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    • 89. 发明授权
    • Chemical amplification type positive resist composition
    • 化学放大型正光刻胶组合物
    • US06627381B1
    • 2003-09-30
    • US09890803
    • 2001-10-25
    • Yasunori UetaniAkira Kamabuchi
    • Yasunori UetaniAkira Kamabuchi
    • G03F7004
    • G03F7/0045G03F7/039G03F7/0397
    • A chemical amplification type positive resist composition comprising: a resin which has a hydroxystyrene-based polymerization unit, a 3-hydroxy-1-adamantyl methacrylate-based polymerization unit and a polymerization unit having a group unstable toward an acid, and, though insoluble or hardly soluble in an alkali in itself, becomes alkali-soluble after the acid-unstable group has been cleaved by the action of an acid; and an acid generating agent is provided. This resist composition is improved in exposure latitude and resolution. Moreover, such properties as sensitivity, heat resistance, the ratio of residual thickness, coatability, and dry etching resistance are also maintained good. Thus, through the use of this composition, a fine resist pattern can be formed with high precision.
    • 一种化学放大型正型抗蚀剂组合物,包括:具有羟基苯乙烯类聚合单元,甲基丙烯酸3-羟基-1-金刚烷基酯聚合单元和具有对酸不稳定的基团的聚合单元的树脂,以及尽管不溶或不溶 本身难溶于碱,在酸不稳定基团通过酸的作用被切割后,变成碱溶性的; 并提供酸生成剂。 该抗蚀剂组合物在曝光宽容度和分辨率方面得到改善。 此外,还保持了诸如灵敏度,耐热性,残留厚度比,涂布性和耐干蚀刻性等特性。 因此,通过使用该组合物,可以高精度地形成精细的抗蚀剂图案。