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81. 发明授权

US07198548B1 Polishing apparatus and method with direct load platen 失效
标题翻译：抛光装置和方法与直接负载压板
公开(公告)号：US07198548B1
公开(公告)日：2007-04-03
申请号：US11241254
申请日：2005-09-30
申请人： Hung Chih Chen
发明人： Hung Chih Chen
IPC分类号： B24B49/00
CPC分类号： B24B41/005 , B24B37/345
摘要： A method and apparatus for chemical mechanical polishing includes a platen supports a polishing article, a robot located proximate the platen, a carrier head having a retaining ring, and a carrier heads support mechanism. The robot is configured to position a substrate on the polishing article, and the carrier heads support mechanism is configured to move the carrier head into a position that the retaining ring surrounds the substrate.
摘要翻译：用于化学机械抛光的方法和装置包括压板支撑抛光制品，位于压板附近的机器人，具有保持环的承载头和承载头支撑机构。机器人构造成将基板定位在抛光制品上，并且载体头支撑机构构造成将承载头移动到保持环围绕基板的位置。

82. 发明申请

US20160016284A1 POLISHING SYSTEM WITH PAD CARRIER AND CONDITIONING STATION 有权
标题翻译：带有承载架和调速台的抛光系统
公开(公告)号：US20160016284A1
公开(公告)日：2016-01-21
申请号：US14800115
申请日：2015-07-15
申请人： Jay Gurusamy , Hung Chih Chen
发明人： Jay Gurusamy , Hung Chih Chen
IPC分类号： B24B53/017 , B24B37/34
CPC分类号： B24B53/017 , B24B27/0023 , B24B27/0076 , B24B37/013 , B24B37/105 , B24B37/16 , B24B37/205 , B24B37/34 , B24B49/12 , B24B53/005
摘要： A polishing system includes a support to hold a substrate having a substrate surface to be polished, a conditioning system for conditioning a polishing pad, the conditioning system comprising one or more conditioning heads, a movable support structure, and a carrier to hold a polishing pad. The carrier is suspended from the movable support structure, and the support structure is configured to move the carrier between the support to hold the substrate and the conditioning system.
摘要翻译：抛光系统包括：支撑体，用于保持具有待抛光的基底表面的基底，用于调节抛光垫的调节系统，所述调节系统包括一个或多个调节头，可移动支撑结构和载体以保持抛光垫。载体从可移动支撑结构悬挂，并且支撑结构构造成使载体在载体之间移动以保持基板和调节系统。

83. 发明申请

US20130196577A1 METHODS AND APPARATUS FOR AN IMPROVED POLISHING HEAD RETAINING RING 有权
标题翻译：改进抛光头保持环的方法和装置
公开(公告)号：US20130196577A1
公开(公告)日：2013-08-01
申请号：US13360221
申请日：2012-01-27
申请人： Hung Chih Chen , Jay Gurusamy , Gautam S. Dandavate , Samuel Chu-Chiang Hsu
发明人： Hung Chih Chen , Jay Gurusamy , Gautam S. Dandavate , Samuel Chu-Chiang Hsu
IPC分类号： B24B5/00
CPC分类号： B24B37/32 , B24B37/34
摘要： Methods, apparatus, and systems are provided for retaining a substrate in a polishing head of a CMP system. The invention includes a flexible inner retaining ring adapted to contour to an edge of a substrate and an inner ring support coupled to the polishing head. The inner support ring is adapted to contact the flexible inner retaining ring in response to a side force load applied to the flexible inner retaining ring by a substrate being polished. Numerous additional aspects are disclosed.
摘要翻译：提供了用于将基板保持在CMP系统的抛光头中的方法，装置和系统。本发明包括适于轮廓到基底的边缘的柔性内保持环和联接到抛光头的内环支撑。内支撑环适于通过被抛光的衬底施加到柔性内保持环的侧向力负载而接触柔性内保持环。公开了许多附加方面。

