tunnel field-effect transistors (TFETs) and Fermi filter FETs (FFFETs), to resist off-state leakage currents from source to drain (through the channel) and from source to ground/substrate. The material bandgap engineering can incorporate a material-based band offset component to control off-state leakage. Such a band offset can expand upon the limited energy band offset achievable using conventional material configurations (e.g., single composition material configurations), because with such conventional material configurations, above a threshold doping concentration, there is no additional decrease in leakage current for a given source to drain voltage at fixed dimensions. For example, increasing the band offset can increase the barrier that carriers must overcome to reach the channel region, thereby reducing off-state leakage.
    • 公开了用于形成包括采用不同材料的源极和漏极(S / D)区域的隧穿晶体管的技术。 利用材料带隙工程技术,这些技术增强了采用量子隧穿技术的晶体管器件(如隧道场效应晶体管(TFET)和费米滤波器FET(FFFET))的能力,可以抵抗从源极到漏极的截止状态泄漏电流(通过 通道)以及从源到地/衬底。 材料带隙工程可以结合基于材料的带偏移分量来控制关态漏电。 这种频带偏移可以在利用常规材料配置(例如,单一组合材料配置)可实现的有限能带偏移时扩大,因为对于给定的给定阈值掺杂浓度以上的这种常规材料配置,不存在额外的漏电流降低 源以固定尺寸的漏极电压。 例如,增加频带偏移可以增加载波必须克服才能到达信道区域的屏障,从而减少关闭状态泄漏。