84. 发明申请

US20120034849A1 CARRIER HEAD WITH NARROW INNER RING AND WIDE OUTER RING 有权
标题翻译：带有内圈和宽外圈的承载头
公开(公告)号：US20120034849A1
公开(公告)日：2012-02-09
申请号：US13204571
申请日：2011-08-05
申请人： Hung Chih Chen , Samuel Chu-Chiang Hsu , Yin Yuan , Huanbo Zhang , Gautam Shashank Dandavate
发明人： Hung Chih Chen , Samuel Chu-Chiang Hsu , Yin Yuan , Huanbo Zhang , Gautam Shashank Dandavate
IPC分类号： B24B41/06 , B24B1/00
CPC分类号： B24B41/06 , B24B37/32 , B24B41/067
摘要： A carrier head for a chemical mechanical polisher includes base, a substrate mounting surface, an annular inner ring, and an annular outer ring. The inner ring has an inner surface configured to circumferentially surround the edge of a substrate positioned on the substrate mounting surface, an outer surface, and a lower surface to contact a polishing pad. The inner ring is vertically movable relative to the substrate mounting surface. The outer ring has an inner surface circumferentially surrounding the inner ring, an outer surface, and a lower surface to contact the polishing pad. The outer ring is vertically movable relative to and independently of the substrate mounting surface and the inner ring. The lower surface of the inner ring has a first width, and the lower surface of the outer ring has a second width greater than the first width.
摘要翻译：用于化学机械抛光机的载体头包括基底，基底安装表面，环形内环和环形外环。内环具有被构造为周向地围绕位于基板安装表面上的基板的边缘的内表面，外表面和与抛光垫接触的下表面。内环可相对于基板安装表面垂直移动。外环具有围绕内环的内表面，外表面和与抛光垫接触的下表面。外环可相对于基板安装表面和内圈而相对并且独立于其上下移动。内圈的下表面具有第一宽度，并且外环的下表面具有大于第一宽度的第二宽度。

85. 发明授权

US08096852B2 In-situ performance prediction of pad conditioning disk by closed loop torque monitoring 有权
标题翻译：通过闭环力矩监测对垫片调节盘的现场性能预测
公开(公告)号：US08096852B2
公开(公告)日：2012-01-17
申请号：US12187637
申请日：2008-08-07
申请人： Sameer Deshpande , Shou-Sung Chang , Hung Chih Chen , Roy C Nangoy , Stan D Tsai
发明人： Sameer Deshpande , Shou-Sung Chang , Hung Chih Chen , Roy C Nangoy , Stan D Tsai
IPC分类号： B24B49/18
CPC分类号： B24B49/18 , B24B37/005 , B24B49/16 , B24B53/017
摘要： Polishing pads used in CMP machines are consumable components that are typically replaced after a specific number of wafers have been processed. The life of a polishing pad is optimized by controlling the rate of material removal from the polishing pad by the conditioning disk. The conditioning disk removes enough material so the polishing surface can properly process the wafers but does not remove any excess material. Preventing excess material removal extends the life of the polishing pad. During CMP processing, the controller receives data concerning the torque applied to the conditioning disk and the torque applied to the arm to sweep the conditioning disk across the polishing pad. Based upon the detected operating conditions, the system can predict the rate of material removal and adjust the forces applied to the conditioning disk so that the life of the polishing pad is optimized.
摘要翻译：在CMP机器中使用的抛光垫是可消耗的部件，通常在处理特定数量的晶片之后被替换。抛光垫的寿命通过控制由调节盘从抛光垫去除的材料的速率被优化。调节盘移除足够的材料，因此抛光表面可以适当地处理晶片，但不会去除任何多余的材料。防止多余的材料去除延长了抛光垫的寿命。在CMP处理期间，控制器接收关于施加到调节盘的扭矩和施加到臂上的扭矩以扫掠经过抛光垫的调节盘的数据。基于检测到的操作条件，系统可以预测材料去除速率并调节施加到调节盘的力，以便抛光垫的寿命被优化。

86. 发明申请

US20110244763A1 SIDE PAD DESIGN FOR EDGE PEDESTAL 有权
标题翻译：侧面设计用于边缘馅饼
公开(公告)号：US20110244763A1
公开(公告)日：2011-10-06
申请号：US12751743
申请日：2010-03-31
申请人： Yin Yuan , Hung Chih Chen , Shou-Sung Chang
发明人： Yin Yuan , Hung Chih Chen , Shou-Sung Chang
IPC分类号： B24B1/04 , B24B55/00
CPC分类号： B24B53/017 , B24B37/005 , B24B37/10
摘要： A method and apparatus for facilitating equalized conditioning of a polishing surface of a polishing pad is described. The apparatus includes an extension device coupled to a base adjacent a peripheral edge of a polishing pad that is adapted to support a conditioning device, the extension device includes a body that is movable relative to the polishing pad, and a sacrificial pad comprising a polishing material coupled to a mounting surface of the body.
摘要翻译：描述了一种用于促进抛光垫的抛光表面的均匀调节的方法和装置。该装置包括连接到邻近抛光垫的外围边缘的基座的延伸装置，其适于支撑调节装置，该延伸装置包括可相对于抛光垫移动的主体，以及包括抛光材料的牺牲垫联接到主体的安装表面。

87. 发明授权

US07815787B2 Electrolyte retaining on a rotating platen by directional air flow 有权
标题翻译：电解液通过定向气流保持在转盘上
公开(公告)号：US07815787B2
公开(公告)日：2010-10-19
申请号：US12246834
申请日：2008-10-07
申请人： Hung Chih Chen , Rashid A. Mavliev
发明人： Hung Chih Chen , Rashid A. Mavliev
IPC分类号： B24B1/00 , B23H5/08
CPC分类号： B23H5/08 , B24B37/04 , B24B57/02
摘要： A method and apparatus for retaining electrolyte on a rotating platen using directional air flow is provided. In one embodiment, an apparatus for processing a substrate is provided. The apparatus includes a platen assembly having a surface for supporting a processing pad and disposed on a stationary base so that the platen assembly may rotate relative to the base; and an air knife coupled to the base and extended over a portion of the surface, the air knife operable to deliver a stream of air toward the pad to divert at least a portion of a fluid disposed on the pad toward a center of the pad.
摘要翻译：提供了一种使用定向气流将电解质保持在旋转台板上的方法和装置。在一个实施例中，提供了一种用于处理衬底的设备。该装置包括压板组件，该压板组件具有用于支撑处理衬垫并设置在固定底座上的表面，使得压板组件可相对于底座旋转; 以及气刀，其联接到所述基座并且延伸到所述表面的一部分上，所述气刀可操作以将空气流输送到所述垫，以将设置在所述垫上的流体的至少一部分转向所述垫的中心。

88. 发明授权

US07749052B2 Carrier head using flexure restraints for retaining ring alignment 失效
标题翻译：承载头使用弯曲约束保持环对准
公开(公告)号：US07749052B2
公开(公告)日：2010-07-06
申请号：US12206338
申请日：2008-09-08
申请人： Jin Yi , Jeonghoon Oh , Hung Chih Chen , Samuel Chu-Chiang
发明人： Jin Yi , Jeonghoon Oh , Hung Chih Chen , Samuel Chu-Chiang
IPC分类号： B24B7/22
CPC分类号： B24B37/32
摘要： One embodiment provides a retaining ring assembly. The retaining ring assembly comprises a retaining ring configured to circumferentially surround and retain the substrate within an inner surface of the retaining ring, and a flexure coupled to the retaining ring. The flexure is configured to maintain a gap between an inner surface of a carrier ring and an outer surface of the retaining ring, and the carrier ring is circumferentially surrounding the retaining ring.
摘要翻译：一个实施例提供一种保持环组件。保持环组件包括保持环，所述保持环被构造成周向地围绕并保持在保持环的内表面内的基板，以及耦合到保持环的挠曲件。挠曲构造成在承载环的内表面和保持环的外表面之间保持间隙，并且承载环周向围绕保持环。

89. 发明申请

US20100105302A1 POLISHING PAD CONDITIONER 有权
标题翻译：抛光垫调节器
公开(公告)号：US20100105302A1
公开(公告)日：2010-04-29
申请号：US12256845
申请日：2008-10-23
申请人： Hung Chih Chen , Sen-Hou Ko , Shou-Sung Chang
发明人： Hung Chih Chen , Sen-Hou Ko , Shou-Sung Chang
IPC分类号： B24D11/00
CPC分类号： B24B53/017
摘要： Embodiments of the present invention generally provide an improved conditioning module and conditioning disks for improved pressure distribution during the process of conditioning a polishing pad of a chemical mechanical polishing (CMP) system. In one embodiment, a conditioning module comprising multiple, small conditioning disks is provided. In one embodiment, a conditioning disk having a compliant backing member is provided. In one embodiment, the compliant backing member comprises a semi-rigid backing member cut into a spiral shape to provide compliancy. In another embodiment, the compliant backing member comprises a fluid-pressurized, flexible membrane. Each embodiment of the present invention provides an improved pressure distribution across the face of each conditioning disk, resulting in increased disk life as well as increased conditioning rate and uniformity.
摘要翻译：本发明的实施例通常提供改进的调节模块和调节盘，用于在调节化学机械抛光（CMP）系统的抛光垫的过程中改善压力分布。在一个实施例中，提供了包括多个小调节盘的调节模块。在一个实施例中，提供了具有柔顺背衬构件的调节盘。在一个实施例中，柔顺背衬构件包括切割成螺旋形状以提供符合性的半刚性背衬构件。在另一个实施例中，顺从背衬构件包括流体加压的柔性膜。本发明的每个实施例提供了在每个调节盘的表面上的改进的压力分布，导致增加的盘寿命以及增加的调节速率和均匀性。

90. 发明申请

US20090264056A1 SUBSTRATE HOLDER WITH LIQUID SUPPORTING SURFACE 失效
标题翻译：带液体支撑表面的基座
公开(公告)号：US20090264056A1
公开(公告)日：2009-10-22
申请号：US12105798
申请日：2008-04-18
申请人： Hung Chih Chen , Yin Yuan , Stephen Jew
发明人： Hung Chih Chen , Yin Yuan , Stephen Jew
IPC分类号： B24B41/06
CPC分类号： B24B37/30
摘要： Embodiments of the present invention generally relate to a substrate transferring system. One embodiment of the present invention provides a substrate holder comprising a pedestal plate, a basin wall extending from a top surface of the pedestal plate, wherein the basin wall has a substantially leveled top surface, the basin wall and the pedestal plate define a basin configured to retain a liquid therein, and a liquid port opening to the basin, wherein the liquid port is configured to flow a liquid to the basin and allow the liquid to overflow from the basin wall, and a top surface of the overflow liquid in the basin is configured to support a substrate without contacting the basin wall or the pedestal plate.
摘要翻译：本发明的实施例一般涉及基板传送系统。本发明的一个实施例提供了一种衬底保持器，其包括基座板，从基座板的顶表面延伸的盆壁，其中，所述盆壁具有基本上平整的顶表面，所述盆壁和所述基座板限定了配置在其中保持液体，以及通向所述盆的液体口，其中所述液体端口被配置为使液体流到所述盆中并允许所述液体从所述盆壁溢出，并且所述盆中的所述溢流液体的顶表面构造成支撑基板而不接触盆壁或基座板。

